公开(公告)号：US5868949A

公开(公告)日：1999-02-09

申请号：US557320

申请日：1995-11-14

申请人： Hideo Sotokawa ,  Masashi Nishiki ,  Eiji Matsuzaki ,  Hidetaka Shigi ,  Toshio Terouchi ,  Mamoru Ogihara ,  Haruhiko Matsuyama ,  Minoru Tanaka

发明人： Hideo Sotokawa ,  Masashi Nishiki ,  Eiji Matsuzaki ,  Hidetaka Shigi ,  Toshio Terouchi ,  Mamoru Ogihara ,  Haruhiko Matsuyama ,  Minoru Tanaka

IPC分类号： C08G73/10 ,  H01L23/498 ,  H05K1/03 ,  H05K1/11 ,  H05K3/46 ,  B44C1/22

CPC分类号： H05K1/112 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/0154 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/10674 ,  H05K3/4605 ,  Y10T428/24917

摘要： A metalization structure having a first conductor layer on the surface of an underlying layer and, further, a second conductor layer connected conductively with the first conductor layer in which a polyimide insulative film of low thermal expansion coefficient is present between at least an end of a pattern of the second conductor layer and the first conductor layer, for stably obtaining a metalization structure of high reliability and free from the worry of peeling of the conductor portion from a substrate or occurrence of cracking to the underlying layer.

摘要翻译： 一种金属化结构，其具有在下层的表面上的第一导体层，并且还具有与第一导体层导电连接的第二导体层，其中热膨胀系数低的聚酰亚胺绝缘膜存在于第一导体层的至少一端 第二导体层和第一导体层的图案，用于稳定地获得高可靠性的金属化结构，并且不会导致导体部分从基板剥离或者发生开裂到下层。

公开(公告)号：US5753372A

公开(公告)日：1998-05-19

申请号：US500157

申请日：1995-07-10

申请人： Hideo Sotokawa ,  Miharu Otani ,  Fumio Kataoka ,  Fusaji Shoji ,  Haruhiko Matsuyama ,  Eiji Matsuzaki ,  Shogi Ikeda ,  Hidetaka Shigi ,  Tetsuya Yamazaki ,  Naoki Matsushima ,  Shirou Akamatsu

发明人： Hideo Sotokawa ,  Miharu Otani ,  Fumio Kataoka ,  Fusaji Shoji ,  Haruhiko Matsuyama ,  Eiji Matsuzaki ,  Shogi Ikeda ,  Hidetaka Shigi ,  Tetsuya Yamazaki ,  Naoki Matsushima ,  Shirou Akamatsu

IPC分类号： H01L21/312 ,  H01L21/3205 ,  H01L21/768 ,  H01L23/532 ,  H05K1/00 ,  H05K1/03 ,  H05K3/46 ,  B32B9/04

CPC分类号： H01L21/76801 ,  H01L21/312 ,  H01L21/32056 ,  H01L21/76838 ,  H01L23/5329 ,  H01L2924/0002 ,  H05K1/0346 ,  H05K3/4647 ,  H05K3/4676 ,  Y10T428/24802 ,  Y10T428/31504 ,  Y10T428/31678 ,  Y10T428/31721

摘要： The present invention provides the wiring structure having a wiring layer and insulation layer and the method of manufacturing the same, wherein at least a part of the wiring of said wiring layer comprises copper, and said insulation layer comprises the polyimide obtained by heating the polyimide precursor composition containing the polyimide precursor having the repeating unit which can be represented by the following general formula (Chemical formula 15). ##STR1## (In this formula, R.sup.1 is at least one type of quadrivalent organic group selected from among the Chemical formulae 16, while R.sup.2 is a bivalent organic group containing aromatic ring).

