公开(公告)号：US08169067B2

公开(公告)日：2012-05-01

申请号：US11583719

申请日：2006-10-20

申请人： Edward Law ,  Sam Ziqun Zhao ,  Rezaur Rahman Khan

发明人： Edward Law ,  Sam Ziqun Zhao ,  Rezaur Rahman Khan

IPC分类号： H01L23/48 ,  H01L23/06 ,  H01L23/22 ,  H01L23/24

CPC分类号： H01L23/3128 ,  H01L23/13 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L24/91 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48465 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/85005 ,  H01L2224/9222 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/11 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Methods and apparatuses for improved thermal, electrical and/or mechanical performance in integrated circuit (IC) packages are described. An IC circuit package comprises a substrate having a central opening. An IC die, resides within the opening in the substrate. Wirebonds couples a plurality of bond pads on a top surface of the IC die to a plurality of bond fingers on a top surface the substrate. An encapsulating material encapsulates at least the IC die and the wirebonds such that at least a bottom surface of the IC die is left exposed. The encapsulating material suspends the die such that at least a portion of the die is held within the opening in the substrate.

摘要翻译： 描述了用于改善集成电路（IC）封装中的热，电和/或机械性能的方法和装置。 IC电路封装包括具有中心开口的基板。 IC芯片位于基板的开口内。 导线将IC芯片的顶表面上的多个接合焊盘耦合到衬底的顶表面上的多个接合指状物。 封装材料至少封装IC芯片和引线键，使得IC芯片的至少底面露出。 封装材料悬挂模具，使得模具的至少一部分保持在基板的开口内。

公开(公告)号：US20080096312A1

公开(公告)日：2008-04-24

申请号：US11583719

申请日：2006-10-20

申请人： Edward Law ,  Sam Ziqun Zhao ,  Rezaur Rahman Khan

发明人： Edward Law ,  Sam Ziqun Zhao ,  Rezaur Rahman Khan

IPC分类号： H01L21/00

CPC分类号： H01L23/3128 ,  H01L23/13 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L24/91 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48465 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/85005 ,  H01L2224/9222 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/11 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Methods and apparatuses for improved thermal, electrical and/or mechanical performance in integrated circuit (IC) packages are described. An IC circuit package comprises a substrate having a central opening. An IC die, resides within the opening in the substrate. Wirebonds couples a plurality of bond pads on a top surface of the IC die to a plurality of bond fingers on a top surface the substrate. An encapsulating material encapsulates at least the IC die and the wirebonds such that at least a bottom surface of the IC die is left exposed. The encapsulating material suspends the die such that at least a portion of the die is held within the opening in the substrate.

摘要翻译： 描述了用于改善集成电路（IC）封装中的热，电和/或机械性能的方法和装置。 IC电路封装包括具有中心开口的基板。 IC芯片位于基板的开口内。 导线将IC芯片的顶表面上的多个接合焊盘耦合到衬底的顶表面上的多个接合指状物。 封装材料至少封装IC芯片和引线键，使得IC芯片的至少底面露出。 封装材料悬挂模具，使得模具的至少一部分保持在基板的开口内。

公开(公告)号：US20070273023A1

公开(公告)日：2007-11-29

申请号：US11583718

申请日：2006-10-20

申请人： Sam Ziqun Zhao ,  Edward Law ,  Rezaur Rahman Khan

发明人： Sam Ziqun Zhao ,  Edward Law ,  Rezaur Rahman Khan

IPC分类号： H01L23/34

CPC分类号： H01L23/13 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An apparatus and method for a wire-bond die-up area array package is described. The package includes an integrated circuit (IC) die, a substrate, and a thermally conducting body. A bottom surface of the IC die is exposed through an opening in a central region of the substrate. The die is mounted to the thermally conducting body. A bottom surface of the thermally conducting body is configured to be connected to a circuit board, such as a PWB, when the package is mounted to the circuit board. The bottom surface of the thermally conducting body may be connected directly to the circuit board, or may be coupled to the circuit board via solder balls or other mechanism. One or more wirebonds are used to electrically connect the die to a top surface of the substrate. A mold compound encapsulates the die, the wirebonds, and at least a portion of the top surface of the substrate, and fills a gap between peripheral edges of the IC die and inner walls of the substrate central window opening. A matrix of solder balls is attached to a bottom surface of the substrate.

