公开(公告)号：US20060102867A1

公开(公告)日：2006-05-18

申请号：US10519674

申请日：2003-07-09

申请人： Ryo Matsuhashi ,  Kazuhiro Suetsugu ,  Hideyuki Miyagawa ,  Toshio Kita ,  Kyota Sogabe ,  Kazuhiro Yoshikawa ,  Akihiro Morimoto ,  Jyunji Sato ,  Kunihiko Daido ,  Hirokatsu Maeda

发明人： Ryo Matsuhashi ,  Kazuhiro Suetsugu ,  Hideyuki Miyagawa ,  Toshio Kita ,  Kyota Sogabe ,  Kazuhiro Yoshikawa ,  Akihiro Morimoto ,  Jyunji Sato ,  Kunihiko Daido ,  Hirokatsu Maeda

IPC分类号： F16K25/00

CPC分类号： F16K1/385 ,  F16K1/04 ,  F16K1/38 ,  F16K1/482 ,  F16K25/005

摘要： A fluid control device 1 comprises a metal body 2 having a fluid inlet channel 2a, a fluid outlet channel 2b and a communication channel 2c for holding the two channels in communication, and a metal slide member 3 vertically movable in a vertical passage 11 including the communication channel 2c for closing or opening the communication channel 2c with an end portion thereof. At least the end portion 3a of the slide member 3 is made of an alloy comprising, in % by weight, 0.001 to 0.01% of C, up to 5% of Si, up to 2% of Mn, up to 0.03% of P, up to 100 ppm of S, up to 50 ppm of O, 18 to 25% of Cr, 15 to 25% of Ni, 4.5 to 7.0% of Mo, 0.5 to 3.0% of Cu, 0.1 to 0.3% of N, and the balance substantially Fe and other inevitable impurities.

摘要翻译： 流体控制装置1包括具有流体入口通道2a，流体出口通道2b和用于保持两个通道连通的连通通道2c的金属体2以及在垂直通道中垂直移动的金属滑动构件3 包括用于关闭或打开具有其端部的通信信道2c的通信信道2c。 至少滑动构件3的端部3a由合金制成，其以重量％计含有0.001至0.01％的C，至多5％的Si，至多2％的Mn，至多0.03％的 P，高达100ppm的S，高达50ppm的O，18〜25％的Cr，15〜25％的Ni，4.5〜7.0％的Mo，0.5〜3.0％的Cu，0.1〜0.3％的N ，余量基本上为Fe等不可避免的杂质。

公开(公告)号：US20060152001A1

公开(公告)日：2006-07-13

申请号：US10519673

申请日：2003-07-09

申请人： Ryo Matsuhashi ,  Kazuhiro Suetsugu ,  Hideyuki Miyagawa ,  Toshio Kita ,  Kyota Sogabe ,  Kazuhiro Yoshikawa ,  Akihiro Morimoto ,  Jyunji Sato ,  Kunihiko Daido ,  Hisatoshi Akamoto ,  Yoshiki Kimura

发明人： Ryo Matsuhashi ,  Kazuhiro Suetsugu ,  Hideyuki Miyagawa ,  Toshio Kita ,  Kyota Sogabe ,  Kazuhiro Yoshikawa ,  Akihiro Morimoto ,  Jyunji Sato ,  Kunihiko Daido ,  Hisatoshi Akamoto ,  Yoshiki Kimura

IPC分类号： F16L19/06

CPC分类号： C22C38/46 ,  C22C38/001 ,  C22C38/42 ,  C22C38/44 ,  F16J15/102 ,  F16K7/123 ,  F16K27/0236 ,  F16K31/122 ,  F16L19/0218 ,  F16L19/103 ,  F16L58/184

摘要： A specified metal member included among the components of a valve, coupling or like fluid handling part for use in piping and fluid control devices is made of an alloy comprising, in % by weight, 0.001 to 0.01% of C, up to 5% of Si, up to 2% of Mn, up to 0.03% of P, up to 100 ppm of S, up to 50 ppm of O, 18 to 25% of Cr, 15 to 25% of Ni, 4.5 to 7.0% of Mo, 0.5 to 3.0% of Cu, 0.1 to 0.3% of N, and the balance substantially Fe and other inevitable impurities, the alloy having a CRI (crevice corrosion resistance index) value in the range of 40≦CRI≦55, as determined from the expression CRI=[Cr]+4×[Mo]+30×[N] wherein the amount of alloy components present in combination in the alloy to ensure crevice corrosion resistance are expressed in % by weight.

