公开(公告)号：US07910402B2

公开(公告)日：2011-03-22

申请号：US12125421

申请日：2008-05-22

申请人： Masayuki Uchida ,  Hisashi Ito ,  Kazuhito Higuchi ,  Takashi Togasaki

发明人： Masayuki Uchida ,  Hisashi Ito ,  Kazuhito Higuchi ,  Takashi Togasaki

IPC分类号： H01L21/00

CPC分类号： H05K3/3436 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13016 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16013 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/81211 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K3/3463 ,  H05K3/3494 ,  H05K2201/0379 ,  H05K2201/09427 ,  H05K2203/1121 ,  Y02P70/613 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： For a suppressed breakage after a flip chip connection of a semiconductor device using a low-permittivity insulation film and a lead-free solder together, with an enhanced production yield, bump electrodes (2) are heated by a temperature profile having, after a heating up to a melting point of the bump electrodes (2) or more, a cooling in which a temperature within a range of 190 to 210° C. is kept for an interval of time within a range of 3 to 15 minutes, and a condition is met, such that 1.4

摘要翻译： 为了在使用低介电常数绝缘膜和无铅焊料的半导体器件的倒装芯片连接之后抑制破坏，以提高的生产成本，凸起电极（2）被加热了在加热之后的温度分布 直到凸起电极（2）的熔点以上，将在190〜210℃的范围内的温度保持在3〜15分钟的范围内的时间间隔的冷却，以及条件 使得1.4

公开(公告)号：US08653651B2

公开(公告)日：2014-02-18

申请号：US13405665

申请日：2012-02-27

申请人： Masayuki Uchida ,  Takashi Togasaki ,  Satoru Hara ,  Kentaro Suga

发明人： Masayuki Uchida ,  Takashi Togasaki ,  Satoru Hara ,  Kentaro Suga

IPC分类号： H01L23/34

CPC分类号： H01L23/367 ,  H01L23/42 ,  H01L23/492 ,  H01L24/26 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/26165 ,  H01L2224/26175 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/8314 ,  H01L2224/83815 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/351 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： According to one embodiment, a semiconductor apparatus includes a semiconductor device, a heat spreader, a regulating unit, a containing unit, and a holding unit. The heat spreader is bonded to the semiconductor device with an interposed solder layer. The regulating unit is configured to regulate a dimension between the semiconductor device and the heat spreader. The containing unit is configured to contain melted solder in an interior of the containing unit. The holding unit is configured to allow melted solder held in an interior of the holding unit. The holding unit is configured to replenish the melted solder in the case where an amount of the melted solder contained in the containing unit is insufficient. The holding unit is configured to recover the melted solder in the case where the amount of the melted solder contained in the containing unit is excessive.

摘要翻译： 根据一个实施例，半导体装置包括半导体器件，散热器，调节单元，容纳单元和保持单元。 散热器通过插入的焊料层与半导体器件接合。 调节单元构造成调节半导体器件和散热器之间的尺寸。 容纳单元构造成在容纳单元的内部容纳熔融的焊料。 保持单元被配置为允许保持在保持单元的内部的熔融焊料。 保持单元构造为在容纳单元中所含的熔融焊料的量不足的情况下补充熔融的焊料。 保持单元被配置为在容纳单元中包含的熔融焊料的量过多的情况下回收熔融的焊料。

公开(公告)号：US20110024901A1

公开(公告)日：2011-02-03

申请号：US12845937

申请日：2010-07-29

申请人： Soichi Yamashita ,  Tatsuo Migita ,  Tadashi Iijima ,  Masahiro Miyata ,  Masayuki Uchida ,  Takashi Togasaki ,  Hirokazu Ezawa

发明人： Soichi Yamashita ,  Tatsuo Migita ,  Tadashi Iijima ,  Masahiro Miyata ,  Masayuki Uchida ,  Takashi Togasaki ,  Hirokazu Ezawa

IPC分类号： H01L23/52 ,  H01L21/283

CPC分类号： H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/02311 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05008 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/05666 ,  H01L2224/0603 ,  H01L2224/06051 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16145 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48666 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/81191 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to one embodiment, a manufacturing method of a semiconductor device attained as follows. A dielectric layer having a first opening and a second opening reaching an electrode terminal is formed by modifying a photosensitive resin film on a substrate on which the electrode terminal of a first conductive layer is provided. Next, a second conductive layer that is electrically connected to the electrode terminal is formed on the dielectric layer that includes inside of the first opening, and a third conductive layer that has an oxidation-reduction potential of which difference from the oxidation-reduction potential of the first conductive layer is smaller than a difference of the oxidation-reduction potential between the first conductive layer and the second conductive layer is formed on the second conductive layer. Next, a dielectric layer having a third opening reaching the third conductive layer and a fourth opening reaching the electrode terminal via the second opening is formed by modifying a photosensitive resin film, and a bump that is electrically connected to the third conductive layer is formed.

