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1.发明申请Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device 审中-公开焊接材料，半导体器件，焊接方法以及制造半导体器件的方法公开(公告)号：US20060081995A1
公开(公告)日：2006-04-20
申请号：US11176422
申请日：2005-07-08
IPC分类号： H01L23/48
CPC分类号： H01L23/488 , H01L23/4827 , H01L23/49562 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/48 , H01L2224/04026 , H01L2224/04042 , H01L2224/29111 , H01L2224/32245 , H01L2224/32507 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83439 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/1301 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/3651 , H01L2924/01026 , H01L2924/01028 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A soldered material according to an aspect of the present invention comprises a first metallic material to be soldered, a second metallic material to be soldered which is composed of at least one element selected from the group consisting of nickel, palladium, platinum and aluminum, and a soldering layer soldering the first metallic material and the second metallic material, and in a cross-sectional microstructure of the soldering layer a solid solution phase comprising the element constituting the second metallic material and tin is present.
摘要翻译： 根据本发明的一个方面的焊接材料包括待焊接的第一金属材料，由至少一种选自镍，钯，铂和铝的元素组成的待焊接的第二金属材料，以及 焊接第一金属材料和第二金属材料的焊接层，并且在焊接层的横截面微结构中存在包含构成第二金属材料的元素和锡的固溶体相。
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公开(公告)号：US20060067853A1
公开(公告)日：2006-03-30
申请号：US11222808
申请日：2005-09-12
申请人： Toshihide Takahashi , Kazutaka Matsumoto , Izuru Komatsu , Masahiro Tadauchi , Yoshiyuki Fukuda
发明人： Toshihide Takahashi , Kazutaka Matsumoto , Izuru Komatsu , Masahiro Tadauchi , Yoshiyuki Fukuda
IPC分类号： C22C13/00
CPC分类号： B23K35/262
摘要： A lead-free solder comprises tin and zinc at a weight ratio between tin and zinc ranging from about 88:12 to about 80:20 on the basis of total weight of the lead-free solder.
摘要翻译： 基于无铅焊料的总重量，无铅焊料包含锡和锌之间的锡和锌的重量比约为88:12至约80:20。
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3.发明申请Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device 审中-公开焊接材料，半导体器件，焊接方法以及制造半导体器件的方法公开(公告)号：US20050218525A1
公开(公告)日：2005-10-06
申请号：US11058323
申请日：2005-02-16
IPC分类号： B23K1/19 , B23K1/00 , B23K35/00 , B23K35/26 , B23K101/40 , B32B15/01 , C22C5/02 , C22C5/06 , C22C13/00 , H01L21/52 , H01L21/60 , H05K3/34 , H01L21/44 , H01L29/40
CPC分类号： B23K35/262 , B23K35/007 , H01L24/29 , H01L24/80 , H01L2224/29111 , H01L2224/83101 , H01L2224/8381 , H01L2224/83825 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01057 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/157 , H05K3/3463 , H01L2924/0105 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2924/00015
摘要： The soldered material relating to the present invention comprises a first metallic material to be soldered; a second metallic material to be soldered; and a soldering layer containing tin and a high melting point metal, interposed between the first metallic material and the second metallic material to solder both metallic materials together, wherein the second metallic material is materials selected from the groups consisting of copper, gold, silver, a gold and palladium based alloy containing gold and palladium as main constituents, and a silver and palladium based alloy containing silver and palladium as main constituents, and the soldering layer has a plurality of granular intermetallic compound phase composed of constituent elements for the second metallic material and tin being dispersed in a cross-sectional microstructure.
摘要翻译： 涉及本发明的焊接材料包括待焊接的第一金属材料; 待焊接的第二金属材料; 以及包含锡和高熔点金属的焊接层，插入在第一金属材料和第二金属材料之间以将两种金属材料焊接在一起，其中第二金属材料是选自由铜，金，银， 以金和钯为主要成分的金和钯基合金以及以银和钯为主要成分的银和钯基合金，并且焊接层具有由第二金属材料的构成元素组成的多个颗粒状金属间化合物相 锡分散在横截面微观结构中。
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公开(公告)号：US07604154B2
公开(公告)日：2009-10-20
申请号：US11756714
申请日：2007-06-01
CPC分类号： H05K3/3484 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/262 , B23K35/36 , B23K35/3612 , B23K35/3613 , B23K35/3618 , B23K2101/40 , H05K3/3489 , H05K2201/10977
摘要： The invention aims to provide a thermosetting flux suitable for solder bonding of a semiconductor element and an electronic part and making solder bonding with a high bonding strength and a high heat resistant strength at a high temperature possible and a paste containing the flux and a non-lead type solder paste and with respect to the thermosetting flux, an epoxy resin, a hardening agent, and at least one of rosin derivatives having functional groups reactive on the epoxy resin and selected from maleic acid-modified rosin, a fumaric acid-modified rosin, and acrylic acid-modified rosin are used. The flux can be used in form of a solder paste while being mixed and kneaded with the non-lead type solder alloy powder.
