公开(公告)号：US6132852A

公开(公告)日：2000-10-17

申请号：US267166

申请日：1999-03-12

申请人： Masahiro Suzuki ,  Akio Takahashi ,  Minoru Tanaka ,  Haruhiko Matsuyama ,  Haruo Akahoshi

发明人： Masahiro Suzuki ,  Akio Takahashi ,  Minoru Tanaka ,  Haruhiko Matsuyama ,  Haruo Akahoshi

IPC分类号： C08G73/06 ,  H05K3/46 ,  B32B15/00 ,  B05D3/02 ,  B32B27/00 ,  H01B7/00

CPC分类号： H05K3/4626 ,  C08G73/0627 ,  Y10T428/12493 ,  Y10T428/24917 ,  Y10T428/31681 ,  Y10T428/31721

摘要： A multilayer wiring substrate using a resin composition comprising polyquinoline compound and bismaleimide compound as essential ingredients between wiring-carrying resin layers as insulating layers forms no void at the time of lamination, has an excellent adhesive property at various interfaces, has a heat stability after lamination and is high in reliability, so that, it is applicable to many fields not only including the multilayer wiring substrates capable of mounting LSI or tip carrier directly but also including multilayer wiring substrate for work station, mounting substrates for small-sized electronic devices such as camera and video for people's use, and high frequency multitip module multilayer substrate.

摘要翻译： 使用包含聚喹啉化合物和双马来酰亚胺化合物的树脂组合物作为绝缘层的布线承载树脂层之间的必要成分的多层布线基板在层压时不会形成空隙，在各界面具有优异的粘合性，层压后具有热稳定性 并且可靠性高，因此可以应用于不仅包括能够直接安装LSI或尖端载体的多层布线基板的许多领域，而且包括用于工作站的多层布线基板，用于小型电子设备的安装基板 相机和视频供人们使用，以及高频多点模块多层基板。

公开(公告)号：US5958600A

公开(公告)日：1999-09-28

申请号：US981835

申请日：1998-01-09

申请人： Hideo Sotokawa ,  Akira Yabushita ,  Takashi Inoue ,  Hidetaka Shigi ,  Mamoru Ogihara ,  Haruhiko Matsuyama ,  Minoru Tanaka ,  Yasunori Narizuka

发明人： Hideo Sotokawa ,  Akira Yabushita ,  Takashi Inoue ,  Hidetaka Shigi ,  Mamoru Ogihara ,  Haruhiko Matsuyama ,  Minoru Tanaka ,  Yasunori Narizuka

IPC分类号： H01L23/498 ,  H01L23/538 ,  B32B15/08 ,  G03C3/00 ,  H05K1/09

CPC分类号： H01L23/5384 ,  H01L23/49866 ,  H01L23/49894 ,  H01L23/5385 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/15312 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31681 ,  Y10T428/31721

摘要： Disclosed are a highly reliable circuit board and a method of stably manufacturing the circuit board, wherein an insulator made from a specific organic insulating material is provided under a highly stressed conductor for preventing occurrence of cracks in the insulator. In addition, a method of correcting a wiring of a ceramic board is additionally adopted. The circuit board includes a thick film wiring board 1 having a first conductor pattern 2 and a thin film layer laminated on the first conductor pattern 2. The thin film layer includes a first insulator 5 on the first conductor pattern 2; a second insulator 10 on the first insulator 5; a second conductor pattern 8 formed on the first insulator 5 in such a manner as to partially pass through the first insulator 5 and to be electrically connected to the first conductor pattern 2; a wiring pattern 9 for circuit correction formed on the first insulator 5; and a third conductor pattern 11 passing through the first insulator 5 and the second insulator 10 and electrically connected to the second conductor pattern 8.