摘要翻译： 根据一个实施例，半导体器件的制造方法如下。 通过改变在其上设置有第一导电层的电极端子的基板上的感光性树脂膜，形成具有第一开口和到达电极端子的第二开口的电介质层。 接下来，在包括第一开口的内部的电介质层上形成与电极端子电连接的第二导电层，以及具有与氧化还原电位不同的氧化还原电位的第三导电层 第一导电层小于在第二导电层上形成第一导电层和第二导电层之间的氧化还原电位的差异。 接下来，通过改变感光性树脂膜形成具有到达第三导电层的第三开口的电介质层和通过第二开口到达电极端子的第四开口，并且形成与第三导电层电连接的凸块。

公开(公告)号：US08314491B2

公开(公告)日：2012-11-20

申请号：US12845937

申请日：2010-07-29

申请人： Soichi Yamashita ,  Tatsuo Migita ,  Tadashi Iijima ,  Masahiro Miyata ,  Masayuki Uchida ,  Takashi Togasaki ,  Hirokazu Ezawa

发明人： Soichi Yamashita ,  Tatsuo Migita ,  Tadashi Iijima ,  Masahiro Miyata ,  Masayuki Uchida ,  Takashi Togasaki ,  Hirokazu Ezawa

IPC分类号： H01L23/48

CPC分类号： H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/02311 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05008 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/05666 ,  H01L2224/0603 ,  H01L2224/06051 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16145 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48666 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/81191 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to one embodiment, a manufacturing method of a semiconductor device attained as follows. A dielectric layer having a first opening and a second opening reaching an electrode terminal is formed by modifying a photosensitive resin film on a substrate on which the electrode terminal of a first conductive layer is provided. Next, a second conductive layer that is electrically connected to the electrode terminal is formed on the dielectric layer that includes inside of the first opening, and a third conductive layer that has an oxidation-reduction potential of which difference from the oxidation-reduction potential of the first conductive layer is smaller than a difference of the oxidation-reduction potential between the first conductive layer and the second conductive layer is formed on the second conductive layer. Next, a dielectric layer having a third opening reaching the third conductive layer and a fourth opening reaching the electrode terminal via the second opening is formed by modifying a photosensitive resin film, and a bump that is electrically connected to the third conductive layer is formed.

摘要翻译： 根据一个实施例，半导体器件的制造方法如下。 通过改变在其上设置有第一导电层的电极端子的基板上的感光性树脂膜，形成具有第一开口和到达电极端子的第二开口的电介质层。 接下来，在包括第一开口的内部的电介质层上形成与电极端子电连接的第二导电层，以及具有与氧化还原电位不同的氧化还原电位的第三导电层 第一导电层小于在第二导电层上形成第一导电层和第二导电层之间的氧化还原电位的差异。 接下来，通过改变感光性树脂膜形成具有到达第三导电层的第三开口的电介质层和通过第二开口到达电极端子的第四开口，并且形成与第三导电层电连接的凸块。

公开(公告)号：US09284445B2

公开(公告)日：2016-03-15

申请号：US14123801

申请日：2012-06-22

申请人： Masayuki Uchida ,  Katsuhiro Kojima ,  Shinji Makino ,  Yusuke Nakai ,  Satoru Ozawa ,  Haruo Unno ,  Isao Yamamoto ,  Takayuki Fukui

发明人： Masayuki Uchida ,  Katsuhiro Kojima ,  Shinji Makino ,  Yusuke Nakai ,  Satoru Ozawa ,  Haruo Unno ,  Isao Yamamoto ,  Takayuki Fukui

IPC分类号： G02B1/12 ,  C08L33/14 ,  C08F220/28 ,  G02B1/04 ,  G02B1/118 ,  C08F290/06 ,  G03F7/027

CPC分类号： C08L33/14 ,  C08F220/28 ,  C08F290/062 ,  G02B1/04 ,  G02B1/118 ,  G02B1/12 ,  G03F7/027 ,  Y10T428/24355 ,  C08L71/02 ,  C08L83/04 ,  C08L33/08 ,  C08F222/10 ,  C08F220/10

摘要： The present invention relates to a resin composition for a nano concave-convex structure, including 0.01 to 10 parts by mass of an active energy ray polymerization initiator (D), 0.01 to 3 parts by mass of a release agent (E), and 0.01 to 3 parts by mass of a lubricant (F), relative to 100 parts by mass of a polymerization reactive monomer component containing 50 to 95 parts by mass of a tetrafunctional (meth)acrylate monomer (A), 5 to 35 parts by mass of a difunctional (meth)acrylate monomer (B) in which the total number of repeating units within a polyalkylene glycol structure is from 4 to 25, and not more than 15 parts by mass of a monofunctional (meth)acrylate monomer (C) which is copolymerizable with the monomers (A) and (B), and relates to a transparent member for the monitor of a vehicle navigation device and the cover of a vehicle meter.