摘要翻译： 本发明的目的是提供一种适用于半导体元件和电子部件的焊接的热固性焊剂，并且可以在高温下具有高接合强度和高耐热强度的焊接，并且含有焊剂和非焊接材料， 铅类焊膏，相对于热固化性助焊剂，环氧树脂，硬化剂，以及具有官能团的至少一种具有在环氧树脂上反应并且选自马来酸改性松香，富马酸改性松香 ，和丙烯酸改性松香。 焊剂可以以焊膏的形式使用，同时与非铅型焊料合金粉末混合和捏合。
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公开(公告)号：US20050056687A1
公开(公告)日：2005-03-17
申请号：US10913370
申请日：2004-08-09
IPC分类号： B23K35/363 , B23K35/02 , B23K35/22 , B23K35/26 , B23K35/36 , C08G59/42 , H05K3/34 , B23K31/00
CPC分类号： H05K3/3484 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/262 , B23K35/36 , B23K35/3612 , B23K35/3613 , B23K35/3618 , B23K2101/40 , H05K3/3489 , H05K2201/10977
摘要： The invention aims to provide a thermosetting flux suitable for solder bonding of a semiconductor element and an electronic part and making solder bonding with a high bonding strength and a high heat resistant strength at a high temperature possible and a paste containing the flux and a non-lead type solder paste and with respect to the thermosetting flux, an epoxy resin, a hardening agent, and at least one of rosin derivatives having functional groups reactive on the epoxy resin and selected from maleic acid-modified rosin, a fumaric acid-modified rosin, and acrylic acid-modified rosin are used. The flux can be used in form of a solder paste while being mixed and kneaded with the non-lead type solder alloy powder.
摘要翻译： 本发明的目的是提供一种适用于半导体元件和电子部件的焊接的热固性焊剂，并且可以在高温下具有高接合强度和高耐热强度的焊接，并且含有焊剂和非焊接材料， 铅类焊膏，相对于热固化性助焊剂，环氧树脂，硬化剂，以及具有官能团的至少一种具有在环氧树脂上反应并且选自马来酸改性松香，富马酸改性松香 ，和丙烯酸改性松香。 焊剂可以以焊膏的形式使用，同时与非铅型焊料合金粉末混合和捏合。
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6.发明授权公开(公告)号：US06673310B2
公开(公告)日：2004-01-06
申请号：US09749606
申请日：2000-12-28
申请人： Masahiro Tadauchi , Izuru Komatsu , Hiroshi Tateishi , Kouichi Teshima , Kazutaka Matsumoto , Tetsuji Hori
发明人： Masahiro Tadauchi , Izuru Komatsu , Hiroshi Tateishi , Kouichi Teshima , Kazutaka Matsumoto , Tetsuji Hori
IPC分类号： C22C1300
CPC分类号： B23K35/282 , B23K35/0222 , B23K35/0227 , B23K35/0244 , B23K35/025 , B23K35/26 , B23K35/262 , B23K35/28 , B23K35/30 , B23K35/3006 , B23K35/36 , B23K2101/36 , H01L24/97 , H01L2224/32245 , H01L2224/45144 , H01L2224/48247 , H01L2224/73265 , H01L2224/83191 , H01L2224/83193 , H01L2224/97 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H05K3/3463 , H01L2924/00 , H01L2924/00012
摘要： Disclosed is a high-temperature solder material which is composed of tin, zinc and silver, or of 0.01 to 2 wt % germanium or aluminum and the balance tin, or tin and zinc at a ratio of 80/20 to 70/30. The tin/zinc/silver solder has a composition ratio that the ratio of till to zinc is within a range of 97/3 to 79/21 by weight, and the ratio of the sum of tin and zinc to silver is within a range of 88/12 to 50/50 by weight, or that the ratio of tin to zinc is within a range of 70/30 to 5/95 by weight, and the ratio of silver to the sum of tin, zinc and silver is 15% by weight or less. The solder material is used for producing electric or electronic devices and equipments.
