公开(公告)号：US5958600A

公开(公告)日：1999-09-28

申请号：US981835

申请日：1998-01-09

申请人： Hideo Sotokawa ,  Akira Yabushita ,  Takashi Inoue ,  Hidetaka Shigi ,  Mamoru Ogihara ,  Haruhiko Matsuyama ,  Minoru Tanaka ,  Yasunori Narizuka

发明人： Hideo Sotokawa ,  Akira Yabushita ,  Takashi Inoue ,  Hidetaka Shigi ,  Mamoru Ogihara ,  Haruhiko Matsuyama ,  Minoru Tanaka ,  Yasunori Narizuka

IPC分类号： H01L23/498 ,  H01L23/538 ,  B32B15/08 ,  G03C3/00 ,  H05K1/09

CPC分类号： H01L23/5384 ,  H01L23/49866 ,  H01L23/49894 ,  H01L23/5385 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/15312 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31681 ,  Y10T428/31721

摘要： Disclosed are a highly reliable circuit board and a method of stably manufacturing the circuit board, wherein an insulator made from a specific organic insulating material is provided under a highly stressed conductor for preventing occurrence of cracks in the insulator. In addition, a method of correcting a wiring of a ceramic board is additionally adopted. The circuit board includes a thick film wiring board 1 having a first conductor pattern 2 and a thin film layer laminated on the first conductor pattern 2. The thin film layer includes a first insulator 5 on the first conductor pattern 2; a second insulator 10 on the first insulator 5; a second conductor pattern 8 formed on the first insulator 5 in such a manner as to partially pass through the first insulator 5 and to be electrically connected to the first conductor pattern 2; a wiring pattern 9 for circuit correction formed on the first insulator 5; and a third conductor pattern 11 passing through the first insulator 5 and the second insulator 10 and electrically connected to the second conductor pattern 8.

摘要翻译： PCT No.PCT / JP96 / 01909 Sec。 371日期1998年1月9日 102（e）1998年1月9日PCT PCT 1996年7月10日PCT公布。 出版物WO97 / 03542 日期1997年1月30日公开是一种高度可靠的电路板和稳定制造电路板的方法，其中由特定有机绝缘材料制成的绝缘体设置在高应力导体下面，以防止在绝缘体中发生裂纹。 此外，另外采用校正陶瓷板的布线的方法。 电路板包括具有层叠在第一导体图案2上的第一导体图案2和薄膜层的厚膜布线板1.薄膜层包括在第一导体图案2上的第一绝缘体5; 第一绝缘体5上的第二绝缘体10; 形成在第一绝缘体5上的部分地通过第一绝缘体5并与第一导体图案2电连接的第二导体图案8; 在第一绝缘体5上形成用于电路校正的布线图案9; 以及穿过第一绝缘体5和第二绝缘体10并电连接到第二导体图案8的第三导体图案11。

公开(公告)号：US5868949A

公开(公告)日：1999-02-09

申请号：US557320

申请日：1995-11-14

申请人： Hideo Sotokawa ,  Masashi Nishiki ,  Eiji Matsuzaki ,  Hidetaka Shigi ,  Toshio Terouchi ,  Mamoru Ogihara ,  Haruhiko Matsuyama ,  Minoru Tanaka

发明人： Hideo Sotokawa ,  Masashi Nishiki ,  Eiji Matsuzaki ,  Hidetaka Shigi ,  Toshio Terouchi ,  Mamoru Ogihara ,  Haruhiko Matsuyama ,  Minoru Tanaka

IPC分类号： C08G73/10 ,  H01L23/498 ,  H05K1/03 ,  H05K1/11 ,  H05K3/46 ,  B44C1/22

CPC分类号： H05K1/112 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/0154 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/10674 ,  H05K3/4605 ,  Y10T428/24917

摘要： A metalization structure having a first conductor layer on the surface of an underlying layer and, further, a second conductor layer connected conductively with the first conductor layer in which a polyimide insulative film of low thermal expansion coefficient is present between at least an end of a pattern of the second conductor layer and the first conductor layer, for stably obtaining a metalization structure of high reliability and free from the worry of peeling of the conductor portion from a substrate or occurrence of cracking to the underlying layer.