摘要翻译： 描述了一种用于引线键合区域阵列封装的装置和方法。 封装包括集成电路（IC）管芯，衬底和导热体。 IC芯片的底表面通过衬底的中心区域中的开口露出。 模具安装到导热体上。 当封装安装到电路板时，导热体的底表面被配置为连接到电路板，例如PWB。 导热体的底表面可以直接连接到电路板，或者可以通过焊球或其它机构与电路板耦合。 一个或多个引线用于将管芯电连接到衬底的顶表面。 模具化合物封装模具，引线键和衬底的顶表面的至少一部分，并且填充IC模具的周边边缘和衬底中心窗口的内壁之间的间隙。 焊球的基体附着在基板的底面上。

公开(公告)号：US08039949B2

公开(公告)日：2011-10-18

申请号：US12619385

申请日：2009-11-16

申请人： Sam Ziqun Zhao ,  Rezaur Rahman Khan ,  Edward Law ,  Marc Papageorge

发明人： Sam Ziqun Zhao ,  Rezaur Rahman Khan ,  Edward Law ,  Marc Papageorge

IPC分类号： H01L23/48

CPC分类号： H01L24/48 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/32 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48237 ,  H01L2224/484 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： Electrically and thermally enhanced die-up ball grid array (BGA) packages are described. A BGA package includes a stiffener, substrate, a silicon die, and solder balls. The die is mounted to the top of the stiffener. The stiffener is mounted to the top of the substrate. A plurality of solder balls are attached to the bottom surface of the substrate. A top surface of the stiffener may be patterned. A second stiffener may be attached to the first stiffener. The substrate may include one, two, four, or other number of metal layers. Conductive vias through a dielectric layer of the substrate may couple the stiffener to solder balls. An opening may be formed through the substrate, exposing a portion of the stiffener. The stiffener may have a down-set portion. A heat slug may be attached to the exposed portion of the stiffener. A locking mechanism may be used to enhance attachment of the heat slug to the stiffener. The heat slug may be directly attached to the die through an opening in the stiffener.

摘要翻译： 描述了电热和热增强型压焊球栅阵列（BGA）封装。 BGA封装包括加强件，衬底，硅管芯和焊球。 模具安装在加强筋的顶部。 加强件安装到基板的顶部。 多个焊球附着在基板的底面上。 加强件的顶表面可以被图案化。 第二加强件可以附接到第一加强件。 衬底可以包括一个，两个，四个或其它数量的金属层。 通过基底的电介质层的导电孔可将加强件耦合到焊球。 可以通过基板形成开口，暴露加强件的一部分。 加强件可以具有下降部分。 散热片可以附着在加强件的暴露部分上。 可以使用锁定机构来增强热块与加强件的连接。 热芯可以通过加强件中的开口直接附接到模具。

公开(公告)号：US09548251B2

公开(公告)日：2017-01-17

申请号：US13349045

申请日：2012-01-12

申请人： Rezaur Rahman Khan ,  Sam Ziqun Zhao ,  Pieter Vorenkamp ,  Kevin Kunzhong Hu ,  Sampath K. V. Karikalan ,  Xiangdong Chen

发明人： Rezaur Rahman Khan ,  Sam Ziqun Zhao ,  Pieter Vorenkamp ,  Kevin Kunzhong Hu ,  Sampath K. V. Karikalan ,  Xiangdong Chen

IPC分类号： H01L23/48 ,  H01L23/13 ,  H01L25/065 ,  H01L23/498

CPC分类号： H01L23/13 ,  H01L23/49827 ,  H01L23/49833 ,  H01L25/0657 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/157

摘要： A semiconductor package may include a substrate, and a semiconductor interposer having a cavity and a plurality of through semiconductor vias. The semiconductor interposer is situated over the substrate. An intra-interposer die is disposed within the cavity of the semiconductor interposer. A thermally conductive adhesive is disposed within the cavity and contacts the intra-interposer die. Additionally, a top die is situated over the semiconductor interposer. In one implementation, the semiconductor interposer is a silicon interposer. In another implementation, the semiconductor interposer is flip-chip mounted to the substrate such that the intra-interposer die disposed within the cavity faces the substrate. In yet another implementation, the cavity in the semiconductor interposer may extend from a top surface of the semiconductor interposer to a bottom surface of the semiconductor interposer and a thermal interface material may be disposed between the intra-interposer die and the substrate.

