Insulated-gate semiconductor device
    4.
    发明授权
    Insulated-gate semiconductor device 失效
    绝缘栅半导体器件

    公开(公告)号:US4213140A

    公开(公告)日:1980-07-15

    申请号:US922371

    申请日:1978-07-06

    CPC分类号: H01L27/0251

    摘要: An insulated-gate semiconductor device wherein a first region is formed in the surface of a semiconductor substrate, the first region having a conductivity type opposite to that of the substrate, two insulated-gate FET's are formed within the first region, the drain of the first insulated-gate FET and that of the second insulated-gate FET are made common, the drains are electrically connected to the first region, and the gate of the first insulated-gate FET and the source of the second insulated-gate FET, and the gate of the second insulated-gate FET and the source of the first insulated-gate FET are respectively connected, thereby to prevent the occurrence of a negative resistance.

    摘要翻译: 一种绝缘栅半导体器件,其中第一区域形成在半导体衬底的表面中,所述第一区域具有与衬底的导电类型相反的导电类型,在所述第一区域内形成有两个绝缘栅FET, 第一绝缘栅极FET和第二绝缘栅极FET的漏极共同,漏极电连接到第一区域,第一绝缘栅极FET的栅极和第二绝缘栅极FET的源极,以及 第二绝缘栅FET的栅极和第一绝缘栅FET的源极分别连接,从而防止产生负电阻。

    Insulated gate field effect transistor with source field shield
extending over multiple region channel
    8.
    发明授权
    Insulated gate field effect transistor with source field shield extending over multiple region channel 失效
    绝缘栅场效应晶体管,源场屏蔽延伸到多个区域通道

    公开(公告)号:US4172260A

    公开(公告)日:1979-10-23

    申请号:US853548

    申请日:1977-11-21

    CPC分类号: H01L29/404 H01L29/7835

    摘要: In an insulated gate field effect transistor having a source region and a drain region of the P-conductivity type which are disposed in surface portions of a semiconductor substrate of the N-conductivity type in a manner to be spaced apart from each other, a gate electrode being disposed through an insulating film on the substrate between the source region and the drain region, an insulated gate field effect transistor wherein said drain region is disposed apart from said gate electrode, two regions of an intermediate region and a high resistance region which are of the P-conductivity type and which successively extend from said drain region towards the side of said gate electrode are disposed in surface portions of the substrate situated between said drain region and said gate electrode, said intermediate region having an impurity concentration lower than that of said drain region, said high resistance region having an impurity concentration lower than that of said intermediate region, and a source electrode extends over and beyond said gate electrode and said high resistance region through said insulating film and terminates over said intermediate region.

    摘要翻译: 在绝缘栅场效应晶体管中,具有P导电类型的源区和漏区,它们以相互间隔开的方式设置在N-导电类型的半导体衬底的表面部分中,栅极 电极通过源极区域和漏极区域之间的衬底上的绝缘膜设置,绝缘栅极场效应晶体管,其中所述漏极区域与所述栅电极隔开,中间区域和高电阻区域的两个区域是 的P导电类型并且从所述漏极区域朝向所述栅电极的侧面依次延伸设置在位于所述漏极区域和所述栅电极之间的衬底的表面部分中,所述中间区域的杂质浓度低于 所述漏极区,所述高电阻区的杂质浓度低于所述中间区的杂质浓度 并且源电极通过所述绝缘膜延伸超过所述栅电极和所述高电阻区域,并且终止于所述中间区域上。

    Packaged semiconductor device having heat dissipation/electrical
connection bumps and method of manufacturing same
    9.
    发明授权
    Packaged semiconductor device having heat dissipation/electrical connection bumps and method of manufacturing same 失效
    具有散热/电连接凸块的封装半导体器件及其制造方法