摘要翻译： 一种金属化结构，其具有在下层的表面上的第一导体层，并且还具有与第一导体层导电连接的第二导体层，其中热膨胀系数低的聚酰亚胺绝缘膜存在于第一导体层的至少一端 第二导体层和第一导体层的图案，用于稳定地获得高可靠性的金属化结构，并且不会导致导体部分从基板剥离或者发生开裂到下层。

公开(公告)号：US5753372A

公开(公告)日：1998-05-19

申请号：US500157

申请日：1995-07-10

申请人： Hideo Sotokawa ,  Miharu Otani ,  Fumio Kataoka ,  Fusaji Shoji ,  Haruhiko Matsuyama ,  Eiji Matsuzaki ,  Shogi Ikeda ,  Hidetaka Shigi ,  Tetsuya Yamazaki ,  Naoki Matsushima ,  Shirou Akamatsu

发明人： Hideo Sotokawa ,  Miharu Otani ,  Fumio Kataoka ,  Fusaji Shoji ,  Haruhiko Matsuyama ,  Eiji Matsuzaki ,  Shogi Ikeda ,  Hidetaka Shigi ,  Tetsuya Yamazaki ,  Naoki Matsushima ,  Shirou Akamatsu

IPC分类号： H01L21/312 ,  H01L21/3205 ,  H01L21/768 ,  H01L23/532 ,  H05K1/00 ,  H05K1/03 ,  H05K3/46 ,  B32B9/04

CPC分类号： H01L21/76801 ,  H01L21/312 ,  H01L21/32056 ,  H01L21/76838 ,  H01L23/5329 ,  H01L2924/0002 ,  H05K1/0346 ,  H05K3/4647 ,  H05K3/4676 ,  Y10T428/24802 ,  Y10T428/31504 ,  Y10T428/31678 ,  Y10T428/31721

摘要： The present invention provides the wiring structure having a wiring layer and insulation layer and the method of manufacturing the same, wherein at least a part of the wiring of said wiring layer comprises copper, and said insulation layer comprises the polyimide obtained by heating the polyimide precursor composition containing the polyimide precursor having the repeating unit which can be represented by the following general formula (Chemical formula 15). ##STR1## (In this formula, R.sup.1 is at least one type of quadrivalent organic group selected from among the Chemical formulae 16, while R.sup.2 is a bivalent organic group containing aromatic ring).

摘要翻译： 本发明提供具有布线层和绝缘层的布线结构及其制造方法，其中所述布线层的布线的至少一部分包括铜，并且所述绝缘层包括通过加热聚酰亚胺前体获得的聚酰亚胺 含有具有可以由以下通式表示的重复单元的聚酰亚胺前体的组合物（化学式15）。 （化学式15）（化学式16） 选自化学式16中的四价有机基团的类型，而R2是含有芳香环的二价有机基团）。

公开(公告)号：US5939789A

公开(公告)日：1999-08-17

申请号：US893323

申请日：1997-07-16

申请人： Michifumi Kawai ,  Ryohei Satoh ,  Osamu Yamada ,  Eiji Matsuda ,  Masakazu Ishino ,  Takashi Inoue ,  Hideo Sotokawa ,  Masayuki Kyoui

发明人： Michifumi Kawai ,  Ryohei Satoh ,  Osamu Yamada ,  Eiji Matsuda ,  Masakazu Ishino ,  Takashi Inoue ,  Hideo Sotokawa ,  Masayuki Kyoui

IPC分类号： H05K3/46 ,  H01L21/48 ,  H05K3/28 ,  H05K3/42 ,  H01L23/485

CPC分类号： H01L21/4857 ,  H05K3/4617 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K2201/0195 ,  H05K2201/09563 ,  H05K2203/1189 ,  H05K3/28 ,  H05K3/423

摘要： A multilayer substrate which is fabricated by laminating a plurality of substrates, each comprising an insulation film, a plurality of via holes which pass through the upper surface to the lower surface of the insulation film, a wiring which is provided on the upper surface of the insulation film and the upper surface of the via holes and electrically connected with the via holes, a bonding member which is provided on the lower surfaces of the via holes and electrically connected with the via holes, and a bonding layer which is provided on the upper surface of the insulation film where the wiring is formed and the method of fabrication thereof whereby large costs reduction and high density effect can be obtained.

