公开(公告)号：US20150181703A1

公开(公告)日：2015-06-25

申请号：US14548568

申请日：2014-11-20

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Masato TANAKA ,  Shoji WATANABE ,  Noriyoshi SHIMIZU

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0298 ,  H01L23/145 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/4644 ,  H05K2201/029 ,  H05K2201/09227 ,  H05K2201/10674 ,  H05K2203/025

Abstract: A wiring substrate includes first and second wiring structures. The first wiring structure includes a core substrate, first and second insulation layers formed from a thermosetting insulative resin respectively including first and second reinforcement materials, and a via wire formed in the first insulation layer. The second wiring structure includes a third insulation layer formed on an upper surface of the first insulation layer and an upper end surface of the via wire, and a wiring layer extended through the third insulation layer and electrically connected to the via wire. The outermost insulation layer, the main component of which is a photosensitive resin, is stacked on a lower surface of the second insulation layer. The second wiring structure has a higher wiring density than the first wiring structure. The first reinforcement material is partially exposed on the upper surface of the first insulation layer.

Abstract translation: 布线基板包括第一和第二布线结构。 第一布线结构包括芯基板，由分别包括第一和第二加强材料的热固性绝缘树脂形成的第一绝缘层和第二绝缘层，以及形成在第一绝缘层中的导线。 第二布线结构包括形成在第一绝缘层的上表面上的通孔导线的上表面的第三绝缘层和延伸穿过第三绝缘层并与通孔导线连接的布线层。 其主要成分是感光性树脂的最外层绝缘层层叠在第二绝缘层的下表面上。 第二布线结构具有比第一布线结构更高的布线密度。 第一增强材料部分地暴露在第一绝缘层的上表面上。

公开(公告)号：US20150282307A1

公开(公告)日：2015-10-01

申请号：US14613591

申请日：2015-02-04

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Noriyoshi SHIMIZU ,  Shoji WATANABE ,  Toshinori KOYAMA ,  Akio ROKUGAWA

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K3/4682 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/10156 ,  H01L2224/11462 ,  H01L2224/13014 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13565 ,  H01L2224/1357 ,  H01L2224/13666 ,  H01L2224/13687 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81395 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/8149 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/15331 ,  H05K1/111 ,  H05K1/115 ,  H05K2201/0352 ,  H05K2203/025 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/04941

Abstract: A wiring board includes first insulating layers; first wiring layers; first via wirings; second insulating layers; second wiring layers; second via wirings; and a solder resist layer, wherein the first insulating layers are composed of non-photosensitive resin, wherein the second insulating layers, and the solder resist layer are composed of photosensitive resin, respectively, wherein the first surface of the uppermost first insulating layer and the first end surface of the first via wiring embedded in the uppermost first insulating layer are polished surfaces, wherein the first end surface of the first via wiring embedded in the uppermost first insulating layer is flush with the first surface of the uppermost first insulating layer, and wherein the wiring density of the second wiring layers is higher than the wiring density of the first wiring layers.

Abstract translation: 布线板包括第一绝缘层; 第一布线层; 首先通过布线; 第二绝缘层; 第二布线层; 第二条通过布线; 以及阻焊层，其中，所述第一绝缘层由非感光性树脂构成，所述第二绝缘层和所述阻焊层分别由感光性树脂构成，其中，所述第一绝缘层和所述第二绝缘层的第一表面 嵌入在最上面的第一绝缘层中的第一通孔布线的第一端面是抛光表面，其中嵌入在最上面的第一绝缘层中的第一通孔布线的第一端面与最上面的第一绝缘层的第一表面齐平， 其中所述第二布线层的布线密度高于所述第一布线层的布线密度。