摘要翻译： 包括在用于管道和流体控制装置的阀，联接器或类似流体处理部件的部件中的特定金属构件由合金制成，其包含以重量％计的0.001至0.01％的C，至多5％的 Si，高达2％的Mn，高达0.03％的P，高达100ppm的S，至多50ppm的O，18至25％的Cr，15至25％的Ni，4.5至7.0％的Mo ，0.5〜3.0％的Cu，0.1〜0.3％的N，余量基本上为Fe和其他不可避免的杂质，该合金的CRI（缝隙耐腐蚀指数）值在40 <= CRI <= 55的范围内，为 由CrI = [Cr] + 4x [Mo] + 30x [N]的表达式确定，其中合金中组合存在的合金组分的量确保耐缝隙腐蚀性以重量％表示。

公开(公告)号：US20060102868A1

公开(公告)日：2006-05-18

申请号：US10519675

申请日：2003-07-09

申请人： Ryo Matsuhashi ,  Kazuhiro Suetsugu ,  Hideyuki Miyagawa ,  Toshio Kita ,  Kyota Sogabe ,  Kazuhiro Yoshikawa ,  Akihiro Morimoto ,  Jyunji Sato ,  Kunihiko Daido ,  Masahiko Sogao ,  Yoshiaki Chikaike

发明人： Ryo Matsuhashi ,  Kazuhiro Suetsugu ,  Hideyuki Miyagawa ,  Toshio Kita ,  Kyota Sogabe ,  Kazuhiro Yoshikawa ,  Akihiro Morimoto ,  Jyunji Sato ,  Kunihiko Daido ,  Masahiko Sogao ,  Yoshiaki Chikaike

IPC分类号： F16K25/00

CPC分类号： F16K27/0236 ,  C22C38/001 ,  C22C38/42 ,  C22C38/44 ,  F16K27/00 ,  F16L19/103 ,  F16L58/184

摘要： A specified metal member (e.g., a bolt) 5 included among a plurality of components 2, 3, 4, 5, 6 of a fluid handling part and having a surface exposed on an exterior of the fluid handling part is made of an alloy comprising, in % by weight, 0.001 to 0.01% of C, up to 5% of Si, up to 2% of Mn, up to 0.03% of P, up to 100 ppm of S, up to 50 ppm of O, 18 to 25% of Cr, 15 to 25% of Ni, 4.5 to 7.0% of Mo, 0.5 to 3.0% of Cu, 0.1 to 0.3% of N, and the balance substantially Fe and other inevitable impurities.

摘要翻译： 包括在流体处理部分的多个部件2,3,4,5,6中并且具有暴露在流体处理部分的外部上的表面的特定金属部件（例如，螺栓）5由合金制成，该合金包括 ，以重量％计，C：0.001〜0.01％，Si：5％以下，Mn：0.2％以下，P：0.03以下，S：100ppm以下，O：18〜 25％的Cr，15〜25％的Ni，4.5〜7.0％的Mo，0.5〜3.0％的Cu，0.1〜0.3％的N，余量基本上是Fe和其他不可避免的杂质。

公开(公告)号：US20060091672A1

公开(公告)日：2006-05-04

申请号：US10519672

申请日：2003-07-09

申请人： Ryo Matsuhashi ,  Kazuhiro Suetsugu ,  Hideyuki Miyagawa ,  Toshio Kita ,  Kyota Sogabe ,  Kazuhiro Yoshikawa ,  Akihiro Morimoto ,  Jyunji Sato ,  Kunihiko Shimomura ,  Yoshinori Shimomura ,  Takayasu Nakahama

