公开(公告)号：US20100006888A1

公开(公告)日：2010-01-14

申请号：US12498482

申请日：2009-07-07

申请人： Naotake WATANABE ,  Izuru Komatsu ,  Kazuo Shimokawa ,  Hisashi Ito

发明人： Naotake WATANABE ,  Izuru Komatsu ,  Kazuo Shimokawa ,  Hisashi Ito

IPC分类号： H01L33/00 ,  H01L21/56

CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

摘要： Provided is a method of manufacturing an optical semiconductor device, the method including: providing a resin layer on a light-emitting substrate to cover a principle surface of the light-emitting substrate, the light-emitting substrate including a pair of electrodes in each section of the principle surface, the resin layer including multiple holes each exposing two of the electrodes located adjacent to each other but in the different sections; providing post electrodes respectively on all the paired electrodes formed in all the sections by filling a conductive material in the holes of the resin layer on the principal surface; and forming multiple optical semiconductor devices by cutting the light-emitting substrate into sections, the light-emitting substrate provided with the post electrodes respectively on all the paired electrodes formed in all the sections.

摘要翻译： 提供一种制造光半导体器件的方法，该方法包括：在发光基板上设置树脂层以覆盖发光基板的主表面，所述发光基板在每个部分中包括一对电极 所述树脂层包括多个孔，每个孔暴露位于彼此相邻但在不同部分中的两个电极; 通过在主表面上的树脂层的孔中填充导电材料，分别在所有部分形成的所有成对电极上分别提供柱状电极; 并且通过将发光基板切割成多个部分形成多个光学半导体器件，分别在所有部分上形成的所有成对电极上设置有柱状电极的发光基板。

公开(公告)号：US08241937B2

公开(公告)日：2012-08-14

申请号：US13221634

申请日：2011-08-30

申请人： Akihiko Happoya ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

发明人： Akihiko Happoya ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

IPC分类号： H01L21/00

CPC分类号： H01L33/62 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An optical semiconductor device includes a light emitting element having a first surface and a second surface, the first surface having a first electrode provided thereon, the second surface being located on the opposite side from the first surface and having a second electrode provided thereon; a first conductive member connected to the first surface; a second conductive member connected to the second surface; a first external electrode connected to the first conductive member; a second external electrode connected to the second conductive member; and an enclosure sealing the light emitting element, the first conductive member, and the second conductive member between the first external electrode and the second external electrode, and being configured to transmit light emitted from the light emitting element.

摘要翻译： 光学半导体器件包括具有第一表面和第二表面的发光元件，所述第一表面具有设置在其上的第一电极，所述第二表面位于与所述第一表面相对的一侧，并且具有设置在其上的第二电极; 连接到第一表面的第一导电构件; 连接到第二表面的第二导电构件; 连接到第一导电构件的第一外部电极; 连接到第二导电构件的第二外部电极; 以及将所述发光元件，所述第一导电构件和所述第二导电构件密封在所述第一外部电极和所述第二外部电极之间并且被配置为透射从所述发光元件发射的光的外壳。

公开(公告)号：US08039857B2

公开(公告)日：2011-10-18

申请号：US12552504

申请日：2009-09-02

申请人： Akihiko Happoya ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

发明人： Akihiko Happoya ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An optical semiconductor device includes a light emitting element having a first surface and a second surface, the first surface having a first electrode provided thereon, the second surface being located on the opposite side from the first surface and having a second electrode provided thereon; a first conductive member connected to the first surface; a second conductive member connected to the second surface; a first external electrode connected to the first conductive member; a second external electrode connected to the second conductive member; and an enclosure sealing the light emitting element, the first conductive member, and the second conductive member between the first external electrode and the second external electrode, and being configured to transmit light emitted from the light emitting element.

摘要翻译： 光学半导体器件包括具有第一表面和第二表面的发光元件，所述第一表面具有设置在其上的第一电极，所述第二表面位于与所述第一表面相对的一侧，并且具有设置在其上的第二电极; 连接到第一表面的第一导电构件; 连接到第二表面的第二导电构件; 连接到第一导电构件的第一外部电极; 连接到第二导电构件的第二外部电极; 以及将所述发光元件，所述第一导电构件和所述第二导电构件密封在所述第一外部电极和所述第二外部电极之间并且被配置为透射从所述发光元件发射的光的外壳。

公开(公告)号：US20100140639A1

公开(公告)日：2010-06-10

申请号：US12552504

申请日：2009-09-02

申请人： Akihiko HAPPOYA ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

发明人： Akihiko HAPPOYA ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An optical semiconductor device includes a light emitting element having a first surface and a second surface, the first surface having a first electrode provided thereon, the second surface being located on the opposite side from the first surface and having a second electrode provided thereon; a first conductive member connected to the first surface; a second conductive member connected to the second surface; a first external electrode connected to the first conductive member; a second external electrode connected to the second conductive member; and an enclosure sealing the light emitting element, the first conductive member, and the second conductive member between the first external electrode and the second external electrode, and being configured to transmit light emitted from the light emitting element.

