公开(公告)号：US20110061907A1

公开(公告)日：2011-03-17

申请号：US12654538

申请日：2009-12-22

Applicant: Myung Sam Kang ,  Chang Sup Ryu

Inventor： Myung Sam Kang ,  Chang Sup Ryu

IPC: H05K1/09 ,  H05K1/11 ,  C25D5/02 ,  B32B38/00

CPC classification number: C25D5/022 ,  C25D7/12 ,  H05K3/0035 ,  H05K3/242 ,  H05K3/243 ,  H05K3/3473 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2203/054 ,  H05K2203/0577 ,  H05K2203/1581

Abstract: A printed circuit board according to an aspect of the invention may include: a board portion having an electrode portion provided on a surface thereof; a solder resist layer provided on the surface of the board portion and having an opening therein to expose the electrode portion to the outside; and a bump layer having the same diameter as the opening and providing an electrical connection with an external chip component.

Abstract translation: 根据本发明的一个方面的印刷电路板可以包括：具有设置在其表面上的电极部分的板部分; 阻焊层，设置在基板部分的表面上，并且在其中具有开口以将电极部分暴露于外部; 以及具有与开口相同直径并且提供与外部芯片部件的电连接的凸块层。

公开(公告)号：US20100024212A1

公开(公告)日：2010-02-04

申请号：US12588259

申请日：2009-10-08

Applicant: Shuhichi Okabe ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Myung Sam Kang ,  Jung Hyun Park ,  Ji Hong Jo ,  Jin Yong An ,  Soon Oh Jung

Inventor： Shuhichi Okabe ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Myung Sam Kang ,  Jung Hyun Park ,  Ji Hong Jo ,  Jin Yong An ,  Soon Oh Jung

IPC: H05K3/06 ,  H05K3/36 ,  H05K3/42

CPC classification number: H05K3/205 ,  H05K3/062 ,  H05K3/108 ,  H05K3/462 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2203/0369 ,  H05K2203/061 ,  H05K2203/0733 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey.

Abstract translation: 一种制造多层印刷电路板的方法，其能够形成能够通过使用CTE的半添加工艺和难以传送的薄基板上的金属载体的刚性来实现的微电路。

公开(公告)号：US07707715B2

公开(公告)日：2010-05-04

申请号：US12005610

申请日：2007-12-28

Applicant: Shuhichi Okabe ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Myung Sam Kang ,  Jung Hyun Park ,  Ji Hong Jo ,  Jin Yong An ,  Soon Oh Jung

Inventor： Shuhichi Okabe ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Myung Sam Kang ,  Jung Hyun Park ,  Ji Hong Jo ,  Jin Yong An ,  Soon Oh Jung

IPC: H05K3/00

CPC classification number: H05K3/205 ,  H05K3/062 ,  H05K3/108 ,  H05K3/462 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2203/0369 ,  H05K2203/061 ,  H05K2203/0733 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: Disclosed is a method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey.

Abstract translation: 公开了一种制造多层印刷电路板的方法，其能够形成能够通过使用CTE的半添加工艺和难以传送的薄基板上的金属载体的刚性来实现的微电路。

公开(公告)号：US07583512B2

公开(公告)日：2009-09-01

申请号：US12023616

申请日：2008-01-31

Applicant: Chang Sup Ryu ,  Myung Sam Kang

Inventor： Chang Sup Ryu ,  Myung Sam Kang

IPC: H05K1/16

CPC classification number: H05K1/185 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/49101 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: Disclosed is a PCB including an embedded passive component and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one insulating layer is interposed between the circuit layers. A pair of terminals is vertically formed through the insulating layers, plated with a first conductive material, and separated from each other by a predetermined distance. The embedded passive component is interposed between the terminals and has electrodes formed on both sides thereof. The electrodes are separated from the terminals by a predetermined distance and electrically connected to the terminals through a second conductive material.

