公开(公告)号：US20210351330A1

公开(公告)日：2021-11-11

申请号：US17385193

申请日：2021-07-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Hyun SIM ,  Yong II KIM ,  Ha Nul YOO ,  Ji Hye YEON ,  Jun Bu YOUN ,  Ji Hoon YUN ,  Su Hyun JO

IPC: H01L33/50 ,  H01L33/54 ,  H01L33/60

Abstract: A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.

公开(公告)号：US20200328329A1

公开(公告)日：2020-10-15

申请号：US16913201

申请日：2020-06-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Hyun SIM ,  Yong II KIM ,  Ha Nul YOO ,  Ji Hye YEON ,  Jun Bu YOUN ,  Ji Hoon YUN ,  Su Hyun JO

IPC: H01L33/50 ,  H01L33/54 ,  H01L33/60

Abstract: A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.

公开(公告)号：US20190371779A1

公开(公告)日：2019-12-05

申请号：US16185602

申请日：2018-11-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji Hye YEON ,  Su Hyun JO ,  Sung Hyun SIM ,  Ha Nul YOO ,  Yong Il KIM ,  Han Kyu SEONG

IPC: H01L25/00 ,  H01L25/18 ,  H01L23/00 ,  H01L33/50

Abstract: A method of manufacturing a display module includes preparing a first substrate structure including an light-emitting diode (LED) array containing a plurality of LED cells, electrode pads connected to the first and second conductivity-type semiconductor layers, and a first bonding layer covering the LED array; preparing a second substrate structure including a plurality of thin-film transistor (TFT) cells disposed on a second substrate, and each having a source region, a drain region and a gate electrode disposed therebetween, the second substrate structure being provided by forming a circuit region, in which connection portions disposed to correspond to the electrode pads are exposed to one surface thereof, and by forming a second bonding layer covering the circuit region, respectively planarizing the first and second bonding layers, and bonding the first and second substrate structures to each other.

公开(公告)号：US20190181181A1

公开(公告)日：2019-06-13

申请号：US15992316

申请日：2018-05-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji Hye YEON ,  Sung Hyun SIM ,  Ha Nul YOO ,  Dong Gun LEE

IPC: H01L27/15 ,  H01L33/00 ,  H01L33/50 ,  H01L33/46 ,  H01L33/56 ,  H01L33/58 ,  H01L33/22

CPC classification number: H01L27/156 ,  H01L25/167 ,  H01L33/0079 ,  H01L33/22 ,  H01L33/46 ,  H01L33/505 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L33/641 ,  H01L2933/0025 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0075 ,  H01L2933/0091

Abstract: A method of fabricating a light emitting device package including forming a cell array that includes semiconductor light-emitters including first and second conductivity-type semiconductor layers and an active layer on a substrate, and a separation region, the cell array having a first surface contacting the substrate; exposing the first surface of the separation region by removing the substrate; forming a seed layer on the first surface in the separation region; forming a photoresist pattern on the light-emitters such that the photoresist pattern exposes the seed layer; forming a partition structure that separates the light-emitters by plating a region exposed by the photoresist pattern; forming light emitting windows of the partition structure by removing the photoresist pattern such that the light-emitters are exposed at lower ends of the light emitting windows; and forming wavelength converters by filling the light emitting windows with a wavelength conversion material.

公开(公告)号：US20200105980A1

公开(公告)日：2020-04-02

申请号：US16299422

申请日：2019-03-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Hyun SIM ,  Yong Il KIM ,  Ha Nul YOO ,  Ji Hye YEON ,  Jun Bu YOUN ,  Ji Hoon YUN ,  Su Hyun JO

IPC: H01L33/50 ,  H01L33/60 ,  H01L33/54

Abstract: A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.

公开(公告)号：US20190189595A1

公开(公告)日：2019-06-20

申请号：US16008276

申请日：2018-06-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong Gun LEE ,  Yong Il KIM ,  Hye Seok NOH ,  Han Kyu SEONG ,  Sung Hyun SIM ,  Ha Nul YOO

IPC: H01L25/075 ,  H01L27/12 ,  H01L33/50 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L27/1214 ,  H01L33/06 ,  H01L33/30 ,  H01L33/32 ,  H01L33/405 ,  H01L33/504 ,  H01L33/505 ,  H01L33/508 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058

Abstract: A light emitting device package includes a first wavelength conversion portion and a second wavelength conversion portion to provide a wavelength of incident light to provide light having a converted wavelength, a light-transmissive partition structure extending along side surfaces of the first and second wavelength conversion portions along a thickness direction to separate the first and second wavelength conversion portions part from each other along a direction crossing the thickness direction, and a cell array including a first light emitting device, a second light emitting device and a third light emitting device, overlapping the first wavelength conversion portion, the second wavelength conversion portion and the light-transmissive partition structure, respectively, along the thickness direction.