公开(公告)号：US06473274B1

公开(公告)日：2002-10-29

申请号：US09607413

申请日：2000-06-28

申请人： Peter J. Maimone ,  Kurt P. Wachtler ,  Tsen-Hwang Lin ,  Mark W. Heaton

发明人： Peter J. Maimone ,  Kurt P. Wachtler ,  Tsen-Hwang Lin ,  Mark W. Heaton

IPC分类号： G11B556

CPC分类号： G11B5/5552

摘要： A microactuator includes a base, first microactuator elements carried by the base, a platform attached to the base, second microactuator elements carried by the platform, and the first microactuator elements being located substantially symmetrically on either side of a plane along a centerline of the base

摘要翻译： 微致动器包括基座，由基座承载的第一微致动器元件，附接到基座的平台，由平台承载的第二微致动器元件，以及第一微致动器元件大致对称地位于沿着基座的中心线的平面的任一侧

公开(公告)号：US06655002B1

公开(公告)日：2003-12-02

申请号：US09607415

申请日：2000-06-28

申请人： Peter J. Maimone ,  Tsen-Hwang Lin ,  Kurt P. Wachtler

发明人： Peter J. Maimone ,  Tsen-Hwang Lin ,  Kurt P. Wachtler

IPC分类号： H02K1516

CPC分类号： G11B5/5552 ,  H02K99/00 ,  Y10T29/49009

摘要： A microactuator, or micromotor, (60) and method for making it are presented such that a symmetrical build up of material is performed on opposite sides of a substrate. This reduces mechanical stresses in the device. In its construction, respective layers of circuit portions (108, 110) are built on each side of the structure, thereby eliminating the need to stack complex patterns. Stacking one complex pattern on top of a similar pattern is difficult because the surface, which is the base for subsequent layers, is not flat. The photolithography process that forms these patterns is not very forgiving to non-flat surfaces. Avoiding the stacked layers also allows thicker conductors to be considered for each circuit. Thicker circuits increase current carrying capacity, which in one of the key variables increase the power of the micromotor.

摘要翻译： 呈现微致动器或微电动机（60）及其制造方法，使得在衬底的相对侧上进行对称的材料堆积。 这降低了设备中的机械应力。 在其结构中，各层电路部分（108,110）被构建在结构的每一侧上，从而不需要堆叠复杂的图案。 在类似图案之上堆叠一个复杂图案是困难的，因为作为后续层的基底的表面不是平坦的。 形成这些图案的光刻工艺不是非平坦的非平坦表面。 避免堆叠层也允许为每个电路考虑更厚的导体。 较大的电路增加了电流承载能力，其中一个关键变量增加了微电机的功率。

公开(公告)号：US06504685B1

公开(公告)日：2003-01-07

申请号：US09634097

申请日：2000-08-08

申请人： Kurt P. Wachtler ,  Peter J. Maimone

发明人： Kurt P. Wachtler ,  Peter J. Maimone

IPC分类号： G11B556

CPC分类号： G11B5/5521 ,  G11B5/5552 ,  G11B5/56

摘要： A microelectromechanical (MEM) device with an expanded PTFE material over the gap between movable structures to provide electrical connection across the gap and prevent particles from contaminating the gap. A microelectromechanical (MEM) device is also immobilized by placing an expanded PTFE material over the gap between movable structures. The expanded PTFE material can be made stiff during manufacture and then flexible after the manufacturing process is complete. An embodiment of the invention is a MEM device configured as a micro-actuator for a dual-actuator hard disk drive.

摘要翻译： 一种在可移动结构之间的间隙上具有膨胀的PTFE材料的微机电（MEM）装置，以提供穿过间隙的电连接并防止颗粒污染间隙。 还通过将可膨胀的PTFE材料放置在可移动结构之间的间隙上来固定微机电（MEM）装置。 膨胀的PTFE材料可以在制造过程中制成刚性，然后在制造过程完成后变得柔性。 本发明的实施例是被配置为用于双致动器硬盘驱动器的微致动器的MEM装置。