摘要翻译： PCT No.PCT / JP96 / 01909 Sec。 371日期1998年1月9日 102（e）1998年1月9日PCT PCT 1996年7月10日PCT公布。 出版物WO97 / 03542 日期1997年1月30日公开是一种高度可靠的电路板和稳定制造电路板的方法，其中由特定有机绝缘材料制成的绝缘体设置在高应力导体下面，以防止在绝缘体中发生裂纹。 此外，另外采用校正陶瓷板的布线的方法。 电路板包括具有层叠在第一导体图案2上的第一导体图案2和薄膜层的厚膜布线板1.薄膜层包括在第一导体图案2上的第一绝缘体5; 第一绝缘体5上的第二绝缘体10; 形成在第一绝缘体5上的部分地通过第一绝缘体5并与第一导体图案2电连接的第二导体图案8; 在第一绝缘体5上形成用于电路校正的布线图案9; 以及穿过第一绝缘体5和第二绝缘体10并电连接到第二导体图案8的第三导体图案11。

公开(公告)号：US5868949A

公开(公告)日：1999-02-09

申请号：US557320

申请日：1995-11-14

申请人： Hideo Sotokawa ,  Masashi Nishiki ,  Eiji Matsuzaki ,  Hidetaka Shigi ,  Toshio Terouchi ,  Mamoru Ogihara ,  Haruhiko Matsuyama ,  Minoru Tanaka

发明人： Hideo Sotokawa ,  Masashi Nishiki ,  Eiji Matsuzaki ,  Hidetaka Shigi ,  Toshio Terouchi ,  Mamoru Ogihara ,  Haruhiko Matsuyama ,  Minoru Tanaka

IPC分类号： C08G73/10 ,  H01L23/498 ,  H05K1/03 ,  H05K1/11 ,  H05K3/46 ,  B44C1/22

CPC分类号： H05K1/112 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/0154 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/10674 ,  H05K3/4605 ,  Y10T428/24917

摘要： A metalization structure having a first conductor layer on the surface of an underlying layer and, further, a second conductor layer connected conductively with the first conductor layer in which a polyimide insulative film of low thermal expansion coefficient is present between at least an end of a pattern of the second conductor layer and the first conductor layer, for stably obtaining a metalization structure of high reliability and free from the worry of peeling of the conductor portion from a substrate or occurrence of cracking to the underlying layer.

摘要翻译： 一种金属化结构，其具有在下层的表面上的第一导体层，并且还具有与第一导体层导电连接的第二导体层，其中热膨胀系数低的聚酰亚胺绝缘膜存在于第一导体层的至少一端 第二导体层和第一导体层的图案，用于稳定地获得高可靠性的金属化结构，并且不会导致导体部分从基板剥离或者发生开裂到下层。

公开(公告)号：US5208656A

公开(公告)日：1993-05-04

申请号：US674605

申请日：1991-03-25

申请人： Haruhiko Matsuyama ,  Mitsuo Yoshimoto ,  Jun Tanaka ,  Fusaji Shoji ,  Hitoshi Yokono ,  Takashi Inoue ,  Tetsuya Yamazaki ,  Minoru Tanaka ,  Hidetaka Shigi

发明人： Haruhiko Matsuyama ,  Mitsuo Yoshimoto ,  Jun Tanaka ,  Fusaji Shoji ,  Hitoshi Yokono ,  Takashi Inoue ,  Tetsuya Yamazaki ,  Minoru Tanaka ,  Hidetaka Shigi

IPC分类号： H05K3/46 ,  H01L21/60 ,  H01L23/498

CPC分类号： H01L23/49827 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701

摘要： A multilayer wiring substrate having high reliability can be produced in good productivity by subjecting metal wiring layers to stabilization treatment on the surface with a metal such as Cr, Mo or the like or an aqueous solution of water glass so as to prevent generation of hillocks or whiskers and to improve chemical resistance.

