公开(公告)号：US20150255683A1

公开(公告)日：2015-09-10

申请号：US14428896

申请日：2013-09-16

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Ion Stoll ,  Sebastian Taeger ,  Hans-Christoph Gallmeier ,  Gudrun Lindberg ,  Stefan Hartauer

IPC: H01L33/44 ,  H01L33/50 ,  H01L33/62 ,  H01L33/46

CPC classification number: H01L33/44 ,  H01L33/46 ,  H01L33/502 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01L2924/00014

Abstract: A method can be used for fixing a matrix-free electrophoretically deposited layer on a semiconductor chip. A semiconductor wafer has a carrier substrate-and at least one semiconductor chip. The at least one semiconductor chip has an active zone for generating electromagnetic radiation. At least one contact area is formed on a surface of the at least one semiconductor chip facing away from the carrier substrate. A material is electrophoretically deposited on the surface of the at least one semiconductor chip facing away from the carrier substrate in order to form the electrophoretically deposited layer. Deposition of the material on the at least one contact area is prevented. An inorganic matrix material is applied to at least one section of a surface of the semiconductor wafer facing away from the carrier substrate in order to fix the material on the at least one semiconductor chip.

Abstract translation: 可以使用一种方法将半导体芯片上的无矩阵电泳沉积层固定。 半导体晶片具有载体衬底和至少一个半导体芯片。 所述至少一个半导体芯片具有用于产生电磁辐射的活动区域。 在至少一个半导体芯片的远离载体衬底的表面上形成至少一个接触区域。 为了形成电泳沉积层，将材料电泳沉积在至少一个半导体芯片背离载体衬底的表面上。 防止材料沉积在至少一个接触区域上。 将无机基质材料施加到半导体晶片的远离载体衬底的表面的至少一个部分，以将材料固定在至少一个半导体芯片上。

公开(公告)号：US20180175260A1

公开(公告)日：2018-06-21

申请号：US15579090

申请日：2016-05-25

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Gudrun Lindberg

IPC: H01L33/56 ,  H01L33/62 ,  H01L33/54 ,  C07F1/00 ,  C07F1/02 ,  C07F3/02 ,  C07F3/00 ,  C07F5/06 ,  C07F5/00

CPC classification number: H01L33/56 ,  C07F1/00 ,  C07F1/02 ,  C07F3/00 ,  C07F3/02 ,  C07F5/00 ,  C07F5/062 ,  H01B3/30 ,  H01L24/48 ,  H01L33/44 ,  H01L33/48 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/8592 ,  H01L2924/12041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes at least one metallic surface, a contacted optoelectronic semiconductor chip configured to emit radiation and a protective layer arranged on the at least one metallic surface, wherein the protective layer comprises a protective material of at least one N-heterocyclic carbene, and wherein a covalent bond is formed between the protective material and the at least one metallic surface.

公开(公告)号：US09831390B2

公开(公告)日：2017-11-28

申请号：US14428896

申请日：2013-09-16

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Ion Stoll ,  Sebastian Taeger ,  Hans-Christoph Gallmeier ,  Gudrun Lindberg ,  Stefan Hartauer

IPC: H01L29/22 ,  H01L33/44 ,  H01L33/46 ,  H01L33/50 ,  H01L33/62

CPC classification number: H01L33/44 ,  H01L33/46 ,  H01L33/502 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01L2924/00014

Abstract: A method can be used for fixing a matrix-free electrophoretically deposited layer on a semiconductor chip. A semiconductor wafer has a carrier substrate and at least one semiconductor chip. The at least one semiconductor chip has an active zone for generating electromagnetic radiation. At least one contact area is formed on a surface of the at least one semiconductor chip facing away from the carrier substrate. A material is electrophoretically deposited on the surface of the at least one semiconductor chip facing away from the carrier substrate in order to form the electrophoretically deposited layer. Deposition of the material on the at least one contact area is prevented. An inorganic matrix material is applied to at least one section of a surface of the semiconductor wafer facing away from the carrier substrate in order to fix the material on the at least one semiconductor chip.

公开(公告)号：US10243110B2

公开(公告)日：2019-03-26

申请号：US15555964

申请日：2016-03-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Reeswinkel ,  Gudrun Lindberg

IPC: H01L21/44 ,  H01L33/44 ,  C09D183/08 ,  C08G77/385 ,  G02B6/42

Abstract: The invention relates to an optoelectronic device (1) comprising at least one outer surface (2) containing silicone (20), chemical compounds, comprising an anchor group (3) and a head group (4), being bonded to the silicone via the anchor group, and the adhesion of the regions of the silicone (2) present on the outer surface being reduced owing to the head groups of the chemical compounds. A method for producing an optoelectronic device is also disclosed.

公开(公告)号：US09663699B2

公开(公告)日：2017-05-30

申请号：US15053646

申请日：2016-02-25

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Gudrun Lindberg ,  Mathias Kämpf ,  Kathrin Lampert

IPC: C09K5/08 ,  H01L33/44 ,  C09D129/04 ,  H01L33/00

CPC classification number: C09K5/08 ,  C09D129/04 ,  H01L33/0095 ,  H01L33/44

Abstract: A suspension for protecting a semiconductor material, comprising a carrier medium, trimethylolpropane as a plasticizer, benzotriazole derivate as an absorber dye, and inorganic particles selected from the group consisting of aluminum nitride, silicon nitride and boron nitride, wherein the thermal conductivity of the suspension is about 1 W/mk to about 2 W/mk.

公开(公告)号：US20220376133A1

公开(公告)日：2022-11-24

申请号：US17773331

申请日：2020-10-26

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Ivar Tangring ,  Gudrun Lindberg ,  Viktor Geringer ,  Sophia Huppmann

IPC: H01L33/00 ,  H01L21/673 ,  H01L33/50 ,  H01L33/62 ,  H01L31/18 ,  H01L31/0232

Abstract: In an embodiment a method includes arranging a plurality of semiconductor chips on a carrier, arranging an auxiliary carrier on sides of the semiconductor chips facing away from the carrier, removing the carrier, separating the auxiliary carrier between the semiconductor chips to form auxiliary carrier-chip units, each of the auxiliary carrier-chip units has at least one semiconductor chip and an auxiliary carrier part adjoining the semiconductor chip, arranging each of the auxiliary carrier-chip units on a connecting carrier and removing the auxiliary carrier parts from each auxiliary carrier-chip unit.

公开(公告)号：US10256379B2

公开(公告)日：2019-04-09

申请号：US15579090

申请日：2016-05-25

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Gudrun Lindberg

IPC: H01L33/56 ,  H01L33/54 ,  H01L33/60 ,  C07F1/00 ,  H01L23/49 ,  H01B3/30 ,  H01L33/44 ,  C07F1/02 ,  C07F3/00 ,  C07F3/02 ,  C07F5/00 ,  C07F5/06 ,  H01L33/62 ,  H01L33/48 ,  H01L23/00

Abstract: An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes at least one metallic surface, a contacted optoelectronic semiconductor chip configured to emit radiation and a protective layer arranged on the at least one metallic surface, wherein the protective layer comprises a protective material of at least one N-heterocyclic carbene, and wherein a covalent bond is formed between the protective material and the at least one metallic surface.