公开(公告)号：US20110118807A1

公开(公告)日：2011-05-19

申请号：US12976650

申请日：2010-12-22

申请人： Robert J. Greenberg ,  Jerry Ok ,  Jordan Neysmith ,  Kevin Wilkins ,  Neil Hamilton Talbot ,  Da-Yu Chang

发明人： Robert J. Greenberg ,  Jerry Ok ,  Jordan Neysmith ,  Kevin Wilkins ,  Neil Hamilton Talbot ,  Da-Yu Chang

IPC分类号： A61F9/08 ,  A61N1/36

CPC分类号： A61N1/36046 ,  A61N1/0543 ,  A61N1/375 ,  A61N1/3758 ,  A61N1/3787 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/19104 ,  H01L2924/19107

摘要： The present invention is an improved package and configuration for an implantable retinal prosthesis. The retinal prosthesis of the present invention includes an electrode array suitable to be mounted in close proximity to a retina, an electronics package and inductive receiving coil mounted next to each other on a strap surrounding the sclera so that the height above the sclera of the prosthesis is minimized.

摘要翻译： 本发明是用于植入式视网膜假体的改进的包装和构造。 本发明的视网膜假体包括适于安装在视网膜附近的电极阵列，电子封装和感应接收线圈，其彼此相邻地安置在围绕巩膜的带上，使得假体巩膜上方的高度 被最小化。

公开(公告)号：US07881799B2

公开(公告)日：2011-02-01

申请号：US11385315

申请日：2006-03-20

申请人： Robert J. Greenberg ,  Jerry Ok ,  Jordan Neysmith ,  Kevin Wilkins ,  Neil Hamilton Talbot ,  Da-Yu Chang

发明人： Robert J. Greenberg ,  Jerry Ok ,  Jordan Neysmith ,  Kevin Wilkins ,  Neil Hamilton Talbot ,  Da-Yu Chang

IPC分类号： A61N1/18

CPC分类号： A61N1/36046 ,  A61N1/0543 ,  A61N1/375 ,  A61N1/3758 ,  A61N1/3787 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/19104 ,  H01L2924/19107

摘要： An improved package and configuration for an implantable retinal prosthesis includes an electrode array suitable to be mounted in close proximity to a retina, an electronics package, and inductive receiving coil mounted next to each other on a strap surrounding the sclera so that the height above the sclera of the prosthesis is minimized.

摘要翻译： 用于可植入视网膜假体的改进的包装和构造包括适于安装在靠近视网膜的电极阵列，电子封装和在包围巩膜的带上彼此相邻安装的感应接收线圈，使得高于 假体的巩膜最小化。

公开(公告)号：US08527057B2

公开(公告)日：2013-09-03

申请号：US12976650

申请日：2010-12-22

申请人： Robert J. Greenberg ,  Jerry Ok ,  Jordan Neysmith ,  Kevin Wilkins ,  Neil Hamilton Talbot ,  Da-Yu Chang

发明人： Robert J. Greenberg ,  Jerry Ok ,  Jordan Neysmith ,  Kevin Wilkins ,  Neil Hamilton Talbot ,  Da-Yu Chang

IPC分类号： A61N1/18

CPC分类号： A61N1/36046 ,  A61N1/0543 ,  A61N1/375 ,  A61N1/3758 ,  A61N1/3787 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/19104 ,  H01L2924/19107

摘要： The present invention is an improved package and configuration for an implantable retinal prosthesis. The retinal prosthesis of the present invention includes an electrode array suitable to be mounted in close proximity to a retina, an electronics package and inductive receiving coil mounted next to each other on a strap surrounding the sclera so that the height above the sclera of the prosthesis is minimized.