摘要翻译： 通过使金属布线层通过金属如Cr，Mo等在表面上进行稳定化处理或水玻璃水溶液，可以以良好的生产率制造具有高可靠性的多层布线基板，以防止产生小丘或 晶须并改善耐化学性。

公开(公告)号：US6124553A

公开(公告)日：2000-09-26

申请号：US262270

申请日：1994-06-20

申请人： Yasunori Narizuka ,  Naoki Matsushima ,  Hidetaka Shigi ,  Haruhiko Matsuyama

发明人： Yasunori Narizuka ,  Naoki Matsushima ,  Hidetaka Shigi ,  Haruhiko Matsuyama

IPC分类号： H05K3/46 ,  H01L23/02 ,  H01L23/12 ,  H01L23/498 ,  H05K1/16

CPC分类号： H01L23/49838 ,  H01L23/49822 ,  H01L23/49833 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/16152 ,  H01L2924/3025

摘要： A multilayer wiring system for preventing the generation of fixing failure due to an organic residue, eliminating an increase in the number of processes and reducing an area necessary for bonding of the cap and its fabrication method. The multilayer wiring board includes at least one wiring layer made of a conductor, at least one insulating layer made of an organic matter and a board. The wiring layer and the insulating layer are alternately laminated on the board and a cap is provided for covering the insulating layer and the wiring layer. The wiring layer has a wiring pattern for forming a wiring and a frame pattern for surrounding the wiring pattern. This frame pattern includes vent holes. The insulating layer has a shield structure made of an inorganic matter around the outer peripheral portion thereof and/or in the interior thereof. The shield structure is formed of the frame patterns continuously connected to each other and the cap is joined to an uppermost layer of the shield structure.

摘要翻译： 一种用于防止由于有机残渣产生固定故障的多层布线系统，消除了工艺数量的增加并减少了盖子接合所需的面积及其制造方法。 多层布线基板包括至少一层由导体制成的布线层，至少一层由有机物制成的绝缘层和基板。 布线层和绝缘层交替地层叠在基板上，并且设置盖以覆盖绝缘层和布线层。 布线层具有用于形成布线的布线图形和用于围绕布线图案的框图案。 该框架图案包括通气孔。 绝缘层具有由外周部分和/或其内部的无机物构成的屏蔽结构。 屏蔽结构由彼此连续连接的框架图案形成，并且盖与屏蔽结构的最上层接合。

公开(公告)号：US5851681A

公开(公告)日：1998-12-22

申请号：US212766

申请日：1994-03-15

申请人： Haruhiko Matsuyama ,  Eiji Matsuzaki ,  Shozi Ikeda ,  Fumio Kataoka ,  Fusaji Shoji

发明人： Haruhiko Matsuyama ,  Eiji Matsuzaki ,  Shozi Ikeda ,  Fumio Kataoka ,  Fusaji Shoji

IPC分类号： C08G73/10 ,  G11B5/17 ,  G11B5/31 ,  H01L23/498 ,  H05K1/00 ,  G11B5/40 ,  C08G69/26

CPC分类号： H01L23/49894 ,  C08G73/10 ,  G11B5/313 ,  H05K3/4676 ,  G11B5/17 ,  G11B5/3109 ,  H01L2924/0002 ,  H05K2201/0154 ,  Y10T428/1193 ,  Y10T428/24917 ,  Y10T428/31681 ,  Y10T428/31721

摘要： This invention relates to a wiring structure having metal wiring layers and polyimide layers. An object of this invention is to overcome problems caused by oxidation of a metal surface, such as an increase in the resistance of wiring and a reduction in insulation, by preventing a reaction between a metal of the wiring layers, such as copper, and carboxyl groups of polyamic acid which make up the polyimide layers. In the wiring structure according to the present invention, the polyimide layers have been formed by heating and curing a resin composition which comprises a polyimide precursor, an amine compound and an organic solvent.

摘要翻译： 本发明涉及具有金属布线层和聚酰亚胺层的布线结构。 本发明的目的是通过防止诸如铜的布线层的金属和羧基之间的反应来克服金属表面的氧化引起的问题，例如布线电阻的增加和绝缘的减少 组成聚酰亚胺层的聚酰胺酸组。 在根据本发明的布线结构中，通过加热和固化包含聚酰亚胺前体，胺化合物和有机溶剂的树脂组合物，形成聚酰亚胺层。