摘要翻译： 本发明提供具有布线层和绝缘层的布线结构及其制造方法，其中所述布线层的布线的至少一部分包括铜，并且所述绝缘层包括通过加热聚酰亚胺前体获得的聚酰亚胺 含有具有可以由以下通式表示的重复单元的聚酰亚胺前体的组合物（化学式15）。 （化学式15）（化学式16） 选自化学式16中的四价有机基团的类型，而R2是含有芳香环的二价有机基团）。

公开(公告)号：US5851681A

公开(公告)日：1998-12-22

申请号：US212766

申请日：1994-03-15

申请人： Haruhiko Matsuyama ,  Eiji Matsuzaki ,  Shozi Ikeda ,  Fumio Kataoka ,  Fusaji Shoji

发明人： Haruhiko Matsuyama ,  Eiji Matsuzaki ,  Shozi Ikeda ,  Fumio Kataoka ,  Fusaji Shoji

IPC分类号： C08G73/10 ,  G11B5/17 ,  G11B5/31 ,  H01L23/498 ,  H05K1/00 ,  G11B5/40 ,  C08G69/26

CPC分类号： H01L23/49894 ,  C08G73/10 ,  G11B5/313 ,  H05K3/4676 ,  G11B5/17 ,  G11B5/3109 ,  H01L2924/0002 ,  H05K2201/0154 ,  Y10T428/1193 ,  Y10T428/24917 ,  Y10T428/31681 ,  Y10T428/31721

摘要： This invention relates to a wiring structure having metal wiring layers and polyimide layers. An object of this invention is to overcome problems caused by oxidation of a metal surface, such as an increase in the resistance of wiring and a reduction in insulation, by preventing a reaction between a metal of the wiring layers, such as copper, and carboxyl groups of polyamic acid which make up the polyimide layers. In the wiring structure according to the present invention, the polyimide layers have been formed by heating and curing a resin composition which comprises a polyimide precursor, an amine compound and an organic solvent.

摘要翻译： 本发明涉及具有金属布线层和聚酰亚胺层的布线结构。 本发明的目的是通过防止诸如铜的布线层的金属和羧基之间的反应来克服金属表面的氧化引起的问题，例如布线电阻的增加和绝缘的减少 组成聚酰亚胺层的聚酰胺酸组。 在根据本发明的布线结构中，通过加热和固化包含聚酰亚胺前体，胺化合物和有机溶剂的树脂组合物，形成聚酰亚胺层。

公开(公告)号：US08063553B2

公开(公告)日：2011-11-22

申请号：US12041724

申请日：2008-03-04

申请人： Shingo Ishihara ,  Eiji Matsuzaki ,  Hiroshi Kageyama

发明人： Shingo Ishihara ,  Eiji Matsuzaki ,  Hiroshi Kageyama

IPC分类号： H01L51/50 ,  H01L51/52 ,  H01L51/56

CPC分类号： H01L51/5228

摘要： To reduce brightness variation by wiring resistance of an upper part transparent electrode in an organic luminescence element, a stripe-shape first auxiliary wiring 11 extending in a direction parallel to a signal line is formed on the upper part transparent electrode, by a precise mask vapor deposition method. Then, a stripe-shape second auxiliary wiring 12 extending in a direction parallel to a scanning line is formed by a precise mask vapor deposition method.

摘要翻译： 为了通过有机发光元件中的上部透明电极的布线电阻来降低亮度变化，通过精确的掩模蒸气在上部透明电极上形成沿与信号线平行的方向延伸的条状的第一辅助布线11 沉积法。 然后，通过精确的掩模气相沉积法形成沿平行于扫描线的方向延伸的条状的第二辅助布线12。

公开(公告)号：US07999469B2

公开(公告)日：2011-08-16

申请号：US12382224

申请日：2009-03-11

申请人： Satoru Kase ,  Yoshinori Ishii ,  Eiji Matsuzaki

发明人： Satoru Kase ,  Yoshinori Ishii ,  Eiji Matsuzaki

IPC分类号： H01L51/52 ,  H01L51/50

CPC分类号： H01L51/5246 ,  H01L27/3244 ,  H01L51/5237 ,  H01L51/5253 ,  H01L51/5259 ,  H01L51/56 ,  H01L2251/5315

摘要： A sealing substrate is arranged to oppositely face an element substrate on which organic EL layers are formed in a matrix array with a sealing material sandwiched therebetween. A gel-state desiccant is filled in an inner space surrounded by the element substrate, the sealing substrate and the sealing material. Since the gel-state desiccant is in a gel state, the gel-state desiccant is flexibly filled in the inner space of the organic EL display device thus completely eliminating a gap. Since the inner space is filled with the gel-state desiccant, moisture hardly intrudes into the inner space from the outside and, at the same time, a mechanical strength of the organic EL display device is also enhanced.

