NONVOLATILE SEMICONDUCTOR STORAGE APPARATUS AND METHOD FOR MANUFACTURING THE SAME
    1.
    发明申请
    NONVOLATILE SEMICONDUCTOR STORAGE APPARATUS AND METHOD FOR MANUFACTURING THE SAME 有权
    非挥发性半导体存储装置及其制造方法

    公开(公告)号:US20080099819A1

    公开(公告)日:2008-05-01

    申请号:US11874004

    申请日:2007-10-17

    摘要: According to an aspect of the present invention, there is provided a nonvolatile semiconductor storage apparatus including: a substrate; a columnar semiconductor disposed perpendicular to the substrate; a charge storage laminated film disposed around the columnar semiconductor; a first conductor layer that is in contact with the charge storage laminated film and that has a first end portion having a first end face; a second conductor layer that is in contact with the charge storage laminated film, that is separated from the first conductor layer and that has a second end portion having a second end face; a first contact plug disposed on the first end face; and a second contact plug disposed on the second end face.

    摘要翻译: 根据本发明的一个方面,提供了一种非易失性半导体存储装置,包括:基板; 垂直于衬底设置的柱状半导体; 设置在所述柱状半导体周围的电荷存储层叠膜; 与所述电荷存储叠层膜接触并具有第一端部的第一导体层,所述第一端部具有第一端面; 与电荷存储叠层膜接触的第二导体层,其与第一导体层分离并且具有具有第二端面的第二端部; 设置在所述第一端面上的第一接触插塞; 以及设置在所述第二端面上的第二接触插塞。

    METHOD FOR MANUFACTURING NONVOLATILE SEMICONDUCTOR STORAGE DEVICE AND NONVOLATILE SEMICONDUCTOR STORAGE DEVICE
    2.
    发明申请
    METHOD FOR MANUFACTURING NONVOLATILE SEMICONDUCTOR STORAGE DEVICE AND NONVOLATILE SEMICONDUCTOR STORAGE DEVICE 有权
    制造非易失性半导体存储器件和非易失性半导体存储器件的方法

    公开(公告)号:US20130075805A1

    公开(公告)日:2013-03-28

    申请号:US13419984

    申请日:2012-03-14

    IPC分类号: H01L29/792 H01L21/425

    摘要: According to one embodiment, a method for manufacturing a nonvolatile semiconductor storage device includes; forming a first and a second stacked bodies; forming a through hole penetrating through the first stacked body, a second portion communicating with the first portion and penetrating through a select gate, and a third portion communicating with the second portion and penetrating through a second insulating layer; forming a memory film, a gate insulating film, and a channel body; forming a third insulating layer inside the channel body; forming a first embedded portion above a boundary portion inside the third portion; exposing the channel body by removing part of the first embedded portion and part of the third insulating layer in the third portion; and embedding a second embedded portion including silicon having higher impurity concentration than the first embedded portion above the first embedded portion inside the third portion.

    摘要翻译: 根据一个实施例,一种用于制造非易失性半导体存储装置的方法包括: 形成第一和第二堆叠体; 形成穿过所述第一层叠体的通孔,与所述第一部分连通并穿过选择栅极的第二部分,以及与所述第二部分连通并穿透第二绝缘层的第三部分; 形成记忆膜,栅极绝缘膜和通道体; 在通道体内形成第三绝缘层; 在第三部分内部的边界部分上方形成第一嵌入部分; 通过去除第三部分中的第一嵌入部分和第三绝缘层的一部分的一部分来暴露通道体; 以及在所述第三部分内部嵌入包含比所述第一嵌入部分上方的所述第一嵌入部分杂质浓度高的硅的第二嵌入部分。

    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
    3.
    发明申请
    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF 有权
    非易失性半导体存储器件及其制造方法

    公开(公告)号:US20110284947A1

    公开(公告)日:2011-11-24

    申请号:US13198359

    申请日:2011-08-04

    IPC分类号: H01L29/792

    摘要: A nonvolatile semiconductor memory device that have a new structure are provided, in which memory cells are laminated in a three dimensional state so that the chip area may be reduced. The nonvolatile semiconductor memory device of the present invention is a nonvolatile semiconductor memory device that has a plurality of the memory strings, in which a plurality of electrically programmable memory cells is connected in series. The memory strings comprise a pillar shaped semiconductor; a first insulation film formed around the pillar shaped semiconductor; a charge storage layer formed around the first insulation film; the second insulation film formed around the charge storage layer; and first or nth electrodes formed around the second insulation film (n is natural number more than 1). The first or nth electrodes of the memory strings and the other first or nth electrodes of the memory strings are respectively the first or nth conductor layers that are spread in a two dimensional state.