公开(公告)号：US5280102A

公开(公告)日：1994-01-18

申请号：US500503

申请日：1990-03-28

申请人： Haruhiko Matsuyama ,  Fusaji Shoji ,  Atsushi Honda ,  Teruki Aizawa

发明人： Haruhiko Matsuyama ,  Fusaji Shoji ,  Atsushi Honda ,  Teruki Aizawa

IPC分类号： C09J179/08 ,  H01B3/30 ,  C08G73/10 ,  C08G8/02 ,  C08G69/26

CPC分类号： H01B3/306 ,  C09J179/08 ,  Y10T428/31721

摘要： Heat-resistant bonding materials are composed of a polyimide precursor end-capped at molecule ends thereof and/or an imide compound formed from the polyimide precursor. They may also contain fine particles of at least one material selected from metals, metal oxides, metal carbides and metal nitrides.

摘要翻译： 耐热接合材料由在其分子末端封端的聚酰亚胺前体和/或由聚酰亚胺前体形成的酰亚胺化合物组成。 它们还可以含有选自金属，金属氧化物，金属碳化物和金属氮化物中的至少一种材料的细颗粒。

公开(公告)号：US5970310A

公开(公告)日：1999-10-19

申请号：US870404

申请日：1997-06-06

申请人： Shigemasa Satoh ,  Kenichi Sugeno ,  Haruhiko Matsuyama

发明人： Shigemasa Satoh ,  Kenichi Sugeno ,  Haruhiko Matsuyama

IPC分类号： G03F7/20 ,  G03F9/00 ,  H01L21/48 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H01L21/00

CPC分类号： G03F7/70425 ,  G03F9/00 ,  G03F9/70 ,  H01L21/4857 ,  H05K3/0008 ,  H05K1/0269 ,  H05K1/0306 ,  H05K2201/09918 ,  H05K3/0082 ,  H05K3/0097 ,  H05K3/4629

摘要： To form in a batch manner a thin-film wiring pattern in high precision over an entire region of a ceramics multilayer wiring board containing distortion and deformation, a correction amount of the ceramics multilayer wiring board (rotation angle and movement amount of position of this ceramics multilayer wiring board) is calculated in a computer by applying, for instance, the least squares method to positional coordinate values of each of the LSI mounting areas of the ceramics multilayer board and also to positional coordinate values corresponding thereto on a photomask. A support apparatus for supporting the multilayer wiring board is controlled based upon the calculated correction amount, so that the multilayer wiring board can be aligned with respect to the photomask.

摘要翻译： 为了在包含变形和变形的陶瓷多层布线板的整个区域上以高精度形成薄膜布线图案，陶瓷多层布线板的校正量（该陶瓷的位置的旋转角度和移动量 多层布线基板）在计算机中通过将例如最小二乘法应用于陶瓷多层板的每个LSI安装区域的位置坐标值以及与光掩模相对应的位置坐标值来计算。 基于所计算的校正量来控制用于支撑多层布线板的支撑装置，使得多层布线板可以相对于光掩模进行对准。

公开(公告)号：US5753372A

公开(公告)日：1998-05-19

申请号：US500157

申请日：1995-07-10

申请人： Hideo Sotokawa ,  Miharu Otani ,  Fumio Kataoka ,  Fusaji Shoji ,  Haruhiko Matsuyama ,  Eiji Matsuzaki ,  Shogi Ikeda ,  Hidetaka Shigi ,  Tetsuya Yamazaki ,  Naoki Matsushima ,  Shirou Akamatsu

发明人： Hideo Sotokawa ,  Miharu Otani ,  Fumio Kataoka ,  Fusaji Shoji ,  Haruhiko Matsuyama ,  Eiji Matsuzaki ,  Shogi Ikeda ,  Hidetaka Shigi ,  Tetsuya Yamazaki ,  Naoki Matsushima ,  Shirou Akamatsu

IPC分类号： H01L21/312 ,  H01L21/3205 ,  H01L21/768 ,  H01L23/532 ,  H05K1/00 ,  H05K1/03 ,  H05K3/46 ,  B32B9/04

CPC分类号： H01L21/76801 ,  H01L21/312 ,  H01L21/32056 ,  H01L21/76838 ,  H01L23/5329 ,  H01L2924/0002 ,  H05K1/0346 ,  H05K3/4647 ,  H05K3/4676 ,  Y10T428/24802 ,  Y10T428/31504 ,  Y10T428/31678 ,  Y10T428/31721

