公开(公告)号：US20100080912A1

公开(公告)日：2010-04-01

申请号：US12568347

申请日：2009-09-28

申请人： Masayoshi Koyama ,  Norihito Tsukahara ,  Daido Komyoji

发明人： Masayoshi Koyama ,  Norihito Tsukahara ,  Daido Komyoji

IPC分类号： B05D5/00 ,  B05D1/02 ,  B05C11/00

CPC分类号： B05C11/1034 ,  B05C5/02 ,  B05C5/0212 ,  B05C5/0225 ,  B05C9/02 ,  B05D1/26 ,  B05D3/0466 ,  B23K1/0016 ,  B23K3/0692 ,  B23K2101/40 ,  G01F11/00 ,  H05K3/3484 ,  H05K2203/0126

摘要： A pin (125) is moved down in a nozzle (121), the end of paste (101) protruded from the discharge opening (122) of the nozzle (121) to a target object (102) is brought into contact with the target object (102), and the pin (125) is moved away from the discharge opening (122) to divide the paste in contact with the target object.

摘要翻译： 销（125）在喷嘴（121）中向下移动，从喷嘴（121）的排出口（122）向目标物体（102）突出的浆料（101）的端部与靶 物体（102），并且销（125）远离排出口（122）移动，以将糊剂与目标物体接触。

公开(公告)号：US09162249B2

公开(公告)日：2015-10-20

申请号：US12568347

申请日：2009-09-28

申请人： Masayoshi Koyama ,  Norihito Tsukahara ,  Daido Komyoji

发明人： Masayoshi Koyama ,  Norihito Tsukahara ,  Daido Komyoji

IPC分类号： B05C1/00 ,  B05C11/00 ,  B05C11/10 ,  B23K1/00 ,  B23K3/06 ,  H05K3/34 ,  C23C14/54 ,  G01F11/20 ,  G01F11/00 ,  B05C5/02 ,  B05C9/02 ,  B05D1/26 ,  B05D3/04

CPC分类号： B05C11/1034 ,  B05C5/02 ,  B05C5/0212 ,  B05C5/0225 ,  B05C9/02 ,  B05D1/26 ,  B05D3/0466 ,  B23K1/0016 ,  B23K3/0692 ,  B23K2101/40 ,  G01F11/00 ,  H05K3/3484 ,  H05K2203/0126

摘要： A pin (125) is moved down in a nozzle (121), the end of paste (101) protruded from the discharge opening (122) of the nozzle (121) to a target object (102) is brought into contact with the target object (102), and the pin (125) is moved away from the discharge opening (122) to divide the paste in contact with the target object.

摘要翻译： 销（125）在喷嘴（121）中向下移动，从喷嘴（121）的排出口（122）向目标物体（102）突出的浆料（101）的端部与靶 物体（102），并且销（125）远离排出口（122）移动，以将糊剂与目标物体接触。

公开(公告)号：US08115109B2

公开(公告)日：2012-02-14

申请号：US12427991

申请日：2009-04-22

申请人： Masayoshi Koyama ,  Norihito Tsukahara ,  Susumu Matsuoka

发明人： Masayoshi Koyama ,  Norihito Tsukahara ,  Susumu Matsuoka

IPC分类号： H05K1/11

CPC分类号： H05K3/361 ,  H01L2224/11003 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H01L2924/01019 ,  H05K3/323 ,  H05K3/363 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/10977 ,  H05K2203/083 ,  H05K2203/087 ,  H05K2203/167 ,  Y10T29/49126

摘要： A circuit board in which end faces (36a) of wires are located in positions withdrawn from the end in a joint region of a first board (31a), end faces (36b) of wires are located in positions withdrawn from the end in a joint region of a second board (31b), a gap (W) between the end faces (36a) of the wires of the first board (31a) and the end faces (36b) of the wires of the second board (31b) is filled with a conductor (16A), and the first board (31a) and the second board (31b) are jointed by means of a resin.