公开(公告)号：US06374481B1

公开(公告)日：2002-04-23

申请号：US09607087

申请日：2000-06-28

申请人： Kurt P. Wachtler ,  Mark W. Heaton

发明人： Kurt P. Wachtler ,  Mark W. Heaton

IPC分类号： H01F706

CPC分类号： G11B5/5552 ,  Y10T29/4902 ,  Y10T29/49025 ,  Y10T29/49073

摘要： A piece-part microactuator (220), or micromotor, manufacturing approach is presented. In this approach, two of the NiFe parts (221,223) and dielectric and copper (225) piece-parts are manufactured separately. This allows the NiFe parts (221,223) to be designed in a manner to maximize the thickness of the metal, which in turn increases the magnetic properties of the motor. The dielectric and copper coils piece-part (225) may be based upon a thin film interconnect (222) or some derivative of a standard flex circuit printed wiring board. These piece-parts (221,223,225) may be tested individually, defective parts discarded, and only functional units assembled. This not only produces a mechanically balanced construction, but has lower cost due to non-sequential manufacturing steps. The dielectric and copper coils piece-part (225) also provides the path for electrical connections to the movable platform (234) and a relatively easy method for electrical connection off the microactuator and onto the hard disk drive system.

摘要翻译： 提出了一种零件微型致动器（220）或微电机的制造方法。 在这种方法中，分别制造两个NiFe部件（221,223）和电介质和铜（225）件。 这允许以使金属的厚度最大化的方式设计NiFe部件（221,223），这又增加了电动机的磁性能。 电介质和铜线圈片部分（225）可以基于薄膜互连（222）或标准柔性电路印刷线路板的一些衍生物。 这些零件（221,223,225）可以单独测试，丢弃有缺陷的零件，并且只能组装功能单元。 这不仅产生机械平衡的结构，而且由于非顺序的制造步骤而具有较低的成本。 电介质和铜线圈片（225）还提供用于与可移动平台（234）的电连接的路径以及用于从微致动器和硬盘驱动系统电连接的相对简便的方法。

公开(公告)号：US07390700B2

公开(公告)日：2008-06-24

申请号：US11400099

申请日：2006-04-07

申请人： Mark A. Gerber ,  Kurt P. Wachtler ,  Abram M. Castro

发明人： Mark A. Gerber ,  Kurt P. Wachtler ,  Abram M. Castro

IPC分类号： H01L21/44

CPC分类号： H01L23/49811 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/16 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19011

摘要： A semiconductor system (200) of one or more semiconductor interposers (201) with a certain dimension (210), conductive vias (212) extending from the first to the second surface, with terminals and attached non-reflow metal studs (215) at the ends of the vias. A semiconducting interposer surface may include discrete electronic components or an integrated circuit. One or more semiconductor chips (202, 203) have a dimension (220, 230) narrower than the interposer dimension, and an active surface with terminals and non-reflow metal studs (224, 234). One chip is flip-attached to the first interposer surface, and another chip to the second interposer surface, so that the interposer dimension projects over the chip dimension. An insulating substrate (204) has terminals and reflow bodies (242) to connect to the studs of the projecting interposer.

摘要翻译： 具有一定尺寸（210）的一个或多个半导体插入件（201）的半导体系统（200），从第一表面延伸到第二表面的导电通孔（212），端子和附接的非回流金属螺柱（215）在 通孔的末端。 半导体插入器表面可以包括分立的电子部件或集成电路。 一个或多个半导体芯片（202,203）具有比插入件尺寸窄的尺寸（220,230）以及具有端子和非回流金属柱（224,234）的活性表面。 一个芯片被翻转连接到第一插入器表面，另一个芯片被翻转连接到第二插入器表面，使得插入器尺寸突出在芯片尺寸上。 绝缘基板（204）具有端子和回流体（242），以连接到突出插入件的螺柱。

公开(公告)号：US06707124B2

公开(公告)日：2004-03-16

申请号：US09788075

申请日：2001-02-16

申请人： Kurt P. Wachtler ,  David N. Walter ,  Larry J. Mowatt

发明人： Kurt P. Wachtler ,  David N. Walter ,  Larry J. Mowatt

IPC分类号： H01L310203

CPC分类号： H01L23/49816 ,  H01L23/055 ,  H01L23/49822 ,  H01L24/19 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2924/00012

摘要： A high density interconnect device which creates a thin, electrically and thermally high performance package for semiconductor devices having a mechanically stable and high thermal conductivity substrate. Cavities in the substrate accommodate semiconductor devices attached directly to the substrate. The semiconductor devices include at least one optical receiver and/or transmitter. A thin film overlay having multiple layers interconnects the semiconductor devices to an array of pads on a surface of the thin film overlay facing away from the substrate. Connectors are attached to the pads to provide direct electrical and mechanical attachment to other system hardware. In one embodiment, the optical receiver and/or transmitter receives and/or transmits light signals through the thin film overlay. In another embodiment, the optical receiver and/or transmitter receives and/or transmits light signals through holes formed through the thin film overlay. The holes may be back filled with an optical quality material.

