公开(公告)号：US5603157A

公开(公告)日：1997-02-18

申请号：US205590

申请日：1994-03-02

申请人： Rickie Lake ,  Peter M. Blonsky

发明人： Rickie Lake ,  Peter M. Blonsky

IPC分类号： H01M2/02 ,  H01M2/08 ,  H01M6/12 ,  H01M6/16

CPC分类号： H01M2/0222 ,  H01M2/08 ,  H01M6/12 ,  H01M6/16 ,  Y10T29/49108 ,  Y10T29/4911 ,  Y10T29/49114 ,  Y10T29/49115

摘要： A method of forming a button-type battery includes: a) providing an electrically conductive sheet having an exposed surface which is divisible into a plurality of areas; b) depositing an uncured electrically insulative gasket material onto the conductive sheet into a plurality of the areas, the gasket material being deposited to define at least one discrete pattern within the respective deposited areas, the respective discrete patterns covering less than a total of their respective areas; c) curing the deposited gasket material; d) cutting and forming a plurality of discrete first terminal housing members from the areas of the conductive sheet, the respective first terminal housing members comprising at least a portion of one of the discrete patterns of gasket material; d) providing a discrete electrically conductive second terminal housing member in facing juxtaposition to one of the first terminal housing members; e) providing an anode and a cathode having a separator and electrolyte positioned therebetween; the anode, cathode, separator and electrolyte being positioned intermediate the juxtaposed first and second terminal housing members; the anode being positioned to electrically connect with one of the first or second terminal housing members and the cathode being positioned to electrically connect with the other of the first or second terminal housing members; and f) crimping the first and second terminal housing members together into an enclosed battery housing with the gasket material being interposed between the first and second terminal housing members to provide a fluid-tight seal and to provide electrical insulation therebetween.

摘要翻译： 形成按钮型电池的方法包括：a）提供具有可分为多个区域的暴露表面的导电片; b）将未固化的电绝缘衬垫材料沉积到导电片上到多个区域中，衬垫材料被沉积以在相应的沉积区域内限定至少一个离散图案，相应的离散图案覆盖小于它们各自的总数 地区 c）固化沉积的垫片材料; d）从导电片的区域切割和形成多个分立的第一端子壳体构件，相应的第一端子壳体构件包括垫片材料的离散图案之一的至少一部分; d）提供分开的导电的第二端子壳体构件，以与所述第一端子壳体构件中的一个并置; e）提供阳极和阴极，其间具有分隔件和电解质; 阳极，阴极，分离器和电解质位于并置的第一和第二端子壳体构件的中间; 阳极被定位成与第一或第二端子壳体构件中的一个电连接，阴极被定位成与第一或第二端子壳体构件中的另一个电连接; 以及f）将所述第一和第二端子壳体部件压合在一起成封闭的电池壳体，所述垫圈材料插入在所述第一和第二端子壳体部件之间，以提供流体密封并在其间提供电绝缘。