摘要翻译： 一种多层基板，其通过层叠多个基板而制造，所述多个基板包括绝缘膜，穿过所述上表面的绝缘膜的下表面的多个通孔，设置在所述绝缘膜的上表面上的布线 绝缘膜和通孔的上表面并与通孔电连接;接合构件，其设置在通孔的下表面上并与通孔电连接;以及接合层，其设置在上部 形成布线的绝缘膜的表面及其制造方法，从而可以获得大量的成本降低和高密度效果。

公开(公告)号：US06554491B2

公开(公告)日：2003-04-29

申请号：US09740610

申请日：2000-12-18

申请人： Hideo Sotokawa ,  Toshimasa Miura

发明人： Hideo Sotokawa ,  Toshimasa Miura

IPC分类号： G02B636

CPC分类号： G02B6/42 ,  G02B1/046 ,  G02B1/048 ,  G02B6/1221 ,  G02B6/30 ,  G02B6/424 ,  G02B6/4253 ,  G02B2006/12176

摘要： The present invention provides an optical module and apparatus and forming method that can reduce problems in the setting of a silicone-based resin. In one embodiment of the present invention an optical module is provided. The optical module includes: an optical waveguide formed from a first resin, the first resin having fluorine; an intermediary layer above the optical waveguide; and a silicone-based resin layer above the intermediary layer. The intermediary layer may include: a metal, a dielectric, an inorganic compound, or a second resin having a fluorine content of less than 10 percent.

摘要翻译： 本发明提供一种能够减少硅树脂树脂的凝固的问题的光学模块及其制造方法。 在本发明的一个实施例中，提供了一种光学模块。 光学模块包括：由第一树脂形成的光波导，第一树脂具有氟; 在光波导上方的中间层; 和中间层上方的硅氧烷类树脂层。 中间层可以包括：金属，电介质，无机化合物或氟含量小于10％的第二树脂。

公开(公告)号：US20080128839A1

公开(公告)日：2008-06-05

申请号：US11573371

申请日：2005-08-30

申请人： Hideo Sotokawa ,  Hiroaki Huruichi

发明人： Hideo Sotokawa ,  Hiroaki Huruichi

IPC分类号： H01L29/84

CPC分类号： B81C1/00269

摘要： An electronic apparatus suppressing damages to a device not having high durability to a high voltage of a structure including a first member having a first electrode and a device, and a second member having a second electrode in which the first electrode and the second electrode, are formed in a region not overlapping the device, the first member and the second member are anodically bonded by the application of a voltage between the first electrode and the second electrode and the device is encapsulated between the first member and the second member.

摘要翻译： 一种电子设备，其抑制对具有第一电极和器件的第一元件的结构的高电压不具有高耐久性的器件的损坏，以及具有第二电极的第二元件，其中第一电极和第二电极是 形成在不与装置重叠的区域中，第一构件和第二构件通过在第一电极和第二电极之间施加电压而阳极结合，并且装置封装在第一构件和第二构件之间。

公开(公告)号：US06937406B2

公开(公告)日：2005-08-30

申请号：US10645986

申请日：2003-08-22

申请人： Naoki Matsushima ,  Hideo Sotokawa ,  Hideyuki Kuwano ,  Yoshiaki Niwa ,  Keiichi Yamada ,  Masahiro Hirai ,  Kazumi Kawamoto ,  Shohei Hata ,  Toshiaki Takai

发明人： Naoki Matsushima ,  Hideo Sotokawa ,  Hideyuki Kuwano ,  Yoshiaki Niwa ,  Keiichi Yamada ,  Masahiro Hirai ,  Kazumi Kawamoto ,  Shohei Hata ,  Toshiaki Takai

IPC分类号： G02B6/42 ,  G02B7/00 ,  G02B7/02

CPC分类号： G02B6/4204 ,  G02B6/423 ,  G02B6/4239 ,  G02B7/025

摘要： The present invention provides an optical module and a method for manufacturing the optical module, in which a V-shaped or trapezoidal groove having a first slope and a second slope facing to the first slope is formed at the surface of a silicon substrate by anisotropic etching, an adhesive is applied to a portion of at least the second slope in a region except the first slope of the groove, and lens is fixedly put in the groove.