摘要翻译： 半导体封装可以包括衬底和具有空腔和多个通孔半导体通孔的半导体插入器。 半导体插入器位于衬底上。 插入式管芯设置在半导体插入器的空腔内。 导热粘合剂设置在空腔内并与内插器模具接触。 此外，顶部管芯位于半导体插入器上方。 在一个实现中，半导体插入器是硅插入器。 在另一个实施方式中，将半导体插入器倒装芯片安装到基板上，使得设置在空腔内的内插器芯片面向基板。 在又一实施方案中，半导体插入器中的空腔可以从半导体插入器的顶表面延伸到半导体插入器的底表面，并且热界面材料可以设置在内插器管芯和衬底之间。

公开(公告)号：US08508045B2

公开(公告)日：2013-08-13

申请号：US13174066

申请日：2011-06-30

申请人： Rezaur Rahman Khan ,  Sam Ziqun Zhao

发明人： Rezaur Rahman Khan ,  Sam Ziqun Zhao

IPC分类号： H01L23/498 ,  H01L21/56

CPC分类号： H01L21/565 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5385 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/16 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00

摘要： An integrated circuit (IC) package has a package member having a first surface and a second surface opposite the first surface. A first plurality of contact members is physically and electrically fixed to the second surface. An interposer substrate having a second plurality of contact members on one surface thereof which make physical and electrical contact with respective ones of the first plurality of contact members. The interposer substrate is configured to have at least one circuit member mounted to a second surface thereof opposite the one surface thereof.

摘要翻译： 集成电路（IC）封装具有封装构件，该封装构件具有与第一表面相对的第一表面和第二表面。 第一组多个接触构件物理和电气固定到第二表面。 具有在其一个表面上具有第二多个接触构件的中介层衬底，其与第一组多个接触构件中的相应接触构件物理和电接触。 插入器基板被配置为具有安装到与其一个表面相对的第二表面的至少一个电路部件。

公开(公告)号：US08183687B2

公开(公告)日：2012-05-22

申请号：US11707026

申请日：2007-02-16

申请人： Rezaur Rahman Khan ,  Sam Ziqun Zhao

发明人： Rezaur Rahman Khan ,  Sam Ziqun Zhao

IPC分类号： H01L23/34

CPC分类号： H01L23/49575 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/49531 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099

摘要： Methods and apparatus for improved electrical, mechanical and thermal performance of stacked IC packages are described. An IC package comprises a substrate, a first die, a second die, and an interposer with an opening in a first surface of the interposer configured to accommodate the first die. The first IC die is attached a first surface of the substrate. The interposer is mounted on the first surface of the substrate such that the first IC die is placed within the opening in the interposer. The second die is mounted on a second surface of the interposer. Wire bonds couple bond pads on the first surfaces of IC die are coupled to the first surface of the substrate. A mold compound encapsulates the first IC die, the second IC die, the interposer and the wire bonds.

摘要翻译： 描述了用于改进堆叠IC封装的电气，机械和热性能的方法和装置。 IC封装包括衬底，第一裸片，第二裸片和插入器，其中插入器的第一表面中的开口被配置成容纳第一裸片。 第一IC芯片附着在基板的第一表面上。 插入器安装在基板的第一表面上，使得第一IC芯片放置在插入件的开口内。 第二管芯安装在插入件的第二表面上。 将IC芯片的第一表面上的引线接合连接焊盘耦合到衬底的第一表面。 模具化合物封装第一IC芯片，第二IC芯片，插入器和引线键合。

公开(公告)号：US07808087B2

公开(公告)日：2010-10-05

申请号：US11527573

申请日：2006-09-27

申请人： Sam Ziqun Zhao ,  Rezaur Rahman Khan

发明人： Sam Ziqun Zhao ,  Rezaur Rahman Khan

IPC分类号： H01L23/495

CPC分类号： H01L23/4334 ,  H01L23/49537 ,  H01L23/49558 ,  H01L23/49568 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages is described. A die-up or die-down package includes first and second caps defining a cavity, an IC die, and a leadframe. The leadframe includes a centrally located die attach pad, a plurality of leads, and a plurality of tie bars that couple the die attach pad to the leads. The IC die is mounted to the die attach pad. Planar rim portions of the first and second caps that surround the cavity are coupled to the leadframe. The first and second caps and the leadframe form an enclosure structure that substantially encloses the IC die, and shields EMI emanating from and radiating towards the IC die. The enclosure structure also dissipates heat generated by the IC die during operation.