公开(公告)号：US5730761A

公开(公告)日：1998-03-24

申请号：US736378

申请日：1996-10-24

申请人： Rickie Lake ,  Peter M. Blonsky

发明人： Rickie Lake ,  Peter M. Blonsky

IPC分类号： H01M2/02 ,  H01M2/08 ,  H01M6/12 ,  H01M6/16

CPC分类号： H01M2/0222 ,  H01M2/08 ,  H01M6/12 ,  H01M6/16 ,  Y10T29/49108 ,  Y10T29/4911 ,  Y10T29/49114 ,  Y10T29/49115

摘要： A method of forming a button-type battery, includes: a) providing an electrically conductive sheet having an exposed surface which is divisible into a plurality of areas; b) depositing an uncured electrically insulative gasket material onto the conductive sheet into a plurality of the areas, the gasket material being deposited to define at least one discrete pattern within the respective deposited areas, the respective discrete patterns covering less than a total of their respective areas; c) curing the deposited gasket material; d) cutting and forming a plurality of discrete first terminal housing members from the areas of the conductive sheet, the respective first terminal housing members comprising at least a portion of one of the discrete patterns of gasket material; d) providing a discrete electrically conductive second terminal housing member in facing juxtaposition to one of the first terminal housing members; e) providing an anode and a cathode having a separator and electrolyte positioned therebetween; the anode, cathode, separator and electrolyte being positioned intermediate the juxtaposed first and second terminal housing members; the anode being positioned to electrically connect with one of the first or second terminal housing members and the cathode being positioned to electrically connect with the other of the first or second terminal housing members; and f) crimping the first and second terminal housing members together into an enclosed battery housing with the gasket material being interposed between the first and second terminal housing members to provide a fluid-tight seal and to provide electrical insulation therebetween.

摘要翻译： 一种形成纽扣型电池的方法包括：a）提供具有可分割成多个区域的暴露表面的导电片; b）将未固化的电绝缘衬垫材料沉积到导电片上到多个区域中，衬垫材料被沉积以在相应的沉积区域内限定至少一个离散图案，相应的离散图案覆盖小于它们各自的总数 地区 c）固化沉积的垫片材料; d）从导电片的区域切割和形成多个分立的第一端子壳体构件，相应的第一端子壳体构件包括垫片材料的离散图案之一的至少一部分; d）提供分开的导电的第二端子壳体构件，以与所述第一端子壳体构件中的一个并置; e）提供阳极和阴极，其间具有分隔件和电解质; 阳极，阴极，分离器和电解质位于并置的第一和第二端子壳体构件的中间; 阳极被定位成与第一或第二端子壳体构件中的一个电连接，阴极被定位成与第一或第二端子壳体构件中的另一个电连接; 以及f）将所述第一和第二端子壳体部件压合在一起成封闭的电池壳体，所述垫圈材料插入在所述第一和第二端子壳体部件之间，以提供流体密封并在其间提供电绝缘。

公开(公告)号：US20060043533A1

公开(公告)日：2006-03-02

申请号：US10925525

申请日：2004-08-24

申请人： Rickie Lake

发明人： Rickie Lake

IPC分类号： H01L29/06 ,  H01L21/78

CPC分类号： H01L21/78 ,  H01L21/76898

摘要： A method used to form a semiconductor device comprises processing a semiconductor wafer to include one or more vias or through-holes only partially etched into the wafer, and scribe marks only partially etched into the wafer which define a plurality of semiconductor devices. Wafer material is removed from the back of the wafer to the level of the vias and scribe marks to form a via opening through the wafer while simultaneously dicing the wafer into individual semiconductor dice.

摘要翻译： 用于形成半导体器件的方法包括处理半导体晶片以包括仅部分蚀刻到晶片中的一个或多个通孔或通孔，以及仅限定蚀刻到限定多个半导体器件的晶片中的划痕。 将晶片材料从晶片的背面移除到通孔和划痕的水平面，以形成穿过晶片的通孔，同时将晶片切割成单独的半导体晶片。

公开(公告)号：US20050058411A1

公开(公告)日：2005-03-17

申请号：US10663242

申请日：2003-09-15

申请人： Marc Finot ,  Rickie Lake

发明人： Marc Finot ,  Rickie Lake

IPC分类号： G02B6/42 ,  G02B6/36

CPC分类号： G02B6/4201 ,  G02B6/4248 ,  G02B6/4251 ,  G02B6/4265 ,  G02B6/4267 ,  G02B6/4271

摘要： A hermetically sealable package may be formed from a top portion and a bottom portion mated along a seam at or near a plane of an optical fiber. A completed pill assembly may be positioned directly into the enclosure base without requiring the fiber to be threaded through the feed through or “snout”. The top potion may then be mated with the bottom portion to form the package. A glass solder ring may be placed coaxial with the fiber in the feed through. The seam may be sealed by laser welding and the glass solder ring reflowed by laser heating, for example, with a same laser as used to weld the seam or by resistive or induction heating. In some embodiments a coupling tube around the fiber and snout or the snout itself may have holes to allow solder sealing within the snout and filling the remaining area with epoxy. Since the package is initially split in two pieces, module assembly may be facilitated without threading.

