Dental adhesive kit
    2.
    发明授权
    Dental adhesive kit 失效
    牙科粘合剂套件

    公开(公告)号:US06174935B1

    公开(公告)日:2001-01-16

    申请号:US09213774

    申请日:1998-12-17

    IPC分类号: A61K6083

    摘要: A dental adhesive kit is disclosed, comprising a combination of: (i) a self-etching primer comprising (A) from 1.0 to 50% by weight of a methacrylate or acrylate having an acidic group and having at least one unsaturated double bond, (B) from 1.0 to 98% by weight of a water-soluble organic solvent, and (C) from 1.0 to 90% by weight of water; and (ii) a bonding agent comprising (D) from 10 to 90% by weight of a methacrylate or acrylate having neither acidic group nor hydroxyl group and having at least one unsaturated double bond, (E) from 10 to 90% by weight of a methacrylate or acrylate not having an acidic group but having a hydroxyl group and having at least one unsaturated double bond, (F) from 0.1 to 5.0% by weight of a photopolymerization initiator, (G) from 0.1 to 5.0% by weight of a photopolymerization accelerator, and (H) from 1.0 to 60% by weight of a filler. The dental adhesive kit of the invention is useful for making the adhesive properties of a resin-based adhesive firm and reliable by a simple handling in adhering a dental restorative material to an enamel and a dentin.

    摘要翻译: 公开了一种牙科粘合剂试剂盒,其包含以下组合:(i)自蚀刻底漆,其包含(A)1.0至50重量%的具有酸性基团并且具有至少一个不饱和双键的甲基丙烯酸酯或丙烯酸酯, B)1.0〜98重量%的水溶性有机溶剂,(C)1.0〜90重量%的水; 和(ii)粘合剂,其包含(D)10至90重量%的不具有酸性基团和羟基并且具有至少一个不饱和双键的甲基丙烯酸酯或丙烯酸酯,(E)10至90重量% 不具有酸性基团但具有羟基且具有至少一个不饱和双键的甲基丙烯酸酯或丙烯酸酯,(F)0.1〜5.0重量%的光聚合引发剂,(G)0.1〜5.0重量% 光聚合促进剂和(H)1.0〜60重量%的填料。本发明的牙科粘合剂试剂盒可用于通过简单的处理使牙科修复剂粘附,使树脂基粘合剂的粘合性能牢固且可靠 搪瓷和牙本质的材料。

    Dental glass ionomer cement compositions
    5.
    发明授权
    Dental glass ionomer cement compositions 失效
    牙科玻璃离子水泥组合物

    公开(公告)号:US5063257A

    公开(公告)日:1991-11-05

    申请号:US448298

    申请日:1989-12-11

    摘要: A dental glass ionomer cement composition comprises:(a) 5 to 100 parts by weight of a polymer of an .alpha.-.beta. unsaturated carboxylic acid having a weight average molecular weight of 5,000 to 40,000,(b) 5 to 100 parts by weight of a fluoroaluminosilicate glass powder having an average particle size of 0.02 to 10 .mu.m and a specific gravity of 2.4 to 4.0 and capable of reacting with said "polymer of an .alpha.-.beta. unsaturated carboxylic acid having a weight average molecular weight of 5,000 to 40,000",(c) 5 to 100 parts by weight of a polymerizable unsaturated organic compound having at least one CH.sub.2 .dbd.C(R1)--COO--group wherein R1=H or CH.sub.3,(d) 0.01 to 5 parts by weight of a polymerization catalyst,(e) 2 to 50 parts by weight of water,(f) 0.01 to 20 parts by weight of a surface active agent, and(g) 0.01 to 5 parts by weight of a reducing agent, and optionally h. 0 to 50 parts by weight of an inorganic filler having an average particle size of 0.02 to 10 .mu.m and undergoing no reaction with said "polymer of an .alpha.-.beta. unsaturated carboxylic acid having a weight average molecular weight of 5,000 to 40,000".

    摘要翻译: 牙科玻璃离聚物粘合剂组合物包含:(a)5至100重量份的重均分子量为5,000至40,000的α-β不饱和羧酸的聚合物,(b)5至100重量份的 平均粒径为0.02〜10μm,比重为2.4〜4.0,能够与所述“重均分子量为5,000〜40,000的α-β不饱和羧酸的聚合物”反应的氟铝硅酸盐玻璃粉末, (c)5至100重量份具有至少一个CH 2 = C(R 1)-COO-基团的可聚合不饱和有机化合物,其中R1 = H或CH3,(d)0.01至5重量份的聚合催化剂, (e)2至50重量份的水,(f)0.01至20重量份的表面活性剂,和(g)0.01至5重量份的还原剂,以及任选的h。 0〜50重量份平均粒径为0.02〜10μm的无机填料,并且与所述“所述重均分子量为5,000〜40,000的α-β不饱和羧酸的聚合物不反应”。

    Magnetic bubble memory module with interconnection member
    6.
    发明授权
    Magnetic bubble memory module with interconnection member 失效
    具有互连构件的磁性气泡存储模块

    公开(公告)号:US4972369A

    公开(公告)日:1990-11-20

    申请号:US432327

    申请日:1989-11-06

    IPC分类号: G11C19/08

    CPC分类号: G11C19/085

    摘要: According to one embodiment of the present invention, a magnetic bubble memory module comprising a flexible printed circuits substrate (FPC3), on which a magnetic bubble memory chip (CHI) is mounted and electrically connected, with interconnecting patterns(9a) electrically connecting the chip (CHI) with external connecting leads, terminals or pins as well as bias coil winding (BIC2) for applying bias field to the chip (CHI), thereby reducing the number of components as well as fabricating steps because of the formation of the bias coil (BIC2) with the printed circuits substrate (FPC3).

    摘要翻译: 根据本发明的一个实施例,一种包括柔性印刷电路基板(FPC3)的磁性气泡存储模块,其上安装有电磁连接的磁性气泡存储芯片(CHI)和电气连接的互连图案(9a),电连接芯片 (CHI),外部连接引线,端子或引脚以及用于向芯片(CHI)施加偏置场的偏置线圈绕组(BIC2),从而由于偏置线圈的形成而减少了部件数量以及制造步骤 (BIC2)与印刷电路基板(FPC3)。