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    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
    2.
    发明申请
    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 有权
    印刷线路板和制造印刷线路板的方法

    公开(公告)号：US20120061347A1

    公开(公告)日：2012-03-15

    申请号：US13273335

    申请日：2011-10-14

    申请人： Satoru KAWAI ,  Kenji Sakai ,  Liyi Chen

    发明人： Satoru KAWAI ,  Kenji Sakai ,  Liyi Chen

    IPC分类号： H05K3/46

    CPC分类号： H05K3/4007 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/113 ,  H05K3/205 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/09436 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T29/49213 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

    摘要： A method for manufacturing a printed wiring board including preparing a carrier, forming a metal layer on the carrier, forming an etching resist on the metal layer, forming a metal film from the metal layer underneath the resist by removing portion of the metal layer exposed through the resist and part of the metal layer contiguous to the portion of the metal layer and underneath the resist, forming a coating layer on side surface of the film and the carrier, forming a pad on the coating layer, removing the resist, forming a resin insulation layer on the film and surface of the pad, forming an opening reaching the surface of the pad in the insulation layer, forming a conductive circuit on the insulation layer, forming a via conductor connecting the circuit and the pad in the opening, removing the carrier from the film and coating layer, and removing the film.

    摘要翻译： 一种制造印刷电路板的方法，包括制备载体，在载体上形成金属层，在金属层上形成抗蚀剂，在抗蚀剂下面的金属层形成金属膜，除去暴露于金属层的部分 所述抗蚀剂和所述金属层的与所述金属层的所述部分相邻并且在所述抗蚀剂下方的部分，在所述膜和载体的侧表面上形成涂层，在所述涂层上形成焊盘，除去所述抗蚀剂，形成树脂 在所述膜的表面和所述垫的表面上形成绝缘层，形成在所述绝缘层中到达所述焊盘表面的开口，在所述绝缘层上形成导电电路，形成在所述开口中连接所述电路和所述焊盘的通孔导体， 载体从膜和涂层，并去除膜。

    Method for manufacturing a printed wiring board
    4.
    发明授权
    Method for manufacturing a printed wiring board 有权
    印刷电路板的制造方法

    公开(公告)号：US08418360B2

    公开(公告)日：2013-04-16

    申请号：US13273335

    申请日：2011-10-14

    申请人： Satoru Kawai ,  Kenji Sakai ,  Liyi Chen

    发明人： Satoru Kawai ,  Kenji Sakai ,  Liyi Chen

    IPC分类号： H05K3/02

    CPC分类号： H05K3/4007 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/113 ,  H05K3/205 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/09436 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T29/49213 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

    摘要： A method for manufacturing a printed wiring board including preparing a carrier, forming a metal layer on the carrier, forming an etching resist on the metal layer, forming a metal film from the metal layer underneath the resist by removing portion of the metal layer exposed through the resist and part of the metal layer contiguous to the portion of the metal layer and underneath the resist, forming a coating layer on side surface of the film and the carrier, forming a pad on the coating layer, removing the resist, forming a resin insulation layer on the film and surface of the pad, forming an opening reaching the surface of the pad in the insulation layer, forming a conductive circuit on the insulation layer, forming a via conductor connecting the circuit and the pad in the opening, removing the carrier from the film and coating layer, and removing the film.

    摘要翻译： 一种制造印刷电路板的方法，包括制备载体，在载体上形成金属层，在金属层上形成抗蚀剂，在抗蚀剂下面的金属层形成金属膜，除去暴露于金属层的部分 所述抗蚀剂和所述金属层的与所述金属层的所述部分相邻并且在所述抗蚀剂下方的部分，在所述膜和载体的侧表面上形成涂层，在所述涂层上形成焊盘，除去所述抗蚀剂，形成树脂 在所述膜的表面和所述垫的表面上形成绝缘层，形成在所述绝缘层中到达所述焊盘表面的开口，在所述绝缘层上形成导电电路，形成在所述开口中连接所述电路和所述焊盘的通孔导体， 载体从膜和涂层，并去除膜。