公开(公告)号：US06744135B2

公开(公告)日：2004-06-01

申请号：US10147073

申请日：2002-05-17

申请人： Takehiko Hasebe ,  Takehide Yokozuka ,  Nobuyuki Ushifusa ,  Masahide Harada ,  Eiji Matsuzaki ,  Hiroshi Hozoji

发明人： Takehiko Hasebe ,  Takehide Yokozuka ,  Nobuyuki Ushifusa ,  Masahide Harada ,  Eiji Matsuzaki ,  Hiroshi Hozoji

IPC分类号： H01L2334

CPC分类号： H01L24/16 ,  H01L23/142 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/29139 ,  H01L2224/2929 ,  H01L2224/32057 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/021 ,  H05K1/056 ,  H05K1/144 ,  H05K3/384 ,  H05K3/4608 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2201/10734 ,  H01L2924/05432 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.

摘要翻译： 本发明提供一种电子设备，其具有包括金属板的金属芯基板，形成在金属板上的绝缘层和形成在绝缘层上的导电层，以及电子部件，并且导电层和导体层的端子 电子部件连接。 在电子设备中，具有高导热性的部件被布置成与金属板和电子部件两者接触。 因此，电子设备的散热性提高。

公开(公告)号：US5821565A

公开(公告)日：1998-10-13

申请号：US573106

申请日：1995-12-15

申请人： Eiji Matsuzaki ,  Akihiro Kenmotsu ,  Yoshifumi Yoritomi ,  Toshiyuki Koshita ,  Takao Takano ,  Mitsuo Nakatani

发明人： Eiji Matsuzaki ,  Akihiro Kenmotsu ,  Yoshifumi Yoritomi ,  Toshiyuki Koshita ,  Takao Takano ,  Mitsuo Nakatani

IPC分类号： H01L29/417 ,  H01L29/786 ,  H01L29/41

CPC分类号： H01L29/78696 ,  H01L29/41733 ,  H01L29/78669 ,  H01L29/78687

摘要： A thin film transistor structure for use in driving liquid crystal display elements has a semiconductor active layer, a control electrode layer underlying the active layer with an insulating layer interposed therebetween and first and second main electrode layers formed on or above the active layer in a spaced relation with each other to define a channel in the active layer in cooperation with the control electrode layer between the main electrode layers. The active layer has a first peripheral edge portion generally perpendicular to the direction of the channel and a second peripheral edge portion generally not perpendicular to the direction of the channel. The first and/or second main electrode layer extends over the first and/or second peripheral edge portion of the active layer such that at least a part of the first peripheral edge portion and/or at least part of the second peripheral edge portion of the active layer has its side face directly covered with the main electrode layer.

公开(公告)号：US20090115325A1

公开(公告)日：2009-05-07

申请号：US12264942

申请日：2008-11-05

申请人： Eiji Matsuzaki ,  Yoshinori Ishii ,  Satoru Kase

发明人： Eiji Matsuzaki ,  Yoshinori Ishii ,  Satoru Kase

IPC分类号： H01J1/62 ,  H01J9/22

CPC分类号： H01L51/5256 ,  H01L51/524 ,  H01L2251/5315

摘要： An organic EL element section (1000) is formed on a circuit formation section (102) formed on a circuit board (101). The organic EL element section (1000) is covered with a protective layer (113) including an SiNxOy film. The SiNxOy film has infrared absorption characteristics including: an Si—O—Si stretching vibration absorption peak appearing at energy lower than 1,000 cm−1; an absorption intensity of an Si—N stretching vibration absorption peak appearing in the vicinity of around 870 cm−1 which is 0.75 or more times an absorption intensity of the Si—O—Si stretching vibration absorption peak; and an absorption peak intensity in a range of 2,000 to 4,000 cm−1, which is 5% or less of the absorption intensity of the Si—N stretching vibration absorption peak. Thus, the protective film having an excellent moisture-blocking property may be obtained, and life property of an organic EL display device may be improved.