摘要翻译： 其中电线的端面（36a）位于从第一板（31a）的接合区域中的端部退出的位置的电路​​板，电线的端面（36b）位于从接头的端部撤出的位置 第二板（31b）的区域，填充第一板（31a）的导线的端面（36a）与第二板（31b）的导线的端面（36b）之间的间隙（W） 与导体（16A）和第一板（31a）和第二板（31b）通过树脂接合。

公开(公告)号：US20090266592A1

公开(公告)日：2009-10-29

申请号：US12427991

申请日：2009-04-22

申请人： Masayoshi Koyama ,  Norihito Tsukahara ,  Susumu Matsuoka

发明人： Masayoshi Koyama ,  Norihito Tsukahara ,  Susumu Matsuoka

IPC分类号： H05K1/02 ,  H05K3/36

CPC分类号： H05K3/361 ,  H01L2224/11003 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H01L2924/01019 ,  H05K3/323 ,  H05K3/363 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/10977 ,  H05K2203/083 ,  H05K2203/087 ,  H05K2203/167 ,  Y10T29/49126

摘要： A circuit board in which end faces (36a) of wires are located in positions withdrawn from the end in a joint region of a first board (31a), end faces (36b) of wires are located in positions withdrawn from the end in a joint region of a second board (31b), a gap (W) between the end faces (36a) of the wires of the first board (31a) and the end faces (36b) of the wires of the second board (31b) is filled with a conductor (16A), and the first board (31a) and the second board (31b) are jointed by means of a resin.

摘要翻译： 其中电线的端面（36a）位于从第一板（31a）的接合区域中的端部退出的位置的电路​​板，电线的端面（36b）位于从接头的端部撤出的位置 第二板（31b）的区域，填充第一板（31a）的导线的端面（36a）与第二板（31b）的导线的端面（36b）之间的间隙（W） 与导体（16A）和第一板（31a）和第二板（31b）通过树脂接合。

公开(公告)号：US08304338B2

公开(公告)日：2012-11-06

申请号：US12728555

申请日：2010-03-22

申请人： Norihito Tsukahara ,  Masayoshi Koyama

发明人： Norihito Tsukahara ,  Masayoshi Koyama

IPC分类号： H01L21/44

CPC分类号： H05K3/3436 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/838 ,  H01L2224/83886 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/15788 ,  H05K3/323 ,  H05K2201/09781 ,  H05K2201/10977 ,  H05K2203/046 ,  Y02P70/613 ,  Y10T29/49117 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Dummy electrodes (15) are disposed on wiring connected to first electrodes (2) of the substrate (1), outside a junction region containing all of the first electrodes (2) and second electrodes (6) and in bonding resin (4), the dummy electrodes (15) not being involved in electrical connection between the substrate (1) and the component (5). When conductive particles (3) in the bonding resin (4) are melted by heating, molten solder self-assembles and solidifies between the first electrodes (2) and the second electrodes (6) and on the dummy electrodes (15). With this configuration, the solder self-assembles between the adjacent dummy electrodes (15) and causes a solder short circuit. Thus it is possible to eliminate excessive solder supply between the adjacent first electrodes (2) and the adjacent second electrodes (6), thereby preventing short circuits between the adjacent first electrodes (2) and the adjacent second electrodes (6).

摘要翻译： 虚拟电极（15）设置在与基板（1）的第一电极（2）连接的布线上，包含所有第一电极（2）和第二电极（6）的接合区域和接合树脂（4）中， 虚设电极（15）不参与基板（1）和部件（5）之间的电连接。 当接合树脂（4）中的导电颗粒（3）通过加热熔化时，熔融焊料在第一电极（2）和第二电极（6）之间以及虚拟电极（15）上自我组装和固化。 利用这种结构，焊料在相邻的虚设电极（15）之间自组装并引起焊料短路。 因此，可以消除相邻的第一电极（2）和相邻的第二电极（6）之间的过多的焊料供应，从而防止相邻的第一电极（2）和相邻的第二电极（6）之间的短路。