    摘要翻译: 提供了具有新结构的非易失性半导体存储器件,其中以三维状态层叠存储单元,从而可以减小芯片面积。 本发明的非易失性半导体存储装置是具有串联连接有多个电可编程存储单元的多个存储串的非易失性半导体存储装置。 存储器串包括柱形半导体; 形成在柱状半导体周围的第一绝缘膜; 形成在所述第一绝缘膜周围的电荷存储层; 形成在电荷存储层周围的第二绝缘膜; 并且形成在第二绝缘膜周围的第一或第n电极(n是大于1的自然数)。 存储器串的第一或第n电极和存储器串的其它第一或第n电极分别是以二维状态扩展的第一或第n导体层。

    SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
    4.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF 有权
    半导体存储器件及其制造方法

    公开(公告)号:US20100052042A1

    公开(公告)日:2010-03-04

    申请号:US12561451

    申请日:2009-09-17

    IPC分类号: H01L29/792 H01L21/336

    摘要: The semiconductor memory device of the present invention includes a plurality of memory strings having a plurality of electrically reprogrammable memory cells connected in series, the memory strings having a column shaped semiconductor, a first insulation film formed around the column shaped semiconductor, a charge accumulation layer formed around the first insulation film, a second insulation film formed around the charge accumulation film and a plurality of electrodes formed around the second insulation film, a bit line connected to one end of the memory strings via a plurality of selection transistors, and a conducting layer extending in two dimensions and in which the plurality of electrodes of the memory strings and the plurality of electrodes of different memory strings are shared respectively, wherein each end part of the conducting layer is formed in step shapes in a direction parallel with the bit line.

    摘要翻译: 本发明的半导体存储器件包括具有串联连接的多个电可再编程存储器单元的多个存储器串,具有列形半导体的存储器串,形成在柱状半导体周围的第一绝缘膜,电荷累积层 形成在第一绝缘膜周围,形成在电荷累积膜周围的第二绝缘膜和围绕第二绝缘膜形成的多个电极,经由多个选择晶体管连接到存储器串的一端的位线,以及导电 分别在存储器串的多个电极和不同的存储器串的多个电极中分别共享,其中导电层的每个端部在平行于位线的方向上形成为台阶形状 。

    METHOD FOR OPERATING NONVOLATILE SEMICONDUCTOR MEMORY DEVICE
    7.
    发明申请
    METHOD FOR OPERATING NONVOLATILE SEMICONDUCTOR MEMORY DEVICE 有权
    用于操作非易失性半导体存储器件的方法

    公开(公告)号:US20120206961A1

    公开(公告)日:2012-08-16

    申请号:US13235999

    申请日:2011-09-19

    申请人: Masaru KITO

    发明人: Masaru KITO

    IPC分类号: G11C16/10

    摘要: According to one embodiment, a method for operating a nonvolatile semiconductor memory device, the device includes a memory unit having a memory string, and a control unit. The memory string includes a plurality of transistors and has a first group being part of the transistors, a adjusting transistor connected next to the first group, and a second group including transistors connected to a side opposite the first group with respect to the adjusting transistor. The method includes rewriting the threshold values of the transistors of the first group, and then performing control so as to set a first threshold value for adjustment to the adjusting transistor to adjust an amount corresponding to relative variations in the threshold values of the transistors of the second group, the relative variations being caused by the rewrite of the threshold values of the transistors of the first group.

    摘要翻译: 根据一个实施例,一种用于操作非易失性半导体存储器件的方法,该器件包括具有存储器串的存储器单元和控制单元。 存储器串包括多个晶体管,并且具有作为晶体管的一部分的第一组,与第一组相邻的调节晶体管,以及包括连接到相对于调整晶体管的与第一组相对的一侧的晶体管的第二组。 该方法包括重写第一组的晶体管的阈值,然后执行控制,以便将调整用的第一阈值设置为调节晶体管,以调整对应于晶体管的阈值的相对变化的量 第二组,相对变化是由第一组的晶体管的阈值的重写引起的。

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    10.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    半导体器件及其制造方法

    公开(公告)号:US20100219538A1

    公开(公告)日:2010-09-02

    申请号:US12776454

    申请日:2010-05-10

    IPC分类号: H01L23/538

    摘要: A semiconductor device comprises a semiconductor layer including a plurality of paralleled linear straight sections extending in a first direction. The layer also includes a plurality of connecting sections each having a width in the first direction sufficient to form a wire-connectable contact therein and arranged to connect between adjacent ones of the straight sections in a second direction. The connecting sections have respective ends formed aligned with a first straight line parallel to the second direction.

    摘要翻译: 半导体器件包括半导体层,该半导体层包括在第一方向上延伸的多个平行的线性直线部分。 该层还包括多个连接部分,每个连接部分具有在第一方向上的宽度,足以在其中形成可接线的触点,并且布置成在第二方向上在相邻的直部分之间连接。 连接部具有与平行于第二方向的第一直线对准的各自的端部。