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    MULTISTACK SOLDER WAFER FILLING
    1.
    发明申请
    MULTISTACK SOLDER WAFER FILLING 审中-公开
    多功能焊丝灌装机

    公开(公告)号：US20120234902A1

    公开(公告)日：2012-09-20

    申请号：US13487378

    申请日：2012-06-04

    申请人： S. Jay Chey ,  David Danovitch ,  Peter A. Gruber ,  Cornelia K. Tsang

    发明人： S. Jay Chey ,  David Danovitch ,  Peter A. Gruber ,  Cornelia K. Tsang

    IPC分类号： B23K31/02 ,  B23K3/06

    CPC分类号： B23K1/0016 ,  B23K3/0638 ,  B23K2101/40

    摘要： A plurality of through-substrate holes is formed in each of at least one substrate. Each through-substrate hole extends from a top surface of the at least one substrate to the bottom surface of the at least one substrate. The at least one substrate is held by a stationary chuck or a rotating chuck. Vacuum suction is provided to a set of through-substrate holes among the plurality of through-substrate holes through a vacuum manifold attached to the bottom surface of the at least one substrate. An injection mold solder head located above the top surface of the at least one substrate injects a solder material into the set of through-substrate holes to form a plurality of through-substrate solders that extend from the top surface to the bottom surface of the at least one substrate. The vacuum suction prevents formation of air bubbles or incomplete filling in the plurality of through-substrate holes.

    摘要翻译： 在至少一个基板中的每一个中形成多个贯通基板孔。 每个贯穿基板孔从至少一个基板的顶表面延伸到至少一个基板的底表面。 至少一个基板由固定卡盘或旋转卡盘保持。 通过安装在至少一个基板的底面上的真空歧管，将多个通孔基板孔内的一组贯通基板孔提供真空抽吸。 位于至少一个衬底的顶表面上方的注射模具焊头将焊料材料注入到一组通孔衬底孔中，以形成从顶表面延伸到底表面的多个通孔衬底焊料 至少一个底物。 真空吸力防止在多个贯通基板孔中形成气泡或不完全填充。

    MULTISTACK SOLDER WAFER FILLING
    2.
    发明申请
    MULTISTACK SOLDER WAFER FILLING 审中-公开
    多功能焊丝灌装机

    公开(公告)号：US20110079632A1

    公开(公告)日：2011-04-07

    申请号：US12571965

    申请日：2009-10-01

    申请人： S. Jay Chey ,  David Danovitch ,  Peter A. Gruber ,  Cornelia K. Tsang

    发明人： S. Jay Chey ,  David Danovitch ,  Peter A. Gruber ,  Cornelia K. Tsang

    IPC分类号： B23K31/02 ,  B23K37/06

    CPC分类号： B23K1/0016 ,  B23K3/0638 ,  B23K2101/40

    摘要： A plurality of through-substrate holes is formed in each of at least one substrate. Each through-substrate hole extends from a top surface of the at least one substrate to the bottom surface of the at least one substrate. The at least one substrate is held by a stationary chuck or a rotating chuck. Vacuum suction is provided to a set of through-substrate holes among the plurality of through-substrate holes through a vacuum manifold attached to the bottom surface of the at least one substrate. An injection mold solder head located above the top surface of the at least one substrate injects a solder material into the set of through-substrate holes to form a plurality of through-substrate solders that extend from the top surface to the bottom surface of the at least one substrate. The vacuum suction prevents formation of air bubbles or incomplete filling in the plurality of through-substrate holes.

    摘要翻译： 在至少一个基板中的每一个中形成多个贯通基板孔。 每个贯穿基板孔从至少一个基板的顶表面延伸到至少一个基板的底表面。 至少一个基板由固定卡盘或旋转卡盘保持。 通过安装在至少一个基板的底面上的真空歧管，将多个通孔基板孔内的一组贯通基板孔提供真空抽吸。 位于至少一个衬底的顶表面上方的注射模具焊头将焊料材料注入到一组通孔衬底孔中，以形成从顶表面延伸到底表面的多个通孔衬底焊料 至少一个底物。 真空吸力防止在多个贯通基板孔中形成气泡或不完全填充。

    Global vacuum injection molded solder system and method
    3.
    发明授权
    Global vacuum injection molded solder system and method 失效
    全球真空注射成型焊料系统及方法

    公开(公告)号：US07497366B2

    公开(公告)日：2009-03-03

    申请号：US11758752

    申请日：2007-06-06

    申请人： S. Jay Chey ,  Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

    发明人： S. Jay Chey ,  Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

    IPC分类号： B23K31/02

    CPC分类号： B23K3/0638 ,  B23K35/02 ,  B23K2101/40 ,  H01L2224/11

    摘要： A system and method are provided for injection molding conductive bonding material into a plurality of cavities in a mold within a vacuum chamber. A mold and a fill head are located within a vacuum chamber, wherein the mold includes a plurality of cavities. A vacuum is created within the vacuum chamber, thereby removing air from the chamber and from the cavities. Optionally, rotational motion is provided to at least one of the mold and the fill head while the fill head is in substantial contact with the mold. Conductive bonding material is forced out of the fill head toward the mold, and into at least one of the cavities, while a vacuum is maintained in the vacuum chamber.