摘要翻译： 可以由沿着光纤平面处或附近的接缝配合的顶部和底部形成气密密封的封装。 完整的药丸组件可以直接定位到外壳基部中，而不需要将纤维穿过进料口或“鼻”。 然后可以将顶部部分与底部配合以形成包装。 玻璃焊环可以与进料通道中的纤维同轴放置。 接缝可以通过激光焊接密封，并且玻璃焊接环通过激光加热回流，例如，与用于焊接接缝或通过电阻或感应加热相同的激光器。 在一些实施例中，围绕纤维和鼻孔或鼻口本身的耦合管可具有孔，以允许焊缝在鼻孔内密封并用环氧树脂填充剩余区域。 由于包装最初分成两部分，所以可以在没有穿线的情况下方便地组装模块。

公开(公告)号：US20060292877A1

公开(公告)日：2006-12-28

申请号：US11168787

申请日：2005-06-28

申请人： Rickie Lake

发明人： Rickie Lake

IPC分类号： H01L21/311 ,  H01L21/302

CPC分类号： H01L21/30655 ,  H01L21/02118 ,  H01L21/0214 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/02282 ,  H01L21/312 ,  H01L21/76898 ,  H01L23/481 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/11 ,  H01L2224/13 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Methods for forming a via and a conductive path are disclosed. The methods include forming a via within a wafer with cyclic etch/polymer phases, followed by an augmented etch phase. The resulting via may include a first portion having a substantially uniform cross section and a second portion in the form of a hollow ball, extending laterally further within the wafer than the first portion. Backgrinding the wafer to the second portion of the via may create a vent. A conductive path may be formed by filling the via with a conductive material, such as solder. Flux gases may escape through the vent. The wafer surrounding the second portion of the via may be removed, exposing a conductive element in the shape of a ball, the shape of the second portion of the via. Semiconductor devices including the conductive paths of the present invention are also disclosed.

摘要翻译： 公开了形成通孔和导电路径的方法。 所述方法包括在具有循环蚀刻/聚合物相的晶片内形成通孔，随后增加蚀刻相位。 所得到的通孔可以包括具有基本上均匀横截面的第一部分和中空球形式的第二部分，其在晶片内横向延伸比第一部分延伸。 将晶片倒入通孔的第二部分可能产生通气口。 可以通过用导电材料（例如焊料）填充通孔来形成导电路径。 助焊剂气体可以通过排气口逸出。 可以去除围绕通孔的第二部分的晶片，将导电元件暴露于球的形状，通孔的第二部分的形状。 还公开了包括本发明的导电路径的半导体器件。

公开(公告)号：US20060234422A1

公开(公告)日：2006-10-19

申请号：US11451398

申请日：2006-06-13

申请人： Warren Farnworth ,  Alan Wood ,  James Wark ,  David Hembree ,  Rickie Lake

发明人： Warren Farnworth ,  Alan Wood ,  James Wark ,  David Hembree ,  Rickie Lake

IPC分类号： H01L21/00

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14683 ,  H01L2224/48227 ,  H01L2224/48091 ,  H01L2924/00014

摘要： Methods of packaging microelectronic imagers and packaged microelectronic imagers. An embodiment of such a method can include providing an imager workpiece having a plurality of imager dies arranged in a die pattern and providing a cover substrate through which a desired radiation can propagate. The imager dies include image sensors and integrated circuitry coupled to the image sensors. The method further includes providing a spacer having a web that includes an adhesive and has openings arranged to be aligned with the image sensors. For example, the web can be a film having an adhesive coating, or the web itself can be a layer of adhesive. The method continues by assembling the imager workpiece with the cover substrate such that (a) the spacer is between the imager workpiece and the cover substrate, and (b) the openings are aligned with the image sensors. The attached web is not cured after the imager workpiece and the cover substrate have both been adhered to the web. As such, the web does not outgas contaminants into the compartments in which the image sensors are housed.