摘要翻译： 描述了用于改善集成电路（IC）封装中的热性能和电磁干扰（EMI）屏蔽的方法和装置。 芯片或芯片封装包括限定空腔的第一和第二盖，IC芯片和引线框架。 引线框架包括位于中心的管芯附接垫，多个引线和将管芯附接垫耦合到引线的多个连接条。 IC芯片安装在管芯附着垫上。 围绕空腔的第一和第二盖的平面轮缘部分联接到引线框架。 第一和第二盖子和引线框架形成基本上封装IC管芯的外壳结构，并且屏蔽从IC管芯发出并向IC裸片辐射的EMI。 外壳结构还在运行期间消散IC芯片产生的热量。

公开(公告)号：US07579217B2

公开(公告)日：2009-08-25

申请号：US11509715

申请日：2006-08-25

申请人： Sam Ziqun Zhao ,  Rezaur Rahman Khan

发明人： Sam Ziqun Zhao ,  Rezaur Rahman Khan

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L23/34 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/5384 ,  H01L23/562 ,  H01L24/14 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48237 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/0665

摘要： An electrically and thermally enhanced die-up tape substrate ball grid array (BGA) package and die-up plastic substrate BGA package are described. A substrate that has a first surface and a second surface is provided. The stiffener has a first surface and a second surface. The second stiffener surface is attached to the first substrate surface. An IC die has a first surface and a second surface. The first IC die surface is mounted to the first stiffener surface. A plurality of solder balls is attached to the second substrate surface. In one aspect, a heat spreader is mounted to the second IC die surface. In another aspect, the stiffener is coupled to ground to act as a ground plane. In another aspect, the substrate has a window opening that exposes a portion of the second stiffener surface. The exposed portion of the second stiffener surface is configured to be coupled to a printed circuit board (PCB). In another aspect, a metal ring is attached to the first stiffener surface. In another aspect, wire bond openings in the stiffener are bridged by one or more studs.

摘要翻译： 描述了一种电和热增强的去卷带基板球栅阵列（BGA）封装和裸芯片塑料基板BGA封装。 提供具有第一表面和第二表面的基底。 加强件具有第一表面和第二表面。 第二加强件表面附接到第一基板表面。 IC管芯具有第一表面和第二表面。 第一IC模具表面安装到第一加强件表面。 多个焊球被附接到第二基板表面。 一方面，散热器安装到第二IC模具表面。 在另一方面，加强件联接到地面以用作接地平面。 在另一方面，衬底具有暴露第二加强件表面的一部分的窗口。 第二加强件表面的暴露部分被配置成联接到印刷电路板（PCB）。 在另一方面，金属环附接到第一加强件表面。 在另一方面，加强件中的引线接合开口由一个或多个螺柱桥接。

公开(公告)号：US20070267740A1

公开(公告)日：2007-11-22

申请号：US11514917

申请日：2006-09-05

申请人： Rezaur Rahman Khan ,  Sam Ziqun Zhao

发明人： Rezaur Rahman Khan ,  Sam Ziqun Zhao

IPC分类号： H01L23/34

CPC分类号： H01L24/16 ,  H01L21/50 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/42 ,  H01L23/4334 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2021/60262 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method, system, and apparatus for improved IC device packaging is described. In an aspect, an (IC) device package includes an IC die having at one or more contact pads, each contact pad located at a corresponding hotspot on a surface of the IC die. The package also includes a thermally conductive interposer which is thermally coupled to the IC die at the contact pads. In another aspect, an underfill material fills a space between the IC die and the interposer. The interposer may also be electrically coupled to the IC die. In an aspect, the interposer and the IC die are coupled through thermal interconnects or “nodules.”

摘要翻译： 描述了用于改进IC器件封装的方法，系统和装置。 在一方面，（IC）器件封装包括具有在一个或多个接触焊盘处的IC管芯，每个接触焊盘位于IC管芯表面上的对应热点处。 封装还包括热接触插入件，其在接触焊盘处热耦合到IC管芯。 在另一方面，底部填充材料填充IC管芯和插入件之间的空间。 插入器也可以电耦合到IC管芯。 在一方面，插入器和IC管芯通过热互连或“结节”耦合。