公开(公告)号：US11956954B2

公开(公告)日：2024-04-09

申请号：US17092916

申请日：2020-11-09

Applicant: Micron Technology, Inc.

Inventor： Yifen Liu ,  Yan Song ,  Albert Fayrushin ,  Naiming Liu ,  Yingda Dong ,  George Matamis

IPC: H10B43/27 ,  H01L23/522 ,  H10B43/10 ,  H10B43/35 ,  H10B43/40

CPC classification number: H10B43/27 ,  H01L23/5226 ,  H10B43/10 ,  H10B43/35 ,  H10B43/40

Abstract: An electronic device comprises a stack of alternating dielectric materials and conductive materials, a pillar region extending vertically through the stack, an oxide material within the pillar region and laterally adjacent to the dielectric materials and the conductive materials of the stack, and a storage node laterally adjacent to the oxide material and within the pillar region. A charge confinement region of the storage node is in horizontal alignment with the conductive materials of the stack. A height of the charge confinement region in a vertical direction is less than a height of a respective, laterally adjacent conductive material of the stack in the vertical direction. Related methods and systems are also disclosed.

公开(公告)号：US20230209819A1

公开(公告)日：2023-06-29

申请号：US17655222

申请日：2022-03-17

Applicant: Micron Technology, Inc.

Inventor： Nancy M. Lomeli ,  Jiewei Chen ,  Naiming Liu

IPC: H01L27/11556 ,  G11C5/02 ,  H01L27/11582 ,  G11C5/06 ,  H01L23/538

CPC classification number: H01L27/11556 ,  G11C5/025 ,  H01L27/11582 ,  G11C5/06 ,  H01L23/5386

Abstract: A microelectronic device includes a stack structure including insulative structures and conductive structures vertically alternating with the insulative structures. At least one of the insulative structures includes interfacial regions proximate interfaces between the at least one of the insulative structures and two of the conductive structures vertically neighboring the at least one of the insulative structures; and an intermediate region interposed between the interfacial regions. The intermediate region has a different material composition and relatively greater strength than the interfacial regions.

公开(公告)号：US20230397424A1

公开(公告)日：2023-12-07

申请号：US18324084

申请日：2023-05-25

Applicant: Micron Technology, Inc.

Inventor： Jordan D. Greenlee ,  Everett A. McTeer ,  Rita J. Klein ,  John D. Hopkins ,  Nancy M. Lomeli ,  Xiao Li ,  Christopher R. Ritchie ,  Alyssa N. Scarbrough ,  Jiewei Chen ,  Sijia Yu ,  Naiming Liu

IPC: H10B43/27 ,  H10B41/27

CPC classification number: H10B43/27 ,  H10B41/27

Abstract: A microelectronic device comprises a stack structure, a memory pillar, and a boron-containing material. The stack structure comprises alternating conductive structures and dielectric structures. The memory pillar extends through the stack structure and defines memory cells at intersections of the memory pillar and the conductive structures. The boron-containing material is on at least a portion of the conductive structures of the stack structure. Related methods and electronic systems are also described.

公开(公告)号：US20220149068A1

公开(公告)日：2022-05-12

申请号：US17092916

申请日：2020-11-09

Applicant: Micron Technology, Inc.

Inventor： Yifen Liu ,  Yan Song ,  Albert Fayrushin ,  Naiming Liu ,  Yingda Dong ,  George Matamis

IPC: H01L27/11582 ,  H01L27/11565 ,  H01L27/1157 ,  H01L27/11573 ,  H01L23/522

Abstract: An electronic device comprises a stack of alternating dielectric materials and conductive materials, a pillar region extending vertically through the stack, an oxide material within the pillar region and laterally adjacent to the dielectric materials and the conductive materials of the stack, and a storage node laterally adjacent to the oxide material and within the pillar region. A charge confinement region of the storage node is in horizontal alignment with the conductive materials of the stack. A height of the charge confinement region in a vertical direction is less than a height of a respective, laterally adjacent conductive material of the stack in the vertical direction. Related methods and systems are also disclosed.

公开(公告)号：US20230387229A1

公开(公告)日：2023-11-30

申请号：US17804530

申请日：2022-05-27

Applicant: Micron Technology, Inc.

Inventor： Everett A. McTeer ,  Farrell M. Good ,  John M. Meldrim ,  Jordan D. Greenlee ,  Justin D. Shepherdson ,  Naiming Liu ,  Yifen Liu

IPC: H01L29/423 ,  H01L21/28 ,  H01L27/11582

CPC classification number: H01L29/4234 ,  H01L29/40117 ,  H01L27/11582

Abstract: A microelectronic device comprises conductive structures and insulative structures vertically alternating with the conductive structures. At least one of the insulative structures includes interfacial regions extending inward from vertical boundaries of the at least one of the insulative structures, and central region vertically interposed between the interfacial regions. The interfacial regions are doped with one or more of carbon and boron. The insulative structures comprise a lower concentration of the one or more of carbon and boron than the interfacial regions. Additional microelectronic devices, electronic systems, and methods are also described.

公开(公告)号：US20230164985A1

公开(公告)日：2023-05-25

申请号：US17533580

申请日：2021-11-23

Applicant: Micron Technology, Inc.