摘要翻译： 包装微电子成像仪和封装的微电子成像仪的方法。 这种方法的实施例可以包括提供具有以模片图案布置的多个成像模具的成像工件，并提供覆盖基板，期望的辐射可以通过该基板传播。 成像器裸片包括耦合到图像传感器的图像传感器和集成电路。 该方法还包括提供具有包括粘合剂并具有布置成与图像传感器对准的开口的腹板的间隔件。 例如，网可以是具有粘合剂涂层的膜，或者网本身可以是一层粘合剂。 该方法通过将成像器工件与盖基板组装成使得（a）间隔件位于成像器工件和盖基板之间，并且（b）开口与图像传感器对准，该方法继续。 在成像器工件和盖基板都已经粘附在卷材上之后，连接的卷材不固化。 因此，纸幅不会将污染物排出到其中容纳图像传感器的隔室中。

公开(公告)号：US20070134471A1

公开(公告)日：2007-06-14

申请号：US11676557

申请日：2007-02-20

申请人： Rickie Lake ,  Charles Watkins

发明人： Rickie Lake ,  Charles Watkins

IPC分类号： B32B3/30

CPC分类号： H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68331 ,  Y10T428/2457 ,  Y10T428/24942

摘要： Methods and apparatuses for releasably attaching microfeature workpieces to support members are disclosed herein. In one embodiment, a method includes applying a first material to a first region on a first side of a microfeature workpiece. The method then includes releasably attaching the first side of the workpiece to a support member. The method further includes applying a second material to a second region on the first side of the workpiece. The second region includes a perimeter portion of the workpiece. The first material and/or the second material can be an adhesive. The second material is removable from the workpiece relative to the first material. In several embodiments, for example, the first material can have a first solubility in a solution and the second material can have a second solubility in the solution less than the first solubility.

摘要翻译： 本文公开了将微型工件可释放地附接到支撑构件的方法和装置。 在一个实施例中，一种方法包括将第一材料施加到微特征工件的第一侧上的第一区域。 该方法然后包括将工件的第一侧可释放地附接到支撑构件。 该方法还包括将第二材料施加到工件的第一侧上的第二区域。 第二区域包括工件的周边部分。 第一材料和/或第二材料可以是粘合剂。 第二材料相对于第一材料可从工件移除。 在几个实施方案中，例如，第一材料可以在溶液中具有第一溶解度，并且第二材料可以在溶液中具有小于第一溶解度的第二溶解度。

公开(公告)号：US20050077609A1

公开(公告)日：2005-04-14

申请号：US10674370

申请日：2003-09-30

申请人： Xiaowei Yao ,  Tam Nguyen ,  Marc Finot ,  Rickie Lake ,  Jeffrey Bennett ,  Robert Kohler

发明人： Xiaowei Yao ,  Tam Nguyen ,  Marc Finot ,  Rickie Lake ,  Jeffrey Bennett ,  Robert Kohler

IPC分类号： C25D5/02 ,  H01L21/48 ,  H01L23/10 ,  H01L23/15 ,  H01L23/36 ,  H01L23/373 ,  H01L23/498 ,  H01L23/66 ,  H05K1/03 ,  H05K1/11 ,  H05K3/24 ,  H01L23/52 ,  H01L21/44 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L23/498 ,  C25D5/02 ,  H01L21/4846 ,  H01L23/10 ,  H01L23/15 ,  H01L23/36 ,  H01L23/3731 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/241 ,  H05K3/243 ,  H05K2201/09354 ,  H01L2924/00

摘要： A circuit package includes a base portion and a first metal pattern disposed on a substrate surface. Second and third metal patterns are disposed on another substrate surface, and electrically coupled to first and second vias. The third metal pattern forms a gap to electrically isolate it from the second metal pattern. A circuit package includes a substrate having an opening and a single heat sink positioned in the opening to expose top and bottom surfaces through top and bottom surfaces of the substrate. Selective plating includes applying first and second metal patterns to a substrate surface, creating a potential voltage difference between the first metal pattern and a metal source, and plating the first metal pattern by attracting a first metal type to the voltage potential of the first metal pattern. The voltage potential of the first metal pattern is less than the voltage potential of the metal source.