摘要翻译： 光学半导体器件包括具有第一表面和第二表面的发光元件，所述第一表面具有设置在其上的第一电极，所述第二表面位于与所述第一表面相对的一侧，并且具有设置在其上的第二电极; 连接到第一表面的第一导电构件; 连接到第二表面的第二导电构件; 连接到第一导电构件的第一外部电极; 连接到第二导电构件的第二外部电极; 以及将发光元件，第一导电构件和第二导电构件密封在第一外部电极和第二外部电极之间并且被配置为透射从发光元件发射的光的外壳。

公开(公告)号：US20110312110A1

公开(公告)日：2011-12-22

申请号：US13221634

申请日：2011-08-30

申请人： Akihiko HAPPOYA ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

发明人： Akihiko HAPPOYA ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

IPC分类号： H01L33/52

CPC分类号： H01L33/62 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An optical semiconductor device includes a light emitting element having a first surface and a second surface, the first surface having a first electrode provided thereon, the second surface being located on the opposite side from the first surface and having a second electrode provided thereon; a first conductive member connected to the first surface; a second conductive member connected to the second surface; a first external electrode connected to the first conductive member; a second external electrode connected to the second conductive member; and an enclosure sealing the light emitting element, the first conductive member, and the second conductive member between the first external electrode and the second external electrode, and being configured to transmit light emitted from the light emitting element.

摘要翻译： 光学半导体器件包括具有第一表面和第二表面的发光元件，所述第一表面具有设置在其上的第一电极，所述第二表面位于与所述第一表面相对的一侧，并且具有设置在其上的第二电极; 连接到第一表面的第一导电构件; 连接到第二表面的第二导电构件; 连接到第一导电构件的第一外部电极; 连接到第二导电构件的第二外部电极; 以及将所述发光元件，所述第一导电构件和所述第二导电构件密封在所述第一外部电极和所述第二外部电极之间并且被配置为透射从所述发光元件发射的光的外壳。

公开(公告)号：US20060067853A1

公开(公告)日：2006-03-30

申请号：US11222808

申请日：2005-09-12

申请人： Toshihide Takahashi ,  Kazutaka Matsumoto ,  Izuru Komatsu ,  Masahiro Tadauchi ,  Yoshiyuki Fukuda

发明人： Toshihide Takahashi ,  Kazutaka Matsumoto ,  Izuru Komatsu ,  Masahiro Tadauchi ,  Yoshiyuki Fukuda

IPC分类号： C22C13/00

CPC分类号： B23K35/262

摘要： A lead-free solder comprises tin and zinc at a weight ratio between tin and zinc ranging from about 88:12 to about 80:20 on the basis of total weight of the lead-free solder.

摘要翻译： 基于无铅焊料的总重量，无铅焊料包含锡和锌之间的锡和锌的重量比约为88:12至约80:20。

公开(公告)号：US20070221712A1

公开(公告)日：2007-09-27

申请号：US11756714

申请日：2007-06-01

申请人： Kazutaka MATSUMOTO ,  Masahiro Tadauchi ,  Izuru Komatsu

发明人： Kazutaka MATSUMOTO ,  Masahiro Tadauchi ,  Izuru Komatsu

IPC分类号： B23K31/00

CPC分类号： H05K3/3484 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K35/36 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3618 ,  B23K2101/40 ,  H05K3/3489 ,  H05K2201/10977

摘要： The invention aims to provide a thermosetting flux suitable for solder bonding of a semiconductor element and an electronic part and making solder bonding with a high bonding strength and a high heat resistant strength at a high temperature possible and a paste containing the flux and a non-lead type solder paste and with respect to the thermosetting flux, an epoxy resin, a hardening agent, and at least one of rosin derivatives having functional groups reactive on the epoxy resin and selected from maleic acid-modified rosin, a fumaric acid-modified rosin, and acrylic acid-modified rosin are used. The flux can be used in form of a solder paste while being mixed and kneaded with the non-lead type solder alloy powder.