    摘要翻译： 提供了一种系统和方法，用于将导电接合材料注射到真空室内的模具中的多个空腔中。 模具和填充头位于真空室内，其中模具包括多个空腔。 在真空室内产生真空，从而从腔室和空腔中除去空气。 可选地，当填充头与模具基本接触时，将旋转运动提供给模具和填充头中的至少一个。 当在真空室中保持真空时，导电接合材料被迫从灌装头朝向模具，并进入至少一个空腔中。

    Injection molded soldering head for high temperature application and method of making same
    4.
    发明申请
    Injection molded soldering head for high temperature application and method of making same 审中-公开
    用于高温应用的注塑焊接头及其制造方法

    公开(公告)号：US20080014406A1

    公开(公告)日：2008-01-17

    申请号：US11484124

    申请日：2006-07-11

    申请人： S. Jay Chey ,  Peter A. Gruber

    发明人： S. Jay Chey ,  Peter A. Gruber

    IPC分类号： C23C16/00 ,  B32B3/10

    CPC分类号： B23K3/0638 ,  B23K2101/40 ,  Y10T428/24273

    摘要： An injection molded soldering head includes a substrate that is flexible (compliant) and stable at high temperature. The substrate includes an aperture therethrough for holding and dispensing solder onto a mold and a low friction coating on the bottom side of the substrate to provide a lower friction surface for the head.

    摘要翻译： 注射成型的焊接头包括柔性（柔顺）并在高温下稳定的基底。 衬底包括穿过其中的孔，用于将焊料保持和分配到模具上，并且在衬底的底侧上具有低摩擦涂层，以为头部提供较低的摩擦表面。

    Probe-on-substrate
    5.
    发明授权
    Probe-on-substrate 有权

    公开(公告)号：US08933717B2

    公开(公告)日：2015-01-13

    申请号：US13528947

    申请日：2012-06-21

    申请人： David M. Audette ,  Kevin Bocash ,  S. Jay Chey ,  Steven A. Cordes ,  Dustin M. Fregeau

    发明人： David M. Audette ,  Kevin Bocash ,  S. Jay Chey ,  Steven A. Cordes ,  Dustin M. Fregeau

    IPC分类号： G01R1/067

    CPC分类号： G01R1/06744 ,  G01R1/07314 ,  G01R3/00

    摘要： Probes are directly patterned on a test substrate, thereby eliminating a need for an interposer. Probe contact structures are formed as a two-level structure having a greater lateral dimension for a lower level portion than for an upper level portion. First cavities are formed in a masking layer applied to a test substrate, filling the cavities with a conductive material, and planarizing the top surfaces of the conductive material portions to form lower level portions. Another masking layer is applied over the lower level portions and patterned to define second cavities having a smaller lateral dimension that the lower level portions. The second cavities are filled with at least one conductive material to form upper level portions of the probe contact structures. The upper level portion of each probe contact structure can be employed to penetrate a surface oxide of solder balls.

    METHOD AND PROCESS FOR REDUCING UNDERCOOLING IN A LEAD-FREE TIN-RICH SOLDER ALLOY
    8.
    发明申请
    METHOD AND PROCESS FOR REDUCING UNDERCOOLING IN A LEAD-FREE TIN-RICH SOLDER ALLOY 失效
    无铅无铅焊料合金的减少方法和工艺

    公开(公告)号：US20080290142A1

    公开(公告)日：2008-11-27

    申请号：US11752382

    申请日：2007-05-23

    申请人： Gareth G. Hougham ,  Kamalesh K. Srivastava ,  Sung K. Kang ,  Da-Yuan Shih ,  Brian R. Sundlof ,  S. Jay Chey ,  Donald W. Henderson ,  David R. Di Milia ,  Richard P. Ferlita ,  Roy A. Carruthers

    发明人： Gareth G. Hougham ,  Kamalesh K. Srivastava ,  Sung K. Kang ,  Da-Yuan Shih ,  Brian R. Sundlof ,  S. Jay Chey ,  Donald W. Henderson ,  David R. Di Milia ,  Richard P. Ferlita ,  Roy A. Carruthers

    IPC分类号： B23K35/24 ,  B23K101/36 ,  B23K31/02

    CPC分类号： B23K1/19 ,  B23K35/262 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0215

    摘要： Briefly, a novel material process is disclosed wherein one or more nucleation modifiers are added, in trace amounts, to a lead-free tin-rich solder alloy to produce a solder composition with reduce or suppressed undercooling temperature characteristics. The modifier being a substance which facilitates the reduction of extreme anisotropic properties associated with body-centered-tetragonal tin based lead-free solder. The addition of the nucleation modifiers to the solder alloy does not materially effect the solder composition's melting point. As such, balls of solder with the nucleated composition freeze while other solder balls within the array remain in the melt. This effectively enables one substrate to be pinned to another substrate by one or more predetermined solder balls to secure the package while the remaining solder joints are in the liquid state. Further, the addition of a trace amount of nucleation sites within the composition facilitates control over the number, size, and orientations of primary intermetallic compounds in tin rich crystallite grains. Moreover, trace amounts of one or more solid and/or insoluble nucleating modifiers within a given volume of solder reduces the size of average crystallites within the composition.

    摘要翻译： 简而言之，公开了一种新颖的材料方法，其中将一种或多种成核改性剂以微量添加到无铅富锡焊料合金中以产生具有降低或抑制的过冷温度特性的焊料组合物。 该改性剂是有助于减少与体心四方锡锡基无铅焊料相关的极端各向异性的物质。 将成核改性剂添加到焊料合金中不会实质上影响焊料组合物的熔点。 因此，具有成核组合物的焊料球冻结，而阵列内的其它焊球保持在熔体中。 这有效地使一个基板通过一个或多个预定的焊球被固定到另一个基板，以固定封装，而剩余的焊点处于液态。 此外，在组合物中添加微量的成核位点有助于控制富锡微晶颗粒中初级金属间化合物的数量，尺寸和取向。 此外，在给定体积的焊料中痕量的一种或多种固态和/或不溶性成核改性剂减少了组合物内平均微晶的尺寸。