摘要翻译： 本发明涉及一种纳米凹凸结构用树脂组合物，其含有0.01〜10质量份的活性能量射线聚合引发剂（D），0.01〜3质量份的脱模剂（E），0.01 相对于100质量份含有50〜95质量份的四官能（甲基）丙烯酸酯单体（A）的聚合反应性单体成分，相对于3质量份的润滑剂（F）为5质量份， 聚亚烷基二醇结构中的重复单元总数为4〜25，双官能（甲基）丙烯酸酯单体（C）为15质量份以下的双官能（甲基）丙烯酸酯单体（B） 可与单体（A）和（B）共聚，涉及用于车辆导航装置的监视器和车辆仪表的盖的透明构件。

公开(公告)号：US08402485B2

公开(公告)日：2013-03-19

申请号：US12588698

申请日：2009-10-23

申请人： Hidenori Takai ,  Masayuki Uchida

发明人： Hidenori Takai ,  Masayuki Uchida

IPC分类号： H04N7/173 ,  H04N7/16

CPC分类号： H04N21/23424 ,  H04N21/23106 ,  H04N21/812

摘要： A VOD server refers to advertisement delivery information, and inserts a stream of advertising content in a stream of video content of a main part, based on advertisement inserting position information indicating an inserting position of the advertising content to be inserted into the video content of the main part, for delivery to a client terminal. When making this delivery, at least time information, such as time management information of reproduced output or decoding, to be added to the stream of the video content of the main part and the stream of the advertising content to be delivered to the client terminal, is replaced by time information in accordance with an order of the streams to be delivered to the client terminal.

摘要翻译： VOD服务器是指广告传递信息，并且基于广告插入位置信息将广告内容流插入到主要部分的视频内容流中，该广告插入位置信息指示要插入的广告内容的插入位置 主要部分，用于交付给客户端。 在进行这种传送时，至少要添加到主要部分的视频内容的流和要传送给客户终端的广告内容的流中的诸如再现的输出或解码的时间管理信息的时间信息， 根据要传送到客户终端的流的顺序由时间信息代替。

公开(公告)号：US08241684B2

公开(公告)日：2012-08-14

申请号：US13170771

申请日：2011-06-28

申请人： Masayuki Uchida ,  Seiko Narushima ,  Keiko Morikubo

发明人： Masayuki Uchida ,  Seiko Narushima ,  Keiko Morikubo

IPC分类号： A01N63/02

CPC分类号： A61K35/74 ,  A23C21/026 ,  A23L33/135 ,  A23V2002/00 ,  A23Y2320/25 ,  A23V2200/32

摘要： The present invention relates to a preventive and/or a therapeutic agent for inflammatory bowel diseases containing a fermentation product of a propionic acid bacterium as an active ingredient.

摘要翻译： 本发明涉及含有丙酸细菌发酵产物作为活性成分的炎症性肠病的预防和/或治疗剂。

公开(公告)号：US20110070990A1

公开(公告)日：2011-03-24

申请号：US12851162

申请日：2010-08-05

申请人： Mitsugi YAMASHITA ,  Shoji Takahashi ,  Misaki Kamiya ,  Masayuki Uchida

发明人： Mitsugi YAMASHITA ,  Shoji Takahashi ,  Misaki Kamiya ,  Masayuki Uchida

IPC分类号： F16H37/12 ,  F16H57/04

CPC分类号： F16H15/42 ,  B60K6/405 ,  B60K6/48 ,  B60K6/543 ,  F16C19/364 ,  F16C35/0635 ,  F16H57/0453 ,  F16H57/0454 ,  F16H57/0491 ,  Y02T10/6221

摘要： A drive system with a case divided into two oil-tight compartments. The first compartment is filled with traction oil and accommodates a friction type continuously variable transmission (CVT) device, and a second compartment filled with lubricant oil and a gear transmission device formed from a meshing rotary transmission mechanism. The CVT device includes an input member, an output member, and a ring interposed in such a way that the ring moves in an axial direction to steplessly change speeds. An input or output member of the CVT device includes a first axial portion rotatably supported by the case, and a second axial portion supported on a second side of the partition through a bearing that provides support in a thrust and radial direction. The bearing is mounted to the partition so that an inner race of the bearing is unrotatably connected to the second-side axial portion through a rotation stopper.