摘要： The present invention provides the wiring structure having a wiring layer and insulation layer and the method of manufacturing the same, wherein at least a part of the wiring of said wiring layer comprises copper, and said insulation layer comprises the polyimide obtained by heating the polyimide precursor composition containing the polyimide precursor having the repeating unit which can be represented by the following general formula (Chemical formula 15). ##STR1## (In this formula, R.sup.1 is at least one type of quadrivalent organic group selected from among the Chemical formulae 16, while R.sup.2 is a bivalent organic group containing aromatic ring).

摘要翻译： 本发明提供具有布线层和绝缘层的布线结构及其制造方法，其中所述布线层的布线的至少一部分包括铜，并且所述绝缘层包括通过加热聚酰亚胺前体获得的聚酰亚胺 含有具有可以由以下通式表示的重复单元的聚酰亚胺前体的组合物（化学式15）。 （化学式15）（化学式16） 选自化学式16中的四价有机基团的类型，而R2是含有芳香环的二价有机基团）。

公开(公告)号：US4643913A

公开(公告)日：1987-02-17

申请号：US687162

申请日：1984-12-28

申请人： Masaaki Okunaka ,  Mitsuo Nakatani ,  Haruhiko Matsuyama ,  Hitoshi Yokono ,  Tokio Isogai ,  Tadashi Saitoh ,  Kunihiro Matsukuma ,  Sumiyuki Midorikawa ,  Satoru Suzuki

发明人： Masaaki Okunaka ,  Mitsuo Nakatani ,  Haruhiko Matsuyama ,  Hitoshi Yokono ,  Tokio Isogai ,  Tadashi Saitoh ,  Kunihiro Matsukuma ,  Sumiyuki Midorikawa ,  Satoru Suzuki

IPC分类号： H01L31/04 ,  C07F7/00 ,  H01L21/283 ,  H01L21/288 ,  H01L31/0216 ,  H01L31/0224 ,  H01L31/18

CPC分类号： C07F7/006 ,  H01L31/02168 ,  H01L31/022425 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521

摘要： A process for producing solar cells which comprises applying a composition for anti-reflection coating formation on one side of a silicon base plate having a p-n junction therein, printing an Ag paste for contact formation on predetermined areas of the coat, and heat-treating the resulting plate at a temperature of 400.degree. to 900.degree. C. to complete anti-reflection coating and a light-receiving side contact, the process being characterized in that the composition for anti-reflection coating formation contains as essential component, (a) at least one member selected from the metal-organic ligand complex compounds represented by the general formula M(OR.sub.1).sub.n (L).sub.a-n wherein M is a metal selected from Zn, Al, Ga, In, Ti, Zr, Sn, V, Nb, Ta, Mo, and W; R.sub.1 is a C.sub.1 -C.sub.18 alkyl group; L is an organic ligand which forms an non-hydrolyzable bond with the metal ion; a is the valency of the metal M; and n is an integer satisfying 1.ltoreq.n

摘要翻译： 一种太阳能电池的制造方法，其特征在于，在具有pn结的硅基板的一面上涂布抗反射涂层用组合物，在所述涂层的规定区域印刷用于接触形成的Ag浆料，并对所述涂料进行热处理 得到的板在400-900℃的温度下完成防反射涂层和光接收侧接触，其特征在于用于防反射涂层形成的组合物包含作为必要组分的（a）在 选自由通式M（OR1）n（L）a表示的金属 - 有机配体络合物中的至少一种成分其中M是选自Zn，Al，Ga，In，Ti，Zr，Sn，V，Nb ，Ta，Mo和W; R1是C1-C18烷基; L是与金属离子形成不可水解键的有机配体; a为金属M的化合价; n为1，n为1的整数，通式（OR 1）n-1M（L）anOM（OR 1）n-1（L）a表示的水解缩合物，（b） 化合物，和（c）溶剂。