发明人： Ryo Matsuhashi ,  Kazuhiro Suetsugu ,  Hideyuki Miyagawa ,  Toshio Kita ,  Kyota Sogabe ,  Kazuhiro Yoshikawa ,  Akihiro Morimoto ,  Jyunji Sato ,  Kunihiko Shimomura ,  Yoshinori Shimomura ,  Takayasu Nakahama

IPC分类号： F16L37/00

CPC分类号： F16L19/061 ,  C22C38/001 ,  C22C38/42 ,  C22C38/44 ,  F16L19/08

摘要： A pipe coupling 30 comprises a tubular body 31 for a pipe 32 to be inserted in through the rear end thereof, a front ring 33 and a back ring 34 to be fitted around the pipe 32 projecting from the rear end of the body 31, and a cap nut 35 for tightening up the front and back rings 33, 34 to fix the pipe 32 to the body 31. The back ring 34 is made of an alloy comprising, in % by weight, 0.001 to 0.01% of C, up to 5% of Si, up to 2% of Mn, up to 0.03% of P, up to 100 ppm of S, up to 50 ppm of O, 18 to 25% of Cr, 15 to 25% of Ni, 4.5 to 7.0% of Mo, 0.5 to 3.0% of Cu, 0.1 to 0.3% of N, and the balance substantially Fe and other inevitable impurities.

摘要翻译： 管接头30包括用于管32的管状体31，其通过其后端插入，前环33和后环34围绕从主体31的后端突出的管32配合，以及 用于紧固前后环33,34以将管32固定到主体31的盖螺母35。 后环34由以重量％计含有0.001至0.01％C，至多5％Si，至多2％Mn，至多0.03％P，至多100ppm S ，高达50ppm的O，18〜25％的Cr，15〜25％的Ni，4.5〜7.0％的Mo，0.5〜3.0％的Cu，0.1〜0.3％的N，余量基本上是Fe等 不可避免的杂质。

公开(公告)号：US06408879B1

公开(公告)日：2002-06-25

申请号：US09127817

申请日：1998-08-03

申请人： Tadahiro Ohmi ,  Yukio Minami ,  Akihiro Morimoto ,  Nobukazu Ikeda ,  Keiji Hirao ,  Takashi Hirose ,  Michio Yamaji ,  Kazuhiro Yoshikawa

发明人： Tadahiro Ohmi ,  Yukio Minami ,  Akihiro Morimoto ,  Nobukazu Ikeda ,  Keiji Hirao ,  Takashi Hirose ,  Michio Yamaji ,  Kazuhiro Yoshikawa

IPC分类号： F16K1100

CPC分类号： F16K27/003 ,  Y10T137/87684

摘要： A fluid control device comprises a first passageway, and a second passageway communicating therewith and having a terminating end closed with a fluid control unit or instrument. The first passageway is adapted to pass a fluid therethrough with a different fluid remaining in the second passageway. The first passageway comprises an upstream portion and a downstream portion communicating with the upstream portion at an approximate right angle therewith. The second passageway extends from a terminating end of the upstream portion of the first passageway in alignment with the upstream portion.

公开(公告)号：US08455969B2

公开(公告)日：2013-06-04

申请号：US12078894

申请日：2008-04-08

申请人： Yoshihiro Nabe ,  Masaki Hatano ,  Hiroshi Asami ,  Akihiro Morimoto

发明人： Yoshihiro Nabe ,  Masaki Hatano ,  Hiroshi Asami ,  Akihiro Morimoto

IPC分类号： H01L31/00 ,  H01L21/00

CPC分类号： H01L27/14618 ,  H01L21/76898 ,  H01L23/3677 ,  H01L23/481 ,  H01L31/0203 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/0557 ,  H01L2224/05647 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10158 ,  H01L2924/16235 ,  H01L2924/3025 ,  H01L2924/00014

摘要： A semiconductor device includes a semiconductor substrate having a first electronic circuit and a second electronic circuit formed on an active surface, a pad electrode formed on the active surface by being connected to the first electronic circuit and/or the second electronic circuit, a first opening formed to some point along a depth of the semiconductor substrate toward the pad electrode from a surface opposite to the active surface of the semiconductor substrate, a second opening formed so as to reach the pad electrode from a bottom surface of the first opening, an insulating layer formed by covering sidewall surfaces of the first opening and the second opening, a conductive layer formed by covering at least an inner wall surface of the insulating layer and a bottom surface of the second opening, a third opening formed to some point along the depth of the semiconductor substrate from the surface opposite to the active surface of the semiconductor substrate, and a heat insulator imbedded in the third opening.