    公开(公告)号:US5299091A

    公开(公告)日:1994-03-29

    申请号:US854028

    申请日:1992-03-19

    摘要: A packaged semiconductor device has, according to one embodiment of the present invention, a semiconductor pellet having an electronic circuit therein and electrode pads formed on a principal surface of the pellet, a plurality of electrical connection bumps provided on the electrode pads, a plurality of heat dissipation bumps provided at the principal surface of the pellet and electrically insulated from the electronic circuit and the electrode pads, electrical connection leads for the electronic circuit, heat dissipators for the electronic circuit and a packaging material for sealing pellet, the electrical connection bumps, the heat dissipation bumps and parts of the electrical connection leads and the heat dissipator. One or more of the heat dissipation bumps are arranged relatively nearer to the electronic circuit than the electrical connection bumps for thermal coupling to the electronic circuit. One or more of the electrical connection leads may be engaged with the electrical connection bumps and the heat dissipation bumps and/or one or more of the dissipators may be engaged with the heat dissipation bumps and the electrical connection bumps, thereby serving to effect electrical connection to and heat dissipation for the electronic circuit.

    摘要翻译: 根据本发明的一个实施例,封装的半导体器件具有其中具有电子电路的半导体芯片和形成在芯片的主表面上的电极焊盘,设置在电极焊盘上的多个电连接凸块,多个 提供在颗粒主表面上的散热凸块与电子电路和电极焊盘电绝缘,用于电子电路的电气连接引线,用于电子电路的散热器和用于密封颗粒的包装材料,电连接凸块, 散热凸块和电气连接引线和散热器的部件。 一个或多个散热凸块被布置成比用于热耦合到电子电路的电连接凸块相对更靠近电子电路。 一个或多个电连接引线可以与电连接凸块接合,并且散热凸块和/或一个或多个散热器可以与散热凸块和电连接凸块接合,从而用于实现电连接 电子电路的散热和散热。

    High frequency power amplifying module and wireless communication apparatus
    10.
    发明授权
    High frequency power amplifying module and wireless communication apparatus 有权
    高频功率放大模块和无线通信设备

    公开(公告)号:US06492872B1

    公开(公告)日:2002-12-10

    申请号:US09657237

    申请日:2000-09-07

    IPC分类号: H03G310

    CPC分类号: H03F1/301 H03G3/3042

    摘要: A high frequency power amplifier module is provided for improving output controllability. A wireless communication apparatus incorporates a high frequency power amplifier module in a multi-stage configuration including a plurality of cascaded MOSFETS. The power amplifier module comprises a bias circuit for generating a gate voltage in response to a power control voltage (vapc) generated based on a power control signal of the wireless communication apparatus. The gate voltage has a bias pattern which presents smaller fluctuations in output power in response to a control voltage (Vapc) in a region near a threshold voltage (Vth) of the MOSFETs in respective amplification stages. In this way, the controllability for the output power is improved. More specifically, the power amplifier module has a gate bias circuit for generating the gate voltage (Vg) which follows a gate voltage pattern. The gate voltage (Vg) supplied to a control terminal in response to the control voltage (Vapc) largely changes in a region where the gate voltage (Vg) is lower than the threshold voltage (Vth) of the respective MOSFETs, and slightly changes near the threshold voltage (Vth). Also, the gate voltage (Vg) presents desired characteristics from the vicinity of the threshold voltage (Vth) to a high Vapc voltage region.

    摘要翻译: 提供了一种用于提高输出可控性的高频功率放大器模块。 无线通信装置将包括多个级联MOSFET的多级配置的高频功率放大器模块结合在一起。 功率放大器模块包括用于响应于基于无线通信设备的功率控制信号产生的功率控制电压(vapc)产生栅极电压的偏置电路。 栅极电压具有偏置图案,其响应于在各个放大级中的MOSFET的阈值电压(Vth)附近的区域中的控制电压(Vapc),输出功率的波动较小。 以这种方式,提高了输出功率的可控性。 更具体地,功率放大器模块具有用于产生跟随栅极电压图案的栅极电压(Vg)的栅极偏置电路。 响应于控制电压(Vapc)而提供给控制端的栅极电压(Vg)在栅极电压(Vg)低于各个MOSFET的阈值电压(Vth)的区域内大大变化,并且稍微改变 阈值电压(Vth)。 此外,栅极电压(Vg)从阈值电压(Vth)附近到高Vapc电压区域呈现期望的特性。