公开(公告)号：US09322377B2

公开(公告)日：2016-04-26

申请号：US13716976

申请日：2012-12-17

Applicant: Satoshi Matsui ,  Taro Kihara

Inventor： Satoshi Matsui ,  Taro Kihara

IPC: F02N3/02

CPC classification number: F02N3/02 ,  F02N5/02

Abstract: One embodiment provides a recoil starter mechanism, including: a starter case having a rotation shaft; a rope reel rotatably mounted on the rotation shaft; a coil spring wound on the rotation shaft, one end thereof being formed into a tip projecting portion; a hold plate holding the coil spring to the rotation shaft; and a ratchet which is formed into a ring-like shape and interposed between the rope reel and the hold plate. The ratchet includes: a fulcrum around which the ratchet is swingable with respect to the rope reel; a guide groove in which the tip projecting portion is engaged; and an engagement pawl which is to be engaged with an engagement portion of a pulley to thereby start an engine. The guide groove and the engagement pawl are disposed at opposite sides so as to interpose the rotation shaft therebetween.

Abstract translation: 一个实施例提供一种反冲启动机构，包括：具有旋转轴的起动器壳体; 可旋转地安装在旋转轴上的绳索卷轴; 卷绕在旋转轴上的螺旋弹簧，其一端形成为前端突出部; 将所述螺旋弹簧保持在所述旋转轴上的保持板; 以及棘轮，其形成为环状形状并且插入在绳索卷轴和保持板之间。 所述棘轮包括：支轴，所述棘轮围绕所述支点相对于所述绳索卷轴摆动; 引导槽，其中所述尖端突出部分接合; 以及与滑轮的接合部接合从而起动发动机的卡合爪。 引导槽和接合爪设置在相对侧，以将旋转轴插入其间。

公开(公告)号：US20130152896A1

公开(公告)日：2013-06-20

申请号：US13716976

申请日：2012-12-17

Applicant: Satoshi Matsui ,  Taro Kihara

Inventor： Satoshi Matsui ,  Taro Kihara

IPC: F02N3/02

CPC classification number: F02N3/02 ,  F02N5/02

Abstract: One embodiment provides a recoil starter mechanism, including: a starter case having a rotation shaft; a rope reel rotatably mounted on the rotation shaft; a coil spring wound on the rotation shaft, one end thereof being formed into a tip projecting portion; a hold plate holding the coil spring to the rotation shaft; and a ratchet which is formed into a ring-like shape and interposed between the rope reel and the hold plate. The ratchet includes: a fulcrum around which the ratchet is swingable with respect to the rope reel; a guide groove in which the tip projecting portion is engaged; and an engagement pawl which is to be engaged with an engagement portion of a pulley to thereby start an engine. The guide groove and the engagement pawl are disposed at opposite sides so as to interpose the rotation shaft therebetween.

Abstract translation: 一个实施例提供一种反冲启动机构，包括：具有旋转轴的起动器壳体; 可旋转地安装在旋转轴上的绳索卷轴; 卷绕在旋转轴上的螺旋弹簧，其一端形成为前端突出部; 将所述螺旋弹簧保持在所述旋转轴上的保持板; 以及棘轮，其形成为环状形状并且插入在绳索卷轴和保持板之间。 所述棘轮包括：支轴，所述棘轮围绕所述支点相对于所述绳索卷轴摆动; 引导槽，其中所述尖端突出部分接合; 以及与滑轮的接合部接合从而起动发动机的卡合爪。 引导槽和接合爪设置在相对侧，以将旋转轴插入其间。