摘要翻译： 半导体器件包括具有第一电子电路和形成在有源表面上的第二电子电路的半导体衬底，通过连接到第一电子电路和/或第二电子电路而形成在有源表面上的焊盘电极，第一开口 从与半导体基板的有源面相反的表面沿着半导体基板的深度朝向焊盘电极的某一点形成第二开口，从第一开口的底面到达焊盘电极，形成绝缘体 通过覆盖第一开口和第二开口的侧壁表面形成的层，通过覆盖绝缘层的至少内壁表面和第二开口的底表面形成的导电层，形成在沿着深度的某个点的第三开口 的半导体衬底从与半导体衬底的有源表面相反的表面，以及绝热体imb 在第三次开幕。

公开(公告)号：US08227912B2

公开(公告)日：2012-07-24

申请号：US11664279

申请日：2004-10-10

申请人： Tadahiro Ohmi ,  Akihiro Morimoto

发明人： Tadahiro Ohmi ,  Akihiro Morimoto

IPC分类号： H01L23/36

CPC分类号： H01L29/7813 ,  H01L21/84 ,  H01L27/12 ,  H01L29/045 ,  H01L29/41741 ,  H01L29/456 ,  H01L29/66734 ,  H01L29/732 ,  H01L29/7397 ,  H01L29/74 ,  H01L29/744 ,  H01L29/78603 ,  H01L2924/0002 ,  H05K1/053 ,  H01L2924/00

摘要： As a substrate for a semiconductor device, a metal substrate is used, and the metal substrate is composed of a metal base body made of a first metal and a connecting metal layer made of a second metal for covering the metal base body. The substrate has a structure wherein a diffusion preventing layer for preventing diffusion of the first metal is provided on the connecting metal layer.

摘要翻译： 作为半导体装置的基板，使用金属基板，金属基板由第一金属制的金属基体和由覆盖金属基体的第二金属构成的连接金属层构成。 基板具有其中在连接金属层上设置防止第一金属扩散的扩散防止层的结构。

公开(公告)号：US08217270B2

公开(公告)日：2012-07-10

申请号：US11990860

申请日：2006-08-18

申请人： Tadahiro Ohmi ,  Akinobu Teramoto ,  Akihiro Morimoto

发明人： Tadahiro Ohmi ,  Akinobu Teramoto ,  Akihiro Morimoto

IPC分类号： H05K1/03

CPC分类号： H05K1/024 ,  H05K3/4602 ,  H05K3/4626 ,  H05K3/4673 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0254

摘要： A multilayered circuit board which is provided with a low-permittivity interlayer insulating film, and which can significantly improve the performance such as signal transmission characteristics of the multilayered circuit board such as a package and a printed board, because the surface in contact with the interlayer insulating film of the circuit board has no unevenness to eliminate the lowering of production yield and the deterioration of high-frequency signal transmission characteristics; and electronic equipment using the circuit board. The multilayered circuit board comprises, mounted on a substrate, plural wiring layers and plural insulating layers positioned between the plural wiring layers, wherein at least part of the plural insulating layers are composed of a porous insulating layer containing at least any of materials selected from a porous material group consisting of porous material, aerogel, porous silica, porous polymer, hollow silica and hollow polymer, and a non-porous insulating layer formed on at least one surface of the porous insulating layer and not containing the porous material group.