公开(公告)号：US20100244283A1

公开(公告)日：2010-09-30

申请号：US12728555

申请日：2010-03-22

申请人： Norihito Tsukahara ,  Masayoshi Koyama

发明人： Norihito Tsukahara ,  Masayoshi Koyama

IPC分类号： H01L23/28 ,  H01R43/00

CPC分类号： H05K3/3436 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/838 ,  H01L2224/83886 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/15788 ,  H05K3/323 ,  H05K2201/09781 ,  H05K2201/10977 ,  H05K2203/046 ,  Y02P70/613 ,  Y10T29/49117 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Dummy electrodes (15) are disposed on wiring connected to first electrodes (2) of the substrate (1), outside a junction region containing all of the first electrodes (2) and second electrodes (6) and in bonding resin (4), the dummy electrodes (15) not being involved in electrical connection between the substrate (1) and the component (5). When conductive particles (3) in the bonding resin (4) are melted by heating, molten solder self-assembles and solidifies between the first electrodes (2) and the second electrodes (6) and on the dummy electrodes (15). With this configuration, the solder self-assembles between the adjacent dummy electrodes (15) and causes a solder short circuit. Thus it is possible to eliminate excessive solder supply between the adjacent first electrodes (2) and the adjacent second electrodes (6), thereby preventing short circuits between the adjacent first electrodes (2) and the adjacent second electrodes (6).

摘要翻译： 虚拟电极（15）设置在与基板（1）的第一电极（2）连接的布线上，包含所有第一电极（2）和第二电极（6）的接合区域和接合树脂（4）中， 虚设电极（15）不参与基板（1）和部件（5）之间的电连接。 当接合树脂（4）中的导电颗粒（3）通过加热熔化时，熔融焊料在第一电极（2）和第二电极（6）之间以及虚拟电极（15）上自我组装和固化。 利用这种结构，焊料在相邻的虚设电极（15）之间自组装并引起焊料短路。 因此，可以消除相邻的第一电极（2）和相邻的第二电极（6）之间的过多的焊料供应，从而防止相邻的第一电极（2）和相邻的第二电极（6）之间的短路。

公开(公告)号：US08111426B2

公开(公告)日：2012-02-07

申请号：US11940774

申请日：2007-11-15

申请人： Masayoshi Koyama ,  Masato Nakamura ,  Takumi Namekawa ,  Shota Nishi ,  Shinichi Horii

发明人： Masayoshi Koyama ,  Masato Nakamura ,  Takumi Namekawa ,  Shota Nishi ,  Shinichi Horii

IPC分类号： H04N1/40

CPC分类号： B41J29/393

摘要： The present invention provides a droplet discharging apparatus including a discharge head for deflectively discharging droplets through one discharge port at a plurality of pixel areas in adaptive fashion. The discharge head is controlled to discharge droplets at an object. A storage unit stores status information about the discharge head. A communication unit communicates with an information processing apparatus located outside so as to transmit the status information to the information processing apparatus.

摘要翻译： 本发明提供了一种液滴喷射装置，包括一个排出头，用于以适应方式以多个像素区域的一个排出口偏转地排出液滴。 排放头被控制以在物体处排出液滴。 存储单元存储关于排出头的状态信息。 通信单元与位于外部的信息处理装置进行通信，以将状态信息发送到信息处理装置。

公开(公告)号：US20070119617A1

公开(公告)日：2007-05-31

申请号：US10573717

申请日：2004-09-27

申请人： Yoshitake Hayashi ,  Masayoshi Koyama ,  Satoru Yuhaku ,  Kazuo Otani ,  Susumu Matsuoka ,  Seiichi Nakatani

发明人： Yoshitake Hayashi ,  Masayoshi Koyama ,  Satoru Yuhaku ,  Kazuo Otani ,  Susumu Matsuoka ,  Seiichi Nakatani

IPC分类号： H05K1/16

CPC分类号： H01L23/5389 ,  H01L21/4857 ,  H01L23/49833 ,  H01L23/5385 ,  H01L25/0657 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2924/0002 ,  H05K1/186 ,  H05K1/187 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/462 ,  H05K2201/10378 ,  H05K2203/0191 ,  Y10T29/49165 ,  H01L2924/00

