MEMORY DEVICES INCLUDING TWO-DIMENSIONAL MATERIAL, METHODS OF MANUFACTURING THE SAME, AND METHODS OF OPERATING THE SAME
    6.
    发明申请
    MEMORY DEVICES INCLUDING TWO-DIMENSIONAL MATERIAL, METHODS OF MANUFACTURING THE SAME, AND METHODS OF OPERATING THE SAME 有权
    包括二维材料的记忆装置,其制造方法及其操作方法

    公开(公告)号:US20150155287A1

    公开(公告)日:2015-06-04

    申请号:US14265965

    申请日:2014-04-30

    摘要: Disclosed are memory devices including a two-dimensional (2D) material, methods of manufacturing the same, and methods of operating the same. A memory device may include a transistor, which includes graphene and 2D semiconductor contacting the graphene, and a capacitor connected to the transistor. The memory device may include a first electrode, a first insulation layer, a second electrode, a semiconductor layer, a third electrode, a second insulation layer, and a fourth electrode which are sequentially arranged. The second electrode may include the graphene, and the semiconductor layer may include the 2D semiconductor. Alternatively, the memory device may include first and second electrode elements, a graphene layer between the first and second electrode elements, a 2D semiconductor layer between the graphene layer and the first electrode element, and a dielectric layer between the graphene layer and the second electrode.

    摘要翻译: 公开了包括二维(2D)材料,其制造方法及其操作方法的存储器件。 存储器件可以包括晶体管,其包括与石墨烯接触的石墨烯和2D半导体以及连接到晶体管的电容器。 存储器件可以包括依次布置的第一电极,第一绝缘层,第二电极,半导体层,第三电极,第二绝缘层和第四电极。 第二电极可以包括石墨烯,并且半导体层可以包括2D半导体。 或者,存储器件可以包括第一和第二电极元件,在第一和第二电极元件之间的石墨烯层,在石墨烯层和第一电极元件之间的2D半导体层,以及在石墨烯层和第二电极之间的电介质层 。