Abstract translation: 公开了一种包括嵌入式无源元件的PCB及其制造方法。 PCB包括形成电路图案的至少两个电路层。 在电路层之间插入至少一个绝缘层。 一对端子通过绝缘层垂直地形成，镀有第一导电材料，并且彼此分开预定距离。 嵌入式无源部件插入在端子之间，并且具有形成在其两侧的电极。 电极与端子分开预定距离，并通过第二导电材料与端子电连接。

公开(公告)号：US20090056119A1

公开(公告)日：2009-03-05

申请号：US12005610

申请日：2007-12-28

Applicant: Shuhichi Okabe ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Myung Sam Kang ,  Jung Hyun Park ,  Ji Hong Jo ,  Jin Yong An ,  Soon Oh Jung

Inventor： Shuhichi Okabe ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Myung Sam Kang ,  Jung Hyun Park ,  Ji Hong Jo ,  Jin Yong An ,  Soon Oh Jung

IPC: H05K3/00

CPC classification number: H05K3/205 ,  H05K3/062 ,  H05K3/108 ,  H05K3/462 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2203/0369 ,  H05K2203/061 ,  H05K2203/0733 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: Disclosed is a method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey.

Abstract translation: 公开了一种制造多层印刷电路板的方法，其能够形成能够通过使用CTE的半添加工艺和难以传送的薄基板上的金属载体的刚性来实现的微电路。

公开(公告)号：US07485569B2

公开(公告)日：2009-02-03

申请号：US11137345

申请日：2005-05-24

Applicant: Chang Sup Ryu ,  Doo Hwan Lee ,  Jin Yong Ahn ,  Myung Sam Kang ,  Suk Hyeon Cho

Inventor： Chang Sup Ryu ,  Doo Hwan Lee ,  Jin Yong Ahn ,  Myung Sam Kang ,  Suk Hyeon Cho

IPC: H01L21/4763

CPC classification number: H01L23/5389 ,  H01L25/0655 ,  H01L25/16 ,  H01L2224/82039 ,  H01L2924/01078 ,  H01L2924/01087 ,  H05K1/186 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/09563 ,  H05K2201/10674 ,  H05K2203/0191

Abstract: A printed circuit board having embedded chips, composed of a central layer having an embedded chip, an insulating layer formed on one surface or both surfaces of the central layer and having a via hole filled with conductive ink, and a circuit layer formed on the insulating layer and having a via hole and a circuit pattern electrically connected to the chip of the central layer through the via hole of the insulating layer. In addition, a method of fabricating a printed circuit board including embedded chips is provided.

Abstract translation: 一种具有嵌入式芯片的印刷电路板，由具有嵌入式芯片的中心层，形成在中心层的一个表面或两个表面上的绝缘层，并且具有填充有导电油墨的通孔，以及形成在绝缘体上的电路层 并且具有通孔和通过绝缘层的通孔与中心层的芯片电连接的电路图案。 此外，提供了一种制造包括嵌入式芯片的印刷电路板的方法。

公开(公告)号：US20080264684A1

公开(公告)日：2008-10-30

申请号：US12003669

申请日：2007-12-28

Applicant: Myung Sam Kang ,  Byoung Youl Min ,  Je Gwang Yoo ,  Jung Hyun Park ,  Chang Sup Ryu ,  Jin Yong Ahn

Inventor： Myung Sam Kang ,  Byoung Youl Min ,  Je Gwang Yoo ,  Jung Hyun Park ,  Chang Sup Ryu ,  Jin Yong Ahn

IPC: H05K3/10 ,  H05K1/00 ,  H05K1/11

CPC classification number: H05K3/428 ,  H05K3/205 ,  H05K3/383 ,  H05K3/384 ,  H05K3/4602 ,  H05K3/4658 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/1536 ,  Y10T29/49155

Abstract: Disclosed herein is a carrier member for transmitting circuits, which is a component of a coreless printed circuit board having circuit patterns embedded therein, and which can be used to provide a high-density and highly reliable printed circuit board by forming protrusions only on the lower ends of the circuit patterns, a coreless printed circuit board using the carrier member, and methods of manufacturing the carrier member and the coreless printed circuit board.