公开(公告)号：US08511272B2

公开(公告)日：2013-08-20

申请号：US12268257

申请日：2008-11-10

Applicant: Kazuaki Koyama ,  Sumito Hori ,  Satoshi Matsui

Inventor： Kazuaki Koyama ,  Sumito Hori ,  Satoshi Matsui

IPC: F02B67/00

CPC classification number: F02B67/00 ,  F02F7/0068

Abstract: A horizontal groove extending horizontally when an alternator bracket is fixed to a cylinder block of a vehicle engine is formed in the alternator bracket. A shank of a bolt inserted through mounting pieces of an alternator is inserted into the horizontal groove from a horizontally lateral direction toward the cylinder block to support the bolt on a lower surface of the horizontal groove. After insertion, the bolt is restrained from moving toward an opening of the horizontal groove. Since the insertion of the bolt into the horizontal groove is facilitated, and the weight of the alternator is borne by the lower surface of the horizontal groove, a burden on a fixing portion is reduced, and it becomes easy to position the alternator and hold it when it is fixed. Thus, the accessory can be mounted on the cylinder block with satisfactory work efficiency and with support accuracy kept high.

Abstract translation: 在交流发电机支架上形成有将交流发电机支架固定在车辆发动机的气缸体上时水平延伸的水平槽。 通过交流发电机的安装件插入的螺栓的柄部从水平方向朝向气缸体插入到水平槽中，以将螺栓支撑在水平槽的下表面上。 插入后，螺栓被限制向水平槽的开口移动。 由于容易将螺栓插入水平槽中，并且交流发电机的重量由水平槽的下表面承担，所以固定部分的负担减小，容易定位交流发电机并保持 当它是固定的。 因此，附件可以以令人满意的工作效率安装在气缸体上，并且支撑精度保持较高。

公开(公告)号：US20090302430A1

公开(公告)日：2009-12-10

申请号：US12477178

申请日：2009-06-03

Applicant: Nobuaki Takahashi ,  Masahiro Komuro ,  Satoshi Matsui

Inventor： Nobuaki Takahashi ,  Masahiro Komuro ,  Satoshi Matsui

IPC: H01L23/48 ,  H01L21/768 ,  H01L21/3205

CPC classification number: H01L23/481 ,  H01L21/76898 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05684 ,  H01L2224/13009 ,  H01L2224/131 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/13644 ,  H01L2224/13664 ,  H01L2224/17181 ,  H01L2924/00014

Abstract: In this semiconductor device, the through-hole is formed in the substrate, and is located under the conductive pattern. The insulating layer is located at the bottom surface of the through-hole. The conductive pattern is located on one surface side of the substrate. The opening pattern is formed in the insulating layer which is located between the through-hole and the conductive pattern, where the distance r3 from the circumference of the opening pattern to the central axis of the through-hole is smaller than the distance r1 in the through-hole. By providing the opening pattern, the conductive pattern is exposed at the bottom surface of the through-hole. The bump is located on the back surface side of the substrate, and is formed integrally with the through-electrode.

Abstract translation: 在该半导体装置中，通孔形成在基板上，位于导电图案的下方。 绝缘层位于通孔的底面。 导电图案位于基板的一个表面侧。 开口图案形成在位于通孔和导电图案之间的绝缘层中，其中从开口图案的周边到通孔的中心轴线的距离r3小于通孔中的距离r1 通孔。 通过设置开口图案，导电图案在通孔的底面露出。 凸块位于基板的背面侧，与贯通电极一体形成。

公开(公告)号：US20080222436A1

公开(公告)日：2008-09-11

申请号：US12043506

申请日：2008-03-06

Applicant: Satoshi Matsui

Inventor： Satoshi Matsui

IPC: G06F1/32

CPC classification number: G06F1/26 ,  G06F1/32

Abstract: A power supply voltage regulator circuit including a power supply circuit which switches to a first through a fourth state; the first state being the state wherein voltage is supplied to neither a normal circuit nor a backup system circuit based on the combination of logic for the normal circuit power control signal, the second state being the state wherein a primary power supply voltage is supplied to the normal circuit and a secondary power supply voltage is supplied to the backup system circuit, the third state being the state wherein voltage is not supplied to the normal circuit and the secondary power supply voltage is supplied to the backup system circuit, the fourth state being the state wherein the primary power supply voltage is supplied to both the normal circuit and the backup system circuit.