摘要： A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical insulating sheet with the electrical component built therein, the electrical insulating sheet being disposed between the first wiring pattern and the second wiring pattern; and a via conductor formed in a via hole penetrating through the electrical insulating sheet, the via conductor connecting electrically the first wiring pattern and the second wiring pattern. A side face of the via conductor defines a continuous line in an axis direction of the via conductor. Thus, a component built-in module having excellent reliability concerning electrical connection can be provided.

摘要翻译： 本发明的组件内置模块包括：第一布线图案; 安装在所述第一布线图案上的电子部件; 第二布线图案; 电气绝缘片，其中内置有电气部件，电绝缘片设置在第一布线图案和第二布线图案之间; 以及形成在穿过所述电绝缘片的通孔中的通孔导体，所述通孔导体电连接所述第一布线图案和所述第二布线图案。 通孔导体的侧面在通孔导体的轴线方向上形成连续的线。 因此，可以提供具有优异的电连接可靠性的组件内置模块。

公开(公告)号：US06613180B2

公开(公告)日：2003-09-02

申请号：US10114089

申请日：2002-04-01

申请人： Yoshitaka Sunagawa ,  Yoshitake Hayashi ,  Masayoshi Koyama ,  Yoshihiro Tomura ,  Toshiyuki Kojima ,  Osamu Shibata ,  Ryuichi Saito

发明人： Yoshitaka Sunagawa ,  Yoshitake Hayashi ,  Masayoshi Koyama ,  Yoshihiro Tomura ,  Toshiyuki Kojima ,  Osamu Shibata ,  Ryuichi Saito

IPC分类号： B32B3100

CPC分类号： H01L21/67132 ,  H01L21/50 ,  H01L21/563 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/3025 ,  Y10T156/1089 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for fabricating a semiconductor-mounting body having at least one semiconductor device mounted on a substrate and a sealing resin set in the gap between the substrate and the semiconductor device, has a first step of setting a flexibly deformable sheet on a face of the semiconductor device not facing the substrate; and a second step of generating an air-pressure difference between the side where the semiconductor device is not present and the side where the semiconductor device is present on the basis of the sheet so that the air pressure at the side where the semiconductor device is not present becomes higher than the side where the semiconductor device is present and pressurizing the semiconductor device by the sheet after the first step.

摘要翻译： 一种制造半导体安装体的方法，其具有安装在基板上的至少一个半导体器件和设置在基板和半导体器件之间的间隙中的密封树脂，具有将柔性可变形薄片设置在半导体的表面上的第一步骤 设备不面向基板; 以及基于片材在半导体器件不存在的一侧和存在半导体器件的一侧之间产生气压差的第二步骤，使得半导体器件不存在的一侧的空气压力 变得高于存在半导体器件的一侧并且在第一步骤之后通过片材对半导体器件加压。

公开(公告)号：US5622935A

公开(公告)日：1997-04-22

申请号：US335411

申请日：1994-11-03

申请人： Masayoshi Koyama ,  Mikiko Takahashi ,  Kazuyuki Doi

发明人： Masayoshi Koyama ,  Mikiko Takahashi ,  Kazuyuki Doi

IPC分类号： A61K47/02 ,  A61K38/00 ,  A61P43/00 ,  C07K14/52

CPC分类号： C07K14/522 ,  A61K38/00

摘要： Pharmaceutical composition for preventing or treating bone fracture comprising as an active ingredient a platelet factor 4.The present composition can promote differentiation of osteoblasts so that they are effective for prophylaxis and treatment of such diseases requiring bone differentiation and proliferation as bone fracture and the like.

摘要翻译： 用于预防或治疗骨折的药物组合物，其包含作为活性成分的血小板因子4.本发明的组合物可以促进成骨细胞分化，使得它们有效预防和治疗需要骨分化和增殖的这种疾病作为骨折等。