摘要翻译： 具有低介电常数层间绝缘膜的多层电路板，能够显着地提高诸如封装和印刷电路板的多层电路板的信号传输特性等性能，因为与中间层 电路板的绝缘膜没有不均匀性，消除了生产成本的降低和高频信号传输特性的恶化; 和使用电路板的电子设备。 多层电路板包括安装在基板上的多个布线层和位于多个布线层之间的多个绝缘层，其中多个绝缘层的至少一部分由多孔绝缘层组成，多孔绝缘层至少含有选自 由多孔材料，气凝胶，多孔二氧化硅，多孔聚合物，中空二氧化硅和中空聚合物组成的多孔材料组和形成在多孔绝缘层的至少一个表面上并且不包含多孔材料组的无孔绝缘层。

公开(公告)号：US08188372B2

公开(公告)日：2012-05-29

申请号：US12442016

申请日：2006-09-21

申请人： Akihiro Sato ,  Masahiro Sasaki ,  Tadahiro Ohmi ,  Akihiro Morimoto

发明人： Akihiro Sato ,  Masahiro Sasaki ,  Tadahiro Ohmi ,  Akihiro Morimoto

IPC分类号： H05K1/02 ,  H05K3/46

CPC分类号： H05K3/4691 ,  C23F1/02 ,  C23F1/18 ,  C23F4/00 ,  C23F4/04 ,  H05K3/064 ,  H05K3/243 ,  H05K3/4652 ,  H05K2201/09736 ,  H05K2203/0369 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/10

摘要： A flex-rigid printed wiring board is provided which can retain flexibility of a flexible portion while increasing durability of the flexible portion against folding, and can ensure conduction in a rigid portion, and a method of manufacturing the printed wiring board.The flex-rigid printed wiring board includes a conductor layer provided on at least one face of a base film, one region of the wiring board containing the base film being a rigid region, an another region containing the base film being a flexible region. The average thickness “tf” of the conductor layer on the base film formed in the flexible region and the average thickness “tR” of the conductor layer on the base film formed in the rigid region satisfy the relationship of tf

摘要翻译： 提供柔性刚性印刷线路板，其可以保持柔性部分的柔性，同时增加柔性部分的折叠的耐久性，并且可以确保刚性部分中的导电性，以及制造印刷线路板的方法。 柔性刚性印刷电路板包括设置在基膜的至少一个面上的导体层，所述布线基板的一个区域包含基膜为刚性区域，另一区域包含基膜为柔性区域。 形成在柔性区域的基底膜上的导体层的平均厚度“tf”和形成在刚性区域中的基底膜上的导体层的平均厚度“tR”满足tf

公开(公告)号：US07988130B2

公开(公告)日：2011-08-02

申请号：US12208949

申请日：2008-09-11

申请人： Tadahiro Ohmi ,  Nobukazu Ikeda ,  Michio Yamaji ,  Masafumi Kitano ,  Akihiro Morimoto

发明人： Tadahiro Ohmi ,  Nobukazu Ikeda ,  Michio Yamaji ,  Masafumi Kitano ,  Akihiro Morimoto

IPC分类号： F16K7/17

CPC分类号： F16K7/14 ,  F16K27/003 ,  F16K51/02

摘要： The invention provides a valve and a method of operating the valve that makes it possible to reduce the diameter of the vacuum exhaustion pipings to make the facility for the vacuum exhaustion system small, which results in lower costs and shortens vacuum exhaustion time, and also which can prevent corrosion, cloggings, and seal leakages inside the piping system caused by the accumulation of substances produced by the decomposition of gas flowing through the pipings. In particular, in accordance with the present invention, an aluminum passivation is applied on the piping parts, i.e. the valve and others, that are used in the vacuum exhaustion system so as to inhibit gas decomposition caused by temperature rise at the time of baking so that components for reduction in the diameter size in the vacuum exhaustion system are provided. Thus, corrosion, cloggings and seat leakages caused by gas decomposition are prevented.

摘要翻译： 本发明提供了一种操作阀门的阀门和方法，其使得可以减小真空排气管道的直径，从而使得真空耗尽系统的设备较小，这导致降低成本并缩短真空耗尽时间，以及哪些 可以防止由流经管道的气体分解产生的物质积聚引起的管道系统内的腐蚀，堵塞和密封泄漏。 特别地，根据本发明，在真空耗尽系统中使用的管道部件即阀等上施加铝钝化，以便抑制由于烘烤时由温度升高引起的气体分解 提供了用于减小真空排气系统中的直径尺寸的部件。 因此，防止由气体分解引起的腐蚀，堵塞和座椅泄漏。