摘要翻译： 一种高密度互连器件，其为具有机械稳定且高导热性的衬底的半导体器件产生薄的，电性和热的高性能封装。 衬底中的腔容纳直接附着在衬底上的半导体器件。 半导体器件包括至少一个光接收器和/或发射器。 具有多个层的薄膜覆盖层将半导体器件与薄膜覆盖物的背离衬底的表面上的焊盘阵列互连。 连接器连接到焊盘，以提供与其他系统硬件的直接电气和机械连接。 在一个实施例中，光接收器和/或发射器通过薄膜覆盖层接收和/或发射光信号。 在另一实施例中，光接收器和/或发射器通过穿过薄膜覆盖层形成的孔接收和/或发射光信号。 孔可以用光学质量材料填充。

公开(公告)号：US07872841B2

公开(公告)日：2011-01-18

申请号：US12049726

申请日：2008-03-17

申请人： Yves Leduc ,  Nathalie Messina ,  Charvaka Duvvury ,  Kurt P. Wachtler

发明人： Yves Leduc ,  Nathalie Messina ,  Charvaka Duvvury ,  Kurt P. Wachtler

IPC分类号： H02H9/00

CPC分类号： H01L23/62 ,  H01L23/60 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/13034 ,  H01L2924/15311 ,  H05K1/0259 ,  H05K2201/0738 ,  Y10T29/49105 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A packaged semiconductor device (200) with a substrate (220) having, sandwiched in an insulator (221), a flat sheet-like sieve member (240) made of a non-linear material switching from insulator to conductor mode at a preset voltage. Both member surfaces are free of indentations; the member is perforated by through-holes, which are grouped into a first set (241) and a second set (242). Metal traces (251) over one member surface are positioned across the first set through-holes (241); each trace is connected to a terminal on the substrate top and, through the hole, to a terminal on the substrate bottom. Analogous for metal traces (252) over the opposite member surface and second set through-holes (242). Traces (252) overlap with a portion of traces (252) to form the locations for the conductivity switches, creating local ultra-low resistance bypasses to ground for discharging overstress events.

摘要翻译： 一种封装半导体器件（200），其具有夹在绝缘体（221）中的基板（220），由预定电压从绝缘体切换到导体模式的非线性材料制成的平板状筛件（240） 。 两个构件表面都没有压痕; 所述构件穿过通孔，所述通孔被分组成第一组（241）和第二组（242）。 一个构件表面上的金属迹线（251）跨过第一组通孔（241）定位; 每个迹线连接到基板顶部上的端子，并且通过孔连接到基板底部上的端子。 类似于相对构件表面上的金属迹线（252）和第二组通孔（242）。 轨迹（252）与轨迹（252）的一部分重叠以形成用于导电开关的位置，从而产生局部超低电阻旁路到地以释放过应力事件。

公开(公告)号：US06541352B2

公开(公告)日：2003-04-01

申请号：US09917524

申请日：2001-07-27

申请人： Kurt P. Wachtler

发明人： Kurt P. Wachtler

IPC分类号： H01L2146

CPC分类号： H01L24/81 ,  H01L21/6835 ,  H01L23/13 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  Y10S438/964 ,  H01L2224/81 ,  H01L2924/00

摘要： Methods are disclosed for manufacturing semiconductor device dies and for removing material from the bottom side of the wafer dies, wherein a contoured surface is provided on the die bottom, such as through an etching process. In addition, methods are disclosed for securing a semiconductor device to a surface. Semiconductor wafers and die are also disclosed having contoured bottom surfaces.