摘要翻译： 有机EL元件部（1000）形成在电路基板（101）上形成的电路形成部（102）上。 有机EL元件部分（1000）被包括SiN x O y膜的保护层（113）覆盖。 SiN x O y膜具有红外吸收特性，包括：以低于1000cm -1的能量出现的Si-O-Si伸缩振动吸收峰; 在约870cm -1附近出现的Si-N伸缩振动吸收峰的吸收强度是Si-O-Si伸缩振动吸收峰的吸收强度的0.75倍以上; 以及在2,000〜4000cm -1的范围内的吸收峰强度，其为Si-N伸缩振动吸收峰的吸收强度的5％以下。 因此，可以获得具有优异的防湿性的保护膜，并且可以提高有机EL显示装置的寿命。

公开(公告)号：US20090096366A1

公开(公告)日：2009-04-16

申请号：US12285822

申请日：2008-10-15

申请人： Kazuhiko Kai ,  Eiji Matsuzaki ,  Masato Ito ,  Noriharu Matsudate ,  Ryoji Iwamura

发明人： Kazuhiko Kai ,  Eiji Matsuzaki ,  Masato Ito ,  Noriharu Matsudate ,  Ryoji Iwamura

IPC分类号： H01J1/62

CPC分类号： H05B33/04 ,  H01L51/524

摘要： An organic EL display device which can prolong a lifetime by suppressing a growth of black spots when the display device is operated for a long time can be realized. An element substrate on which organic EL layers are formed is hermetically adhered to a sealing substrate on which a desiccant is mounted by way of a sealing portion. The element substrate and the sealing substrate are curved outwardly. Particularly, by curving the element substrate outwardly, a growth of black points can be prevented when the organic EL display device is operated for a long time. Accordingly, a lifetime of the organic EL display device can be remarkably prolonged.

摘要翻译： 可以实现通过在显示装置长时间操作时抑制黑点的生长而延长使用寿命的有机EL显示装置。 其上形成有机EL层的元件基板通过密封部分气密地附着在其上安装有干燥剂的密封基板上。 元件基板和密封基板向外弯曲。 特别地，通过向外弯曲元件基板，当有机EL显示装置长时间操作时，可以防止黑点的生长。 因此，可以显着延长有机EL显示装置的寿命。

公开(公告)号：US20090008128A1

公开(公告)日：2009-01-08

申请号：US12184119

申请日：2008-07-31

申请人： Takehiko Hasebe ,  Takehide Yokozuka ,  Nobuyuki Ushifusa ,  Masahide Harada ,  Eiji Matsuzaki ,  Hiroshi Hozoji

发明人： Takehiko Hasebe ,  Takehide Yokozuka ,  Nobuyuki Ushifusa ,  Masahide Harada ,  Eiji Matsuzaki ,  Hiroshi Hozoji

IPC分类号： H05K1/00

CPC分类号： H01L24/16 ,  H01L23/142 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/29139 ,  H01L2224/2929 ,  H01L2224/32057 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/021 ,  H05K1/056 ,  H05K1/144 ,  H05K3/384 ,  H05K3/4608 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2201/10734 ,  H01L2924/05432 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.

摘要翻译： 本发明提供一种电子设备，其具有包括金属板的金属芯基板，形成在金属板上的绝缘层和形成在绝缘层上的导电层，以及电子部件，并且导电层和导体层的端子 电子部件连接。 在电子设备中，具有高导热性的部件被布置成与金属板和电子部件都接触。 因此，电子设备的散热性提高。