-
公开(公告)号：US20050263905A1
公开(公告)日：2005-12-01
申请号：US11138932
申请日：2005-05-25
申请人： Ryosuke Usul , Hideki Mizuhara , Yusuke Igarashi , Nobuhisa Takakusaki , Hayato Abe , Takeshi Nakamura
发明人： Ryosuke Usul , Hideki Mizuhara , Yusuke Igarashi , Nobuhisa Takakusaki , Hayato Abe , Takeshi Nakamura
IPC分类号： H01L21/48 , H01L23/31 , H01L23/48 , H01L23/498 , H01L23/538 , H01L25/16 , H05K1/02 , H05K1/05 , H05K3/00 , H05K3/28 , H05K3/42 , H05K3/46
CPC分类号： H01L21/486 , H01L23/3121 , H01L23/49822 , H01L23/49827 , H01L23/5383 , H01L24/73 , H01L24/97 , H01L25/16 , H01L25/165 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48472 , H01L2224/73265 , H01L2224/97 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/1301 , H01L2924/13055 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19105 , H01L2924/351 , H05K1/0206 , H05K1/056 , H05K3/0035 , H05K3/284 , H05K3/421 , H05K3/423 , H05K3/4647 , H05K3/4652 , H05K3/4655 , H05K2201/0195 , H05K2201/0209 , H05K2201/09509 , H05K2201/09563 , H05K2201/096 , H05K2201/09881 , H05K2203/0369 , H05K2203/0554 , H05K2203/1476 , Y10T29/49126 , Y10T29/49156 , Y10T29/49165 , H01L2224/83 , H01L2924/00014 , H01L2224/85 , H01L2224/92247 , H01L2924/00 , H01L2924/00012
摘要： A method for manufacturing a circuit device, which is suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, is provided. In a method for manufacturing a hybrid integrated circuit device of the present invention, a first wring layer is formed by laminating a first conductive film on a first insulating layer, and patterning the first conductive film. In the first wiring layer, a first connection part which is protruded in a thickness direction is formed. Moreover, the first wiring layer including the first connection part is covered with a second insulating layer. The second insulating layer is formed of a first resin film and a second resin film. The second resin film contains fewer inorganic fillers than the first resin film. Thus, there is an advantage that a through-hole can be easily formed.
摘要翻译： 本发明提供一种适于通过绝缘层将多层叠布线层彼此连接的电路装置的制造方法。 在本发明的混合集成电路器件的制造方法中，通过在第一绝缘层上层叠第一导电膜，对第一导电膜进行构图来形成第一绞合层。 在第一布线层中，形成沿厚度方向突出的第一连接部。 此外，包括第一连接部的第一布线层被第二绝缘层覆盖。 第二绝缘层由第一树脂膜和第二树脂膜形成。 第二树脂膜比第一树脂膜含有更少的无机填料。 因此，具有可以容易地形成通孔的优点。
-
公开(公告)号：US07768132B2
公开(公告)日：2010-08-03
申请号：US11165680
申请日：2005-06-24
CPC分类号： H01L23/5384 , H01L23/3128 , H01L24/48 , H01L2221/68377 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48465 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H05K3/4647 , H05K2201/0355 , H05K2201/09509 , H05K2201/09563 , H05K2203/0369 , H05K2203/0733 , H05K2203/1476 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A circuit device including a multilayer wiring structure having an improved heat radiation performance, and a manufacturing method thereof is provided. A circuit device of the invention includes a first wiring layer and a second wiring layer laminated while interposing a first insulating layer. The first wiring layer is connected to the second wiring layer in a desired position through a connecting portion formed so as to penetrate the first insulating layer. The connecting portion includes a first connecting portion protruding in a thickness direction from the first wiring layer, and a second connecting portion protruding in the thickness direction from the second wiring layer. The first connecting portion and the second connecting portion contact each other at an intermediate portion in the thickness direction of the insulating layer.
摘要翻译： 提供一种包括具有改善的散热性能的多层布线结构的电路装置及其制造方法。 本发明的电路器件包括第一布线层和在插入第一绝缘层的同时层叠的第二布线层。 第一布线层通过形成为穿透第一绝缘层的连接部分而在期望位置连接到第二布线层。 连接部分包括从第一布线层沿厚度方向突出的第一连接部分和从第二布线层沿厚度方向突出的第二连接部分。 第一连接部和第二连接部在绝缘层的厚度方向的中间部彼此接触。
-
公开(公告)号：US07439614B2
公开(公告)日：2008-10-21
申请号：US11139238
申请日：2005-05-26
IPC分类号： H01L23/12 , H01L23/053 , H01L23/34
CPC分类号： H01L23/3735 , H01L21/4857 , H01L21/4871 , H01L23/49822 , H01L23/5383 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/4903 , H01L2224/73265 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/1301 , H01L2924/13055 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H05K1/0206 , H05K1/056 , H05K3/0035 , H05K3/284 , H05K3/421 , H05K3/423 , H05K3/4647 , H05K3/4652 , H05K2201/0209 , H05K2201/09509 , H05K2201/09563 , H05K2201/096 , H05K2201/09745 , H05K2201/09772 , H05K2201/09781 , H05K2203/0369 , H05K2203/0554 , H05K2203/1476 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2924/00015
摘要： In a manufacturing method of a hybrid integrated circuit device 10 according to the present invention, a first dummy pattern D1 is provided on a first wiring layer 18A. Furthermore, a second dummy pattern D2 is provided on a second wiring layer 18B. The first dummy pattern D1 and the second dummy pattern D2 are connected through a connection part 25 which penetrates an insulation layer 17. Hence, heat dissipation through a dummy pattern can be actively performed. In addition, even in the cases where a multi-layered wiring is formed, it is possible to provide a circuit device which can secure a heat dissipation property.
摘要翻译： 在根据本发明的混合集成电路装置10的制造方法中，在第一布线层18A上设置第一虚设图案D 1。此外，第二布线层18B设置第二虚设图案D 2 第一虚设图案D 1和第二虚设图案D 2通过贯穿绝缘层17的连接部25连接。 因此，可以主动地执行通过虚拟图案的散热。 此外，即使在形成多层布线的情况下，也可以提供能够确保散热性的电路装置。
-
-
搜索结果
3 条记录 (耗时 0.021 秒)