摘要翻译： 电路封装包括基部和设置在基板表面上的第一金属图案。 第二和第三金属图案设置在另一基板表面上，并且电耦合到第一和第二通孔。 第三金属图案形成间隙以将其与第二金属图案电隔离。 电路封装包括具有开口的基板和位于开口中的单个散热器，以通过基板的顶表面和底表面露出顶表面和底表面。 选择电镀包括将第一和第二金属图案施加到基板表面，产生第一金属图案和金属源之间的电压差，以及通过将第一金属类型吸引到第一金属图案的电压电位来镀覆第一金属图案 。 第一金属图案的电压电位小于金属源的电压电位。

公开(公告)号：US20060162850A1

公开(公告)日：2006-07-27

申请号：US11042749

申请日：2005-01-24

申请人： Rickie Lake ,  Charles Watkins

发明人： Rickie Lake ,  Charles Watkins

IPC分类号： H01L21/302 ,  B32B37/00

CPC分类号： H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68331 ,  Y10T428/2457 ,  Y10T428/24942

摘要： Methods and apparatuses for releasably attaching microfeature workpieces to support members are disclosed herein. In one embodiment, a method includes applying a first material to a first region on a first side of a microfeature workpiece. The method then includes releasably attaching the first side of the workpiece to a support member. The method further includes applying a second material to a second region on the first side of the workpiece. The second region includes a perimeter portion of the workpiece. The first material and/or the second material can be an adhesive. The second material is removable from the workpiece relative to the first material. In several embodiments, for example, the first material can have a first solubility in a solution and the second material can have a second solubility in the solution less than the first solubility.

摘要翻译： 本文公开了将微型工件可释放地附接到支撑构件的方法和装置。 在一个实施例中，一种方法包括将第一材料施加到微特征工件的第一侧上的第一区域。 该方法然后包括将工件的第一侧可释放地附接到支撑构件。 该方法还包括将第二材料施加到工件的第一侧上的第二区域。 第二区域包括工件的周边部分。 第一材料和/或第二材料可以是粘合剂。 第二材料相对于第一材料可从工件移除。 在几个实施方案中，例如，第一材料可以在溶液中具有第一溶解度，并且第二材料可以在溶液中具有小于第一溶解度的第二溶解度。

公开(公告)号：US20060121732A1

公开(公告)日：2006-06-08

申请号：US11334172

申请日：2006-01-18

申请人： Xiaowei Yao ,  Tam Nguyen ,  Marc Finot ,  Rickie Lake ,  Jeffrey Bennett ,  Robert Kohler

发明人： Xiaowei Yao ,  Tam Nguyen ,  Marc Finot ,  Rickie Lake ,  Jeffrey Bennett ,  Robert Kohler

IPC分类号： H01L21/44 ,  H01L23/12 ,  H01L23/34 ,  H01L23/053

CPC分类号： H01L23/498 ,  C25D5/02 ,  H01L21/4846 ,  H01L23/10 ,  H01L23/15 ,  H01L23/36 ,  H01L23/3731 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/241 ,  H05K3/243 ,  H05K2201/09354 ,  H01L2924/00

摘要： A circuit package includes a substrate having an opening and a single unitary heat sink adapted to effectively dissipate heat is positioned in the opening to expose top and bottom surfaces which are respectively coplanar with top and bottom surfaces of the substrate. Selective plating includes applying first and second metal patterns to a substrate surface, creating a potential voltage difference between the first metal pattern and a metal source, and plating the first metal pattern by attracting a first metal type to the voltage potential of the first metal pattern. The voltage potential of the first metal pattern is less than the voltage potential of the metal source.

摘要翻译： 电路封装包括具有开口的基板和适于有效散发热量的单个整体式散热器，其位于开口中以暴露与基板的顶表面和底表面共面的顶表面和底表面。 选择性电镀包括将第一和第二金属图案施加到基板表面，产生第一金属图案和金属源之间的电位差，并且通过将第一金属类型吸引到第一金属图案的电压电位来镀覆第一金属图案 。 第一金属图案的电压电位小于金属源的电压电位。