Abstract translation: 本文公开了一种用于传输电路的载体构件，其是具有嵌入其中的电路图案的无芯印刷电路板的部件，其可用于通过仅在下部形成突起来提供高密度和高可靠性的印刷电路板 电路图案的端部，使用载体部件的无芯印刷电路板，以及制造载体部件和无芯印刷电路板的方法。

公开(公告)号：US07277005B2

公开(公告)日：2007-10-02

申请号：US11022074

申请日：2004-12-22

Applicant: Myung Sam Kang ,  Chang Sup Ryu ,  Jong Kuk Hong

Inventor： Myung Sam Kang ,  Chang Sup Ryu ,  Jong Kuk Hong

IPC: H01C1/012

CPC classification number: H01C7/003 ,  H01C17/065 ,  H01C17/0652 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/167 ,  H05K3/0047 ,  H05K3/005 ,  H05K3/4069 ,  H05K3/42 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/09509 ,  H05K2201/09645 ,  H05K2203/1476

Abstract: Disclosed is a PCB including an embedded resistor and a method of fabricating the same. The PCB includes a plurality of circuit layers in which circuit patterns are formed. A plurality of insulating layers is each interposed between the circuit layers. The embedded resistor is made of a resistive material and received in a receiving hole formed in the plurality of circuit layers and the plurality of insulating layers such that walls defining the receiving hole extends from one of the circuit layers to another circuit layer. The receiving hole has a closed section, and a conductive material is plated on the opposite walls of the walls defining the receiving hole.

Abstract translation: 公开了一种包括嵌入式电阻器的PCB及其制造方法。 PCB包括形成电路图案的多个电路层。 在电路层之间分别插入多个绝缘层。 嵌入式电阻器由电阻材料制成并且被容纳在形成在多个电路层和多个绝缘层中的接收孔中，使得限定接收孔的壁从电路层之一延伸到另一个电路层。 接收孔具有闭合部分，并且导电材料被电镀在限定接收孔的壁的相对壁上。

公开(公告)号：US20120073865A1

公开(公告)日：2012-03-29

申请号：US13311058

申请日：2011-12-05

Applicant: Myung Sam Kang ,  Byoung Youl Min ,  Je Gwang Yoo ,  Jung Hyun Park ,  Chang Sup Ryu ,  Jin Yong Ahn

Inventor： Myung Sam Kang ,  Byoung Youl Min ,  Je Gwang Yoo ,  Jung Hyun Park ,  Chang Sup Ryu ,  Jin Yong Ahn

IPC: H05K1/09 ,  H05K1/00

CPC classification number: H05K3/428 ,  H05K3/205 ,  H05K3/383 ,  H05K3/384 ,  H05K3/4602 ,  H05K3/4658 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/1536 ,  Y10T29/49155

Abstract: A carrier member for transmitting circuits, which is a component of a coreless printed circuit board having circuit patterns embedded therein, and which can be used to provide a high-density and highly reliable printed circuit board by forming protrusions only on the lower ends of the circuit patterns, a coreless printed circuit board using the carrier member, and methods of manufacturing the carrier member and the coreless printed circuit board.

Abstract translation: 用于发送电路的载体构件，其是具有嵌入其中的电路图案的无芯型印刷电路板的部件，并且其可用于通过仅在其下端形成突起来提供高密度和高可靠性的印刷电路板 电路图案，使用承载构件的无芯印刷电路板，以及制造载体构件和无芯非印刷电路板的方法。

公开(公告)号：US20080123308A1

公开(公告)日：2008-05-29

申请号：US12023616

申请日：2008-01-31

Applicant: Chang Sup Ryu ,  Myung Sam Kang

Inventor： Chang Sup Ryu ,  Myung Sam Kang

IPC: H05K7/06

CPC classification number: H05K1/185 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/49101 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: Disclosed is a PCB including an embedded passive component and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one insulating layer is interposed between the circuit layers. A pair of terminals is vertically formed through the insulating layers, plated with a first conductive material, and separated from each other by a predetermined distance. The embedded passive component is interposed between the terminals and has electrodes formed on both sides thereof. The electrodes are separated from the terminals by a predetermined distance and electrically connected to the terminals through a second conductive material.

Abstract translation: 公开了一种包括嵌入式无源元件的PCB及其制造方法。 PCB包括形成电路图案的至少两个电路层。 在电路层之间插入至少一个绝缘层。 一对端子通过绝缘层垂直地形成，电镀有第一导电材料，并且彼此分开预定距离。 嵌入式无源部件插入在端子之间，并且具有形成在其两侧的电极。 电极与端子分开预定距离，并通过第二导电材料与端子电连接。