摘要翻译： 本发明的目的是提供一种适用于半导体元件和电子部件的焊接的热固性焊剂，并且可以在高温下具有高接合强度和高耐热强度的焊接，并且含有焊剂和非焊接材料， 铅类焊膏，相对于热固化性助焊剂，环氧树脂，硬化剂，以及具有官能团的至少一种具有在环氧树脂上反应并且选自马来酸改性松香，富马酸改性松香 ，和丙烯酸改性松香。 焊剂可以以焊膏的形式使用，同时与非铅型焊料合金粉末混合和捏合。

公开(公告)号：US06220501B1

公开(公告)日：2001-04-24

申请号：US09169981

申请日：1998-10-13

申请人： Masahiro Tadauchi ,  Izuru Komatsu ,  Kouichi Teshima ,  Rikiya Katoh ,  Jun Sugimoto ,  Takayuki Suzuki ,  Mitsuyoshi Hirayama

发明人： Masahiro Tadauchi ,  Izuru Komatsu ,  Kouichi Teshima ,  Rikiya Katoh ,  Jun Sugimoto ,  Takayuki Suzuki ,  Mitsuyoshi Hirayama

IPC分类号： B23K120

CPC分类号： B23K35/262 ,  B23K35/3613 ,  C22C13/00 ,  H05K3/3463

摘要： Disclosed is a method of joining metallic members together. The metallic members are coated with an undercoat composed of an alloy of tin and zinc and contacted with each other through a mixture containing a solder comprising tin and zinc and a flux, while heating the metallic members to melt the solder. Then the molten solder is solidified to join the metallic members. Here, the ratio of zinc in the undercoat is represented by x (% by weight), the ratio of zinc in the solder is represented by y (% by weight), and the ratio, x, and the ratio, y, are values within an area enclosed by the line A or B in FIG. 1, which satisfies the formulas: 1≦x≦20, 3≦y≦13 and 3≦(x+y)/2≦13, or formulas: 0.1≦x≦25, 2≦y≦15 and 2≦(x+y)/2≦15.

摘要翻译： 公开了将金属构件连接在一起的方法。 金属构件涂覆有由锡和锌的合金构成的底涂层，并通过包含锡和锌的焊料和助熔剂的混合物彼此接触，同时加热金属构件以熔化焊料。 然后将熔融的焊料固化，以将金属构件接合。 这里，底涂层中的锌的比例由x（重量％）表示，焊料中的锌的比例由y（重量％）表示，x的比例和y的比例为y 在由图1中的线A或B包围的区域内。 1，其满足以下公式：1 <= x <= 20,3 <= y <= 13和3 <=（x + y）/ 2 <= 13或式：0.1 <= x <= 25,2 = y <= 15和2 <=（x + y）/ 2 <= 15。

公开(公告)号：US20120212959A1

公开(公告)日：2012-08-23

申请号：US13397036

申请日：2012-02-15

申请人： Michinobu INOUE ,  Izuru Komatsu ,  Yasuhide Okada ,  Daigo Suzuki ,  Kumiko Ioka ,  Kazuki Tateyama

发明人： Michinobu INOUE ,  Izuru Komatsu ,  Yasuhide Okada ,  Daigo Suzuki ,  Kumiko Ioka ,  Kazuki Tateyama

IPC分类号： F21V3/00 ,  F21V7/00 ,  F21V29/00

CPC分类号： F21V3/00 ,  F21K9/232 ,  F21K9/64 ,  F21V3/061 ,  F21V3/062 ,  F21V29/87 ,  F21V29/89 ,  F21Y2105/10 ,  F21Y2115/10

摘要： According to one embodiment, a lighting device includes a body section, a light source, a globe, and a heat transfer section. The light source is provided on one end portion of the body section. The light source includes a light emitting element. The globe is provided so as to cover the light source. The heat transfer section in thermal contacts with at least one of an inner surface of the globe and a heat dissipation surface on the end portion side of the body section.

摘要翻译： 根据一个实施例，照明装置包括主体部分，光源，球体和传热部分。 光源设置在主体部分的一个端部上。 光源包括发光元件。 提供球体以覆盖光源。 与球体的内表面中的至少一个热敏接触的传热部和主体部的端部侧的散热面。

公开(公告)号：US20060081995A1

公开(公告)日：2006-04-20

申请号：US11176422

申请日：2005-07-08

申请人： Toshihide Takahashi ,  Shuichi Komatsu ,  Masahiro Tadauchi ,  Kazutaka Matsumoto ,  Izuru Komatsu

发明人： Toshihide Takahashi ,  Shuichi Komatsu ,  Masahiro Tadauchi ,  Kazutaka Matsumoto ,  Izuru Komatsu

IPC分类号： H01L23/48

CPC分类号： H01L23/488 ,  H01L23/4827 ,  H01L23/49562 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/32507 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83439 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/1301 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3651 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A soldered material according to an aspect of the present invention comprises a first metallic material to be soldered, a second metallic material to be soldered which is composed of at least one element selected from the group consisting of nickel, palladium, platinum and aluminum, and a soldering layer soldering the first metallic material and the second metallic material, and in a cross-sectional microstructure of the soldering layer a solid solution phase comprising the element constituting the second metallic material and tin is present.

摘要翻译： 根据本发明的一个方面的焊接材料包括待焊接的第一金属材料，由至少一种选自镍，钯，铂和铝的元素组成的待焊接的第二金属材料，以及 焊接第一金属材料和第二金属材料的焊接层，并且在焊接层的横截面微结构中存在包含构成第二金属材料的元素和锡的固溶体相。