摘要翻译： 一个驱动系统，其中壳体分为两个油密封隔间。 第一隔室装有牵引油，并容纳摩擦式无级变速器（CVT）装置，以及装有润滑油的第二隔室和由啮合式旋转传动机构形成的齿轮传动装置。 CVT装置包括输入构件，输出构件和插入的环，使得环沿轴向移动以无级地改变速度。 CVT装置的输入或输出构件包括由壳体可旋转地支撑的第一轴向部分和通过在推力和径向方向上提供支撑的轴承支撑在分隔件的第二侧上的第二轴向部分。 轴承安装在隔板上，使得轴承的内圈通过旋转止动件不可旋转地连接到第二侧轴向部分。

公开(公告)号：US20100265439A1

公开(公告)日：2010-10-21

申请号：US12746310

申请日：2008-12-03

申请人： Tatsuro Ishitobi ,  Hideaki Yamagata ,  Koji Arai ,  Masatoshi Oba ,  Masahiro Takahashi ,  Masayuki Uchida

发明人： Tatsuro Ishitobi ,  Hideaki Yamagata ,  Koji Arai ,  Masatoshi Oba ,  Masahiro Takahashi ,  Masayuki Uchida

IPC分类号： G02F1/1335 ,  G02F1/13

CPC分类号： G02B5/201 ,  G02B5/223 ,  G02F1/133512 ,  G02F1/133516 ,  G02F1/13394 ,  G02F2201/121

摘要： There is provided a color filter which can be manufactured by a simplified process and which will not short-circuit an electrode of a TFT substrate. The color filter includes a substrate, and a red layer, a green layer and a blue layer, formed on the substrate. When forming the green layer and the blue layer, these layers are not only formed on the substrate, but also laminated on the red layer to form a spacer comprised of the green layer and the blue layer, laminated on the red layer. The color filter further includes a transparent electrode layer which covers the substrate, the red layer, the green layer, the blue layer and the spacer, and an insulating black matrix layer formed on predetermined areas of the transparent electrode layer.

摘要翻译： 提供了可以通过简化的工艺制造并且不会使TFT基板的电极短路的滤色器。 滤色器包括在基板上形成的基板和红色层，绿色层和蓝色层。 当形成绿色层和蓝色层时，这些层不仅形成在基板上，而且层叠在红色层上以形成层叠在红色层上的由绿色层和蓝色层组成的间隔物。 滤色器还包括覆盖基板，红色层，绿色层，蓝色层和间隔物的透明电极层和形成在透明电极层的预定区域上的绝缘黑矩阵层。

公开(公告)号：US07641797B2

公开(公告)日：2010-01-05

申请号：US11665732

申请日：2005-10-21

申请人： Hiroaki Ikebe ,  Masayuki Uchida ,  Hitoshi Betchaku

发明人： Hiroaki Ikebe ,  Masayuki Uchida ,  Hitoshi Betchaku

IPC分类号： C02F3/00

CPC分类号： B01D61/18 ,  B01D61/025 ,  B01D61/147 ,  B01D61/58 ,  B01D2315/06 ,  B01D2317/025 ,  C02F1/444 ,  C02F3/1268 ,  C02F2101/30 ,  C02F2103/36 ,  C02F2103/365 ,  C02F2303/04 ,  C05F7/005 ,  C05F17/0018 ,  C05G3/0076 ,  Y02E50/343 ,  Y02P20/145 ,  Y02W10/15 ,  Y02W30/43 ,  Y02W30/47 ,  Y10S210/908

摘要： A method for treating a formaldehyde-containing waste liquid, which is formed as a byproduct in a plant for the production of hydrocarbons or oxygen-containing compounds, containing the steps of: subjecting formaldehyde in the liquid to chemical treatment; and treating the resulting waste liquid, while being aerated, by using a membrane bioreactor that is composed of a microorganism or enzyme and a separation membrane.

摘要翻译： 一种用于处理植物中用于生产烃或含氧化合物的副产物形成的含甲醛废液的方法，其包括以下步骤：使甲醛在液体中进行化学处理; 并且通过使用由微生物或酶组成的膜生物反应器和分离膜，在通气的同时处理所得废液。