Abstract translation: 一种电源稳压器电路，包括切换到第一至第四状态的电源电路; 第一状态是基于用于正常电路功率控制信号的逻辑的组合而不向正常电路和备用系统电路供应电压的状态，第二状态是向第一状态提供主电源电压的状态 正常电路和次级电源电压被提供给备用系统电路，第三状态是其中电压不被提供给正常电路并且次级电源电压被提供给备用系统电路的状态，第四状态是 其中主电源电压被提供给正常电路和备用系统电路。

公开(公告)号：US20080048337A1

公开(公告)日：2008-02-28

申请号：US11842973

申请日：2007-08-22

Applicant: Nobuaki TAKAHASHI ,  Masahiro Komuro ,  Koji Soejima ,  Satoshi Matsui ,  Masaya Kawano

Inventor： Nobuaki TAKAHASHI ,  Masahiro Komuro ,  Koji Soejima ,  Satoshi Matsui ,  Masaya Kawano

IPC: H01L29/40 ,  H01L21/44

CPC classification number: H01L21/76898 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0401 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/06181 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/11901 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/14181 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/10329 ,  H01L2924/00014

Abstract: The present invention provides a semiconductor device including at least one of an insulating layer and a semiconductor layer each including a hole formed therein, and a through electrode provided in the hole. In the semiconductor device, the side wall of the hole is constituted of a first region from the opening of the hole to a predetermined position between the opening of the hole and the bottom surface of the hole, and a second region from the predetermined position to the bottom surface of the hole. The through electrode includes a seed layer and a plating layer. The seed layer covers the second region and the bottom surface of the hole without covering the first region. In addition, the plating layer covers the seed layer and at least a part of the first region.

Abstract translation: 本发明提供一种半导体器件，其包括绝缘层和各自包括形成在其中的孔的半导体层中的至少一个，以及设置在孔中的通孔。 在半导体装置中，孔的侧壁由从孔的开口到孔的开口部与孔的底面之间的规定位置的第一区域和从规定位置到第二区域 孔的底面。 通孔包括种子层和镀层。 种子层覆盖孔的第二区域和底部表面而不覆盖第一区域。 此外，电镀层覆盖种子层和第一区域的至少一部分。

公开(公告)号：US20070004084A1

公开(公告)日：2007-01-04

申请号：US11518274

申请日：2006-09-11

Applicant: Satoshi Matsui

Inventor： Satoshi Matsui

IPC: H01L21/00 ,  H01L23/02

CPC classification number: H01L25/50 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/544 ,  H01L24/81 ,  H01L25/0657 ,  H01L2223/54473 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/05684 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06593 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  Y10S438/975 ,  H01L2924/00 ,  H01L2924/00014

Abstract: The chip for the multi-chip semiconductor device having the markings for alignment formed on the front surface and/or the back surface of the chip only by the processing from the front surface of the chip (photolithography, etch) and the method for manufacturing same are presented, without adding any dedicated process step to the formation process for the marking for alignment. In the chip for the multi-chip semiconductor device having two or more electroconductive through plug in one chip for the multi-chip semiconductor device, one or more electroconductive through plugs are employed for the marking for alignment, and the chip is configured to allow identification of the marking for alignment on the front surface and/or the back surface of the chip for the multi-chip semiconductor device. Then, an insulating film is provided on the front surface and/or the back surface of the electrically conducting through plug.