摘要翻译： 本发明提供了一种光学模块及其制造方法，其中通过各向异性蚀刻在硅衬底的表面上形成具有第一斜面和第一斜面的第一斜面的V形或梯形槽 在除了槽的第一斜面之外的区域中，至少第二斜面的一部分施加粘合剂，并且将透镜固定地放入槽中。

公开(公告)号：US20060161940A1

公开(公告)日：2006-07-20

申请号：US11333171

申请日：2006-01-18

申请人： Satoshi Arai ,  Hiroaki Furuichi ,  Yoshio Oozeki ,  Hideo Sotokawa ,  Mitsuo Satake ,  Kazuhiko Ito ,  Masayoshi Watanabe

发明人： Satoshi Arai ,  Hiroaki Furuichi ,  Yoshio Oozeki ,  Hideo Sotokawa ,  Mitsuo Satake ,  Kazuhiko Ito ,  Masayoshi Watanabe

IPC分类号： G11B7/09 ,  G11B7/085 ,  G11B7/08

CPC分类号： G11B7/08582 ,  G11B7/22 ,  H05K1/147 ,  H05K2201/0191

摘要： In order to improve reliability of an optical disk drive apparatus at low cost, a flexible substrate for making connection between an optical pick-up device incorporated in the optical disk drive apparatus and a drive side is divided into a first flexible substrate fixed to the optical pick-up body (for example, upper surface), and a second flexible substrate connected to the first flexible substrate and extending to the drive, wiring conductors formed on a connection end portion of the first flexible substrate and wiring conductors formed on a connection end portion of the second flexible substrate are superposed at a region adjacent an end of the case of the optical pick-up device body, and connected to each other by joining material, and a connection section between the wiring conductors is held down by a cover for protecting the optical pick-up device body.

摘要翻译： 为了以低成本提高光盘驱动装置的可靠性，用于连接在光盘驱动装置中的光学拾取装置与驱动侧之间的连接的柔性基板被分成固定到光学器件的第一柔性基板 以及连接到第一柔性基板并延伸到驱动器的第二柔性基板，形成在第一柔性基板的连接端部上的布线导体和形成在连接端上的布线导体 第二柔性基板的一部分重叠在与光拾取装置主体的壳体的端部相邻的区域处，并且通过接合材料彼此连接，并且布线导体之间的连接部分被盖盖住 保护光学拾取装置主体。

公开(公告)号：US20060062139A1

公开(公告)日：2006-03-23

申请号：US11232961

申请日：2005-12-07

申请人： Yoshio Oozeki ,  Hiroaki Furuichi ,  Satoshi Arai ,  Hideo Sotokawa

发明人： Yoshio Oozeki ,  Hiroaki Furuichi ,  Satoshi Arai ,  Hideo Sotokawa

IPC分类号： G11B15/64 ,  G11B17/32

CPC分类号： G11B7/22 ,  G11B7/08582

摘要： To provide an optical pickup device in which an optical parts module is fixedly adhered in a high positional precision to an optical pickup case, such that the adhesion strength can be sufficiently enhanced against a stress to be applied to the adhering faces from a flexible printed circuit board connected to the optical parts module, the present invention forms the adhering faces on at least two portions across the optical axis of the optical parts module, and also forms groove portions on the individual surfaces of the optical parts module and the optical pickup case for the adhering faces.

公开(公告)号：US06635971B2

公开(公告)日：2003-10-21

申请号：US10042270

申请日：2002-01-11

申请人： Toyoki Asada ,  Yuji Fujita ,  Hideo Sotokawa ,  Kazumi Kawamoto ,  Kunio Matsumoto ,  Shinya Hamagishi ,  Mari Matsuyoshi

发明人： Toyoki Asada ,  Yuji Fujita ,  Hideo Sotokawa ,  Kazumi Kawamoto ,  Kunio Matsumoto ,  Shinya Hamagishi ,  Mari Matsuyoshi

IPC分类号： H01L2329

CPC分类号： H01L24/31 ,  G02B6/4232 ,  G02B6/4246 ,  H01L21/563 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/83951 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/0401

摘要： An electronic device, in which terminals of a semiconductor integrated circuit chip and terminals of a circuit substrate are mounted with solder so as to face one another. The electronic device includes a first resin, which is disposed between the circuit substrate and a terminal formation face of the semiconductor integrated circuit chip and a second resin, which is disposed at the outer perimeter of the semiconductor integrated circuit chip or is disposed laterally thereon. The modulus of elasticity of the second resin is smaller than the modulus of elasticity of the first resin, the modulus of elasticity of the second resin is at least 0.5 GPa but not more than 28 GPa at room temperature.