摘要翻译： 公开了用于制造半导体器件管芯并用于从晶片管芯的底侧去除材料的方法，其中，例如通过蚀刻工艺，在模具底部上设置有轮廓的表面。 此外，公开了用于将半导体器件固定到表面的方法。 还公开了具有轮廓底面的半导体晶片和裸片。

公开(公告)号：US08309388B2

公开(公告)日：2012-11-13

申请号：US12337320

申请日：2008-12-17

申请人： Kurt P. Wachtler ,  Wei-Yan Shih ,  Gregory E. Howard

发明人： Kurt P. Wachtler ,  Wei-Yan Shih ,  Gregory E. Howard

IPC分类号： H01L23/10

CPC分类号： H01L23/10 ,  B81B7/0077 ,  B81C1/00333 ,  B81C2203/0127 ,  B81C2203/0163 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

摘要： A hermetic MEMS device (100) comprising a carrier (110) having a surface (111) including a device (101) and an attachment stripe (122), the stripe spaced from the device and surrounding the device; a metallic foil (102) having a central bulge portion (103) and a peripheral rim portion (104) meeting the stripe, the bulge cross section parallel to the carrier monotonically decreasing from the rim (104) towards the bulge apex (105); and the foil positioned over the carrier surface so that the bulge arches over the device and the rim forms a seal with the stripe.

摘要翻译： 一种密封MEMS装置（100），包括具有包括装置（101）和附接条（122）的表面（111）的载体（110），所述条与所述装置间隔开并围绕所述装置; 具有中心凸起部分（103）的金属箔（102）和与所述条纹相遇的周边边缘部分（104），所述凸起横截面平行于所述载体从所述边缘（104）向凸起顶点（105）单调递减; 并且所述箔定位在所述载体表面上方，使得所述装置和所述边缘上的凸起拱形物与所述条纹形成密封。

公开(公告)号：US06274391B1

公开(公告)日：2001-08-14

申请号：US07966645

申请日：1992-10-26

申请人： Kurt P. Wachtler ,  David N. Walter ,  Larry J. Mowatt

发明人： Kurt P. Wachtler ,  David N. Walter ,  Larry J. Mowatt

IPC分类号： H01L2100

CPC分类号： H01L23/49816 ,  H01L23/055 ,  H01L23/49822 ,  H01L24/19 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2924/00012

摘要： A high density interconnect land grid array package device combines various electronic packaging techniques in a unique way to create a very thin, electrically and thermally high performance package for single or multiple semiconductor devices. A thin and mechanically stable substrate or packaging material (12) is selected that also has high thermal conductivity. Cavities (14) in the substrate or packaging material (12) accommodate one or more semiconductor devices that are attached directly to the substrate or packaging material. At least one of said semiconductor devices includes at least one optical receiver and/or transmitter. A thin film overlay (18) having multiple layers interconnects the one or more semiconductor devices to an array of pads (20) on a surface of the thin film overlay facing away from the substrate or packaging material. Solder balls (22), conductive adhesive or elastomeric connectors are attached to the pads to provide direct electrical and mechanical attachment means to other system hardware. In one embodiment of the invention, the optical receiver and/or transmitter receives and/or transmits light signals through the thin film overlay. In another embodiment of the invention, the optical receiver and/or transmitter receives and/or transmits light signals through holes (47) formed through the thin film overlay. The holes may be back filled with an optical quality material.

摘要翻译： 高密度互连焊盘阵列封装器件以独特的方式组合各种电子封装技术，以为单个或多个半导体器件创建非常薄的电气和热性能高的封装。 选择也具有高导热性的薄且机械稳定的基底或包装材料（12）。 衬底或包装材料（12）中的空腔（14）容纳一个或多个直接连接到衬底或包装材料的半导体器件。 所述半导体器件中的至少一个包括至少一个光接收器和/或发射器。 具有多个层的薄膜覆盖层（18）将一个或多个半导体器件与薄膜覆盖物表面上的衬垫阵列（20）相互互连，所述衬垫背面远离衬底或封装材料。 焊球（22），导电粘合剂或弹性连接器附接到焊盘，以向其他系统硬件提供直接的电和机械连接装置。 在本发明的一个实施例中，光接收器和/或发射器通过薄膜覆盖层接收和/或发射光信号。 在本发明的另一实施例中，光接收器和/或发射器通过穿过薄膜覆盖层形成的孔（47）接收和/或发射光信号。 孔可以用光学质量材料填充。