    MULTILAYER PRINTED WIRING BOARD
    9.
    发明申请
    MULTILAYER PRINTED WIRING BOARD 审中-公开
    多层印刷接线板

    公开(公告)号：US20120199386A1

    公开(公告)日：2012-08-09

    申请号：US13325414

    申请日：2011-12-14

    申请人： Takema Adachi ,  Liyi Chen

    发明人： Takema Adachi ,  Liyi Chen

    IPC分类号： H05K1/02 ,  H05K3/02

    CPC分类号： H05K3/445 ,  H01L23/142 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/056 ,  H05K3/0032 ,  H05K3/3478 ,  H05K3/4608 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2203/0323 ,  H05K2203/1572

    摘要： A printed wiring board including a core substrate having a metal layer, a first resin insulation layer on a surface of the metal layer and a second resin insulation layer on the opposite surface of the metal layer, a first conductive circuit formed on the first layer, a second conductive circuit formed on the second layer, and a through-hole conductor formed in a penetrating hole through the substrate and connecting the first and second circuits. The metal layer has an opening filled with a filler resin, the penetrating hole has a first opening in the first layer, a second opening in the second layer and a third opening in the filler resin, the first opening tapers toward the filler resin, the second opening tapers toward the filler resin, and the third opening is connecting the first and second openings.

    摘要翻译： 一种印刷电路板，包括具有金属层的芯基板，在所述金属层的表面上的第一树脂绝缘层和在所述金属层的相对表面上的第二树脂绝缘层，形成在所述第一层上的第一导电电路， 形成在第二层上的第二导电电路，以及形成在穿过基板的穿透孔中并连接第一和第二电路的通孔导体。 金属层具有填充有填充树脂的开口，贯通孔在第一层中具有第一开口，在第二层中具有第二开口，在填充树脂中具有第三开口，第一开口朝着填充树脂逐渐变细， 第二开口朝向填充树脂逐渐变细，第三开口连接第一和第二开口。

    Interposer, a method for manufacturing the same and an electronic circuit package
    10.
    发明授权
    Interposer, a method for manufacturing the same and an electronic circuit package 有权
    内插器，其制造方法和电子电路封装

    公开(公告)号：US07911802B2

    公开(公告)日：2011-03-22

    申请号：US11949795

    申请日：2007-12-04

    申请人： Shuichi Kawano ,  Liyi Chen

    发明人： Shuichi Kawano ,  Liyi Chen

    IPC分类号： H05K1/18

    CPC分类号： H01G4/35 ,  H01G4/01 ,  H01G4/236 ,  H01L2224/16265 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19103 ,  Y10T29/49165

    摘要： An interposer including: a substrate including a first layer and second layer, wherein the first layer and second layer are positioned parallel to each other; electrodes each having a concave-convex structure formed on each facing surface of the first layer and second layer of the substrate; a dielectric layer sandwiched between the electrodes which are formed on each facing surface of the first layer and second layer of the substrate; a first conductive part which vertically passes through the first layer of the substrate from a first outer surface of the substrate and is electrically connected to an electrode formed on a surface of the second layer of the substrate that faces the first layer of the substrate; and a second conductive part which vertically passes through the second layer of the substrate from a second outer surface of the substrate and is electrically connected to an electrode formed on a surface of the first layer of the substrate that faces the second layer of the substrate.

    摘要翻译： 一种插入器，包括：包括第一层和第二层的衬底，其中所述第一层和第二层彼此平行地定位; 每个具有形成在基板的第一层和第二层的每个相对表面上的凹凸结构的电极; 夹在电极之间的电介质层，其形成在基板的第一层和第二层的每个相对表面上; 第一导电部件，其从衬底的第一外表面垂直地穿过衬底的第一层，并且电连接到形成在衬底的面向衬底的第一层的第二层的表面上的电极; 以及第二导电部件，其从所述基板的第二外表面垂直地穿过所述基板的所述第二层，并且电连接到形成在所述基板的所述第一层的面向所述基板的第二层的表面上的电极。