摘要翻译： 公开了由锡，锌和银组成的高温焊料材料，或0.01至2重量％的锗或铝，余量为锡，或锡和锌的比例为80/20至70/30。 锡/锌/银焊料的组成比为：直到锌的比例在97/3〜79/21的范围内，锡和锌与银的和的比例在 88/12〜50/50，或锡与锌的比例在70/30〜5/95的范围内，银与锡，锌和银之和的比率为15％ 以下。 焊料用于生产电气或电子设备和设备。
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公开(公告)号：US08531496B2
公开(公告)日：2013-09-10
申请号：US13224419
申请日：2011-09-02
申请人： Kazutaka Matsumoto
发明人： Kazutaka Matsumoto
IPC分类号： B41J2/45
CPC分类号： G02B26/123
摘要： An image forming apparatus has a speed range showing image forming capability per unit time that is determined in advance, and is settable to either a model set at a relatively low-speed range or a model set at a relatively high-speed range. Then, the arrangement of the laser elements is differentiated between a low-speed machine and a high-speed machine each other. Even when timing of writing for the high-speed machine is applied to the arrangement of the laser elements for the low-speed machine to write in an image, the image is not able to be written successfully, and resulting in an image which is displaced vertically.
摘要翻译： 图像形成装置具有表示预先确定的每单位时间的图像形成能力的速度范围，并且可设置为设定在相对低速范围的模型或设定在较高速度范围的模型。 然后，激光元件的配置在低速机与高速机之间相互不同。 即使将高速机的写入时间应用于低速机的激光元件的配置来写入图像，也不能成功地写入图像，并且导致图像被移位 垂直。
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公开(公告)号：US08022979B2
公开(公告)日：2011-09-20
申请号：US11503708
申请日：2006-08-14
申请人： Shinichi Miyamoto , Takayuki Kameya , Katsushi Watanabe , Kazutaka Matsumoto , Takeaki Nakamura
发明人： Shinichi Miyamoto , Takayuki Kameya , Katsushi Watanabe , Kazutaka Matsumoto , Takeaki Nakamura
CPC分类号： A61B1/0052 , A61B1/00048 , A61B1/00052 , A61B1/04
摘要： The endoscope system of the present invention includes: an endoscope that has an image pickup device that picks up an observation image of a test object; an image display unit that converts image pickup signals that have been sent from the image pickup device into images and then displays these images; a first mounting portion that is provided in an operating section of the endoscope and on which the image display unit is mounted; and a second mounting portion that is provided in the operating section of the endoscope and on which the image display unit is mounted in a different position from that of the first mounting portion.
摘要翻译： 本发明的内窥镜系统包括：内窥镜，其具有拾取测试对象的观察图像的图像拾取装置; 图像显示单元，其将已经从图像拾取装置发送的图像拾取信号转换成图像，然后显示这些图像; 第一安装部，其设置在所述内窥镜的操作部中，并且安装所述图像显示单元; 以及第二安装部，其设置在所述内窥镜的操作部中，并且所述图像显示单元安装在与所述第一安装部的位置不同的位置。
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公开(公告)号：US4719255A
公开(公告)日：1988-01-12
申请号：US760770
申请日：1985-07-31
摘要： An epoxy resin composition for encapsulation of semiconductor device comprises the components (a), (b), (c) and at least one of the components (d) and (e) as shown below:(a) 100 parts by weight of an epoxy resin having at least 2 epoxy groups in one molecule;(b) 8 to 65 parts by weight of a novolak type phenolic resin with an ortho ratio less than 50%;(c) 1.2 to 40 parts by weight of a polyvinyl acetal compound;(d) 0.8 to 30 parts by weight of a silicone oil; and(e) 4 to 80 parts by weight of a rubber-modified phenolic resin.The described epoxy resins composition for encapsulation of semiconductor devices can retain its high glass transition temperature in the cured product and also has low modulus of elasticity, as well as excellent humidity resistance and thermal shock resistance.
摘要翻译： 用于半导体器件封装的环氧树脂组合物包括如下所示的组分（a），（b），（c）和组分（d）和（e）中的至少一种：（a）100重量份的 一个分子中具有至少2个环氧基团的环氧树脂; （b）8〜65重量份邻位比小于50％的酚醛清漆型酚醛树脂; （c）1.2〜40重量份的聚乙烯醇缩醛化合物; （d）0.8〜30重量份的硅油; 和（e）4至80重量份的橡胶改性酚醛树脂。 所述用于半导体器件封装的环氧树脂组合物可以在固化产物中保持其高的玻璃化转变温度，并且还具有低的弹性模量以及优异的耐湿性和耐热冲击性。
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公开(公告)号：USD549332S1
公开(公告)日：2007-08-21
申请号：US29214553
申请日：2004-06-10
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