Inventor： Jordan D. Greenlee ,  Allen McTeer ,  Rita J. Klein ,  John D. Hopkins ,  Nancy M. Lomeli ,  Xiao Li ,  Alyssa N. Scarbrough ,  Jiewei Chen ,  Naiming Liu ,  Shuangqiang Luo ,  Silvia Borsari ,  John Mark Meldrim ,  Shen Hu

IPC: H01L27/11556 ,  H01L27/11524 ,  H01L27/1157 ,  H01L27/11582

CPC classification number: H01L27/11556 ,  H01L27/11524 ,  H01L27/1157 ,  H01L27/11582

Abstract: A memory array comprising strings of memory cells comprises laterally-spaced memory blocks individually comprising a vertical stack comprising alternating insulative tiers and conductive tiers. Strings of memory cells comprise channel-material strings that extend through the insulative tiers and the conductive tiers in the memory blocks. A through-array-via (TAV) region comprises TAV constructions that extend through the insulative tiers and the conductive tiers. The TAV constructions individually comprise a radially-outer insulative lining and a conductive core radially-inward of the insulative lining. The insulative lining comprises a radially-inner insulative material and a radially-outer insulative material that are of different compositions relative one another. The radially-outer insulative material is in radially-outer recesses that are in the first tiers as compared to the second tiers. The radially-inner insulative material extends elevationally along the insulative tiers and the conductive tiers. Other embodiments, including method, are disclosed.

公开(公告)号：US20240244845A1

公开(公告)日：2024-07-18

申请号：US18622671

申请日：2024-03-29

Applicant: Micron Technology, Inc.

Inventor： Yifen Liu ,  Yan Song ,  Albert Fayrushin ,  Naiming Liu ,  Yingda Dong ,  George Matamis

IPC: H10B43/27 ,  H01L23/522 ,  H10B43/10 ,  H10B43/35 ,  H10B43/40

CPC classification number: H10B43/27 ,  H01L23/5226 ,  H10B43/10 ,  H10B43/35 ,  H10B43/40

Abstract: An electronic device comprises a stack of alternating dielectric materials and conductive materials, a pillar region extending vertically through the stack, an oxide material within the pillar region and laterally adjacent to the dielectric materials and the conductive materials of the stack, and a storage node laterally adjacent to the oxide material and within the pillar region. A charge confinement region of the storage node is in horizontal alignment with the conductive materials of the stack. A height of the charge confinement region in a vertical direction is less than a height of a respective, laterally adjacent conductive material of the stack in the vertical direction. Related methods and systems are also disclosed.

公开(公告)号：US20240215246A1

公开(公告)日：2024-06-27

申请号：US18596580

申请日：2024-03-05

Applicant: Micron Technology, Inc.

Inventor： Swapnil A. Lengade ,  Jeremy Adams ,  Naiming Liu ,  Jeslin J. Wu ,  Kadir Abdul ,  Carlo Mendoza Orofeo

IPC: H10B43/27 ,  H01L21/02 ,  H10B41/27

CPC classification number: H10B43/27 ,  H01L21/0217 ,  H01L21/02266 ,  H01L21/02274 ,  H10B41/27

Abstract: A method of forming a microelectronic device comprises forming a stack structure comprising a vertically alternating sequence of insulative structures and additional insulative structures, at least some of the additional insulative structures comprising silicon nitride having a ratio of nitrogen atoms to silicon atoms greater than about 1.58:1.00, forming openings through the stack structure, and forming cell pillar structures within the openings, the cell pillar structures individually comprising a semiconductor channel material vertically extending through the stack structure. Related methods, microelectronic devices, memory devices, and electronic systems are also described.

公开(公告)号：US12295140B2

公开(公告)日：2025-05-06

申请号：US17533580

申请日：2021-11-23

Applicant: Micron Technology, Inc.

Inventor： Jordan D. Greenlee ,  Allen McTeer ,  Rita J. Klein ,  John D. Hopkins ,  Nancy M. Lomeli ,  Xiao Li ,  Alyssa N. Scarbrough ,  Jiewei Chen ,  Naiming Liu ,  Shuangqiang Luo ,  Silvia Borsari ,  John Mark Meldrim ,  Shen Hu

IPC: H10B41/27 ,  H10B41/35 ,  H10B43/27 ,  H10B43/35

Abstract: A memory array comprising strings of memory cells comprises laterally-spaced memory blocks individually comprising a vertical stack comprising alternating insulative tiers and conductive tiers. Strings of memory cells comprise channel-material strings that extend through the insulative tiers and the conductive tiers in the memory blocks. A through-array-via (TAV) region comprises TAV constructions that extend through the insulative tiers and the conductive tiers. The TAV constructions individually comprise a radially-outer insulative lining and a conductive core radially-inward of the insulative lining. The insulative lining comprises a radially-inner insulative material and a radially-outer insulative material that are of different compositions relative one another. The radially-outer insulative material is in radially-outer recesses that are in the first tiers as compared to the second tiers. The radially-inner insulative material extends elevationally along the insulative tiers and the conductive tiers. Other embodiments, including method, are disclosed.

公开(公告)号：US12004346B2

公开(公告)日：2024-06-04

申请号：US17200169

申请日：2021-03-12

Applicant: Micron Technology, Inc.

Inventor： Swapnil Lengade ,  Jeremy Adams ,  Naiming Liu ,  Jeslin J. Wu ,  Kadir Abdul ,  Carlo Mendoza Orofeo

IPC: H10B43/27 ,  H01L21/02 ,  H10B41/27

CPC classification number: H10B43/27 ,  H01L21/0217 ,  H01L21/02266 ,  H01L21/02274 ,  H10B41/27

Abstract: A method of forming a microelectronic device comprises forming a stack structure comprising a vertically alternating sequence of insulative structures and additional insulative structures, at least some of the additional insulative structures comprising silicon nitride having a ratio of nitrogen atoms to silicon atoms greater than about 1.58:1.00, forming openings through the stack structure, and forming cell pillar structures within the openings, the cell pillar structures individually comprising a semiconductor channel material vertically extending through the stack structure. Related methods, microelectronic devices, memory devices, and electronic systems are also described.