摘要翻译： 本发明是用于植入式视网膜假体的改进的包装和构造。 本发明的视网膜假体包括适于安装在视网膜附近的电极阵列，电子封装和感应接收线圈，其彼此相邻地安置在围绕巩膜的带上，使得假体巩膜上方的高度 被最小化。

公开(公告)号：US07873419B2

公开(公告)日：2011-01-18

申请号：US11927315

申请日：2007-10-29

申请人： Robert J. Greenberg ,  Jerry Ok ,  Jordan Neysmith ,  Kevin Wilkin ,  Neil Hamilton Talbot ,  Da-Yu Chang

发明人： Robert J. Greenberg ,  Jerry Ok ,  Jordan Neysmith ,  Kevin Wilkin ,  Neil Hamilton Talbot ,  Da-Yu Chang

IPC分类号： A61N1/18

CPC分类号： A61N1/36046 ,  A61N1/0543 ,  A61N1/375 ,  A61N1/3758 ,  A61N1/3787 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/19104 ,  H01L2924/19107

摘要： An improved package and configuration for an implantable retinal prosthesis includes an electrode array suitable to be mounted in close proximity to a retina, an electronics package, and an inductive receiving coil mounted next to each other on a strap surrounding the sclera so that the height above the sclera of the prosthesis is minimized.

摘要翻译： 用于植入式视网膜假体的改进的包装和构造包括适于安装在靠近视网膜的电极阵列，电子封装和在包围巩膜的带上彼此相邻安装的感应接收线圈，使得高于 假体的巩膜最小化。

公开(公告)号：US08473048B2

公开(公告)日：2013-06-25

申请号：US11385314

申请日：2006-03-20

申请人： Robert J. Greenberg ,  Jerry Ok ,  Jordan Neysmith ,  Kevin Wilkin ,  Neil Hamilton Talbot ,  Da-Yu Chang

发明人： Robert J. Greenberg ,  Jerry Ok ,  Jordan Neysmith ,  Kevin Wilkin ,  Neil Hamilton Talbot ,  Da-Yu Chang

IPC分类号： A61N1/375

CPC分类号： A61N1/36046 ,  A61N1/0543 ,  A61N1/375 ,  A61N1/3758 ,  A61N1/3787 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/19104 ,  H01L2924/19107

摘要： The present invention is an improved hermetic package for implantation in the human body. The implantable device of the present invention includes an eclectically non-conductive bass including electrically conductive vias through the substrate. A circuit is flip-chip bonded to a subset of the vias. A second circuit is wire bonded to another subset of the vias. Finally, a cover is bonded to the substrate such that the cover, substrate and vias form a hermetic package.

摘要翻译： 本发明是用于植入人体的改进的密封包装。 本发明的可植入装置包括包含通过基底的导电通路的折衷不导电的低音。 电路倒装芯片结合到通孔的子集。 第二电路被引线接合到通孔的另一子集。 最后，将覆盖物粘合到基底上，使得盖，基底和通孔形成密封包装。

公开(公告)号：US07904148B2

公开(公告)日：2011-03-08

申请号：US11517860

申请日：2006-09-07

申请人： Robert J. Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  Dao Min Zhou

发明人： Robert J. Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  Dao Min Zhou

IPC分类号： A61N1/00

CPC分类号： A61N1/3758 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/375 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13169 ,  H01L2224/13178 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81469 ,  H01L2224/81478 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/189 ,  H05K3/10 ,  H05K3/188 ,  H05K3/305 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K13/0469 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/05 ,  H05K2203/06 ,  H05K2203/0733 ,  H05K2203/09 ,  H05K2203/107 ,  H05K2203/1446 ,  H01L2924/00 ,  H01L2224/05599

摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

摘要翻译： 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法以及所得到的电子封装，其适于植入生物组织，例如用于视网膜或皮质电极阵列，以使视力恢复 对某些无意识的个人。 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US07142909B2

公开(公告)日：2006-11-28

申请号：US10236396

申请日：2002-09-06

申请人： Robert J. Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  Dao Min Zhou

发明人： Robert J. Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  Dao Min Zhou

IPC分类号： A61N1/00

CPC分类号： A61N1/3758 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/375 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13169 ,  H01L2224/13178 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81469 ,  H01L2224/81478 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/189 ,  H05K3/10 ,  H05K3/188 ,  H05K3/305 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K13/0469 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/05 ,  H05K2203/06 ,  H05K2203/0733 ,  H05K2203/09 ,  H05K2203/107 ,  H05K2203/1446 ,  H01L2924/00 ,  H01L2224/05599

摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

公开(公告)号：US08880165B2

公开(公告)日：2014-11-04

申请号：US13009769

申请日：2011-01-19

申请人： Robert J. Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  Dao Min Zhou

发明人： Robert J. Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  Dao Min Zhou

IPC分类号： A61N1/00 ,  A61N1/36 ,  A61N1/05 ,  A61N1/375 ,  H01L23/498 ,  H05K3/36 ,  H05K1/03 ,  H05K3/46 ,  H05K3/32 ,  H05K3/42 ,  H01L21/56 ,  H05K3/40

CPC分类号： A61N1/3758 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/375 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13169 ,  H01L2224/13178 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81469 ,  H01L2224/81478 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/189 ,  H05K3/10 ,  H05K3/188 ,  H05K3/305 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K13/0469 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/05 ,  H05K2203/06 ,  H05K2203/0733 ,  H05K2203/09 ,  H05K2203/107 ,  H05K2203/1446 ,  H01L2924/00 ,  H01L2224/05599

摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

摘要翻译： 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法以及所得到的电子封装，其适于植入生物组织，例如用于视网膜或皮质电极阵列，以使视力恢复 对某些无意识的个人。 电气密封的电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US20080046021A1

公开(公告)日：2008-02-21

申请号：US11924469

申请日：2007-10-25

申请人： Robert Greenberg ,  Jerry Ok ,  Jordan Neysmith ,  Kevin Wilkins

发明人： Robert Greenberg ,  Jerry Ok ,  Jordan Neysmith ,  Kevin Wilkins

IPC分类号： A61N1/02

CPC分类号： A61N1/36046 ,  A61N1/0543 ,  A61N1/375 ,  A61N1/3758 ,  A61N1/3787 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/19104 ,  H01L2924/19107

摘要： The present invention is an improved hermetic package for implantation in the human body. The implantable device of the present invention includes an eclectically non-conductive bass including electrically conductive vias through the substrate. A circuit is flip-chip bonded to a subset of the vias. A second circuit is wire bonded to another subset of the vias. Finally, a cover is bonded to the substrate such that the cover, substrate and vias form a hermetic package.

摘要翻译： 本发明是用于植入人体的改进的密封包装。 本发明的可植入装置包括包含通过基底的导电通路的折衷不导电的低音。 电路倒装芯片结合到通孔的子集。 第二电路被引线接合到通孔的另一子集。 最后，将覆盖物粘合到基底上，使得盖，基底和通孔形成密封包装。

公开(公告)号：US20070041164A1

公开(公告)日：2007-02-22

申请号：US11385314

申请日：2006-03-20

申请人： Robert Greenberg ,  Jerry Ok ,  Jordan Neysmith ,  Kevin Wilkin

发明人： Robert Greenberg ,  Jerry Ok ,  Jordan Neysmith ,  Kevin Wilkin

IPC分类号： A61N1/375

CPC分类号： A61N1/36046 ,  A61N1/0543 ,  A61N1/375 ,  A61N1/3758 ,  A61N1/3787 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/19104 ,  H01L2924/19107

摘要： The present invention is an improved hermetic package for implantation in the human body. The implantable device of the present invention includes an eclectically non-conductive bass including electrically conductive vias through the substrate. A circuit is flip-chip bonded to a subset of the vias. A second circuit is wire bonded to another subset of the vias. Finally, a cover is bonded to the substrate such that the cover, substrate and vias form a hermetic package.

摘要翻译： 本发明是用于植入人体的改进的密封包装。 本发明的可植入装置包括包含通过基底的导电通路的折衷不导电的低音。 电路倒装芯片结合到通孔的子集。 第二电路被引线接合到通孔的另一子集。 最后，将覆盖物粘合到基底上，使得盖，基底和通孔形成密封包装。