Abstract translation: 仅通过从芯片的前表面（光刻，蚀刻）的处理及其制造方法的仅在芯片的前表面和/或后表面上形成的用于对准的标记的多芯片半导体器件的芯片 而不需要为对准标记的形成过程添加任何专门的工艺步骤。 在具有用于多芯片半导体器件的一个芯片中具有两个或多个导电贯穿插头的多芯片半导体器件的芯片中，采用一个或多个导电通孔用于对准的标记，并且芯片被配置为允许识别 用于在用于多芯片半导体器件的芯片的前表面和/或背表面上对准的标记。 然后，在导电贯通插头的前表面和/或后表面上设置绝缘膜。

公开(公告)号：US20060118965A1

公开(公告)日：2006-06-08

申请号：US11290433

申请日：2005-12-01

Applicant: Satoshi Matsui

Inventor： Satoshi Matsui

IPC: H01L23/48

CPC classification number: H01L23/481 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: The layout density of the through electrodes in the horizontal plane of the substrate is enhanced. Through holes 103 extending through the silicon substrate 101 is provided. An insulating film 105 is buried within the through hole 103. A plurality of columnar through plugs 107 are provided in the insulating film 105.

Abstract translation: 衬底的水平面中的贯通电极的配置密度提高。 提供延伸穿过硅衬底101的通孔103。 绝缘膜105被埋在通孔103内。绝缘膜105中设有多个柱状贯通插头107。

公开(公告)号：US20050252463A1

公开(公告)日：2005-11-17

申请号：US11125143

申请日：2005-05-10

Applicant: Satoshi Matsui ,  Toshihiko Oka ,  Koichi Yoshimoto ,  Yoshinori Sakurai ,  Tetsushi Nagira ,  Kenichi Morishima

Inventor： Satoshi Matsui ,  Toshihiko Oka ,  Koichi Yoshimoto ,  Yoshinori Sakurai ,  Tetsushi Nagira ,  Kenichi Morishima

IPC: F02F1/38 ,  F01P3/02 ,  F02B31/00 ,  F02F1/24 ,  F02F1/26 ,  F02F1/36 ,  F02F1/40 ,  F02F1/42

CPC classification number: F02F1/40 ,  F02B31/00

Abstract: The bottom surface 18 of the cylinder head 10 is formed by an intake-side bottom surface 18a and an exhaust-side bottom surface 18b on which an intake port 13 and an exhaust port 15 are formed respectively. Further, a first wall 19 formed between an intake-side water jacket 16 and the intake-side bottom surface 18a is larger in thickness than a second wall 20 formed between an exhaust-side water jacket 17 and the exhaust-side bottom surface 18b. This structure can reduce an amount of HC included in exhaust gas.

Abstract translation: 气缸盖10的底表面18由分别形成有进气口13和排气口15的进气侧底面18a和排气侧底面18b形成。 此外，形成在进气侧水套16和进气侧底面18a之间的第一壁19的厚度大于形成在排气侧水套17和排气侧底面18之间的第二壁20 b。 该结构可以减少废气中包含的HC的量。

公开(公告)号：US20050182885A1

公开(公告)日：2005-08-18

申请号：US10898339

申请日：2004-07-26

Applicant: Satoshi Matsui ,  Seiji Suetake

Inventor： Satoshi Matsui ,  Seiji Suetake

IPC: G06F12/04 ,  G06F13/16 ,  G06F13/40

CPC classification number: G06F13/1678 ,  G06F13/4018

Abstract: A data controlling unit activates a predetermined number of data terminals according to a mode signal and changes a bus width of external data signal. According to the mode signal, an address controlling unit selects a predetermined number of bits of an internal address signal outputted from a controller and outputs the selected bits as an external address signal. Specifically, the address controlling unit selects upper bits of the internal address signal when the bus width of the external data signal is increased according to the mode signal. Therefore, it is possible to prevent occurrence of an unused external address terminal, enabling the increase in accessible external memory capacity.

Abstract translation: 数据控制单元根据模式信号激活预定数量的数据终端并改变外部数据信号的总线宽度。 根据模式信号，地址控制单元选择从控制器输出的内部地址信号的预定数量的比特，并将所选择的比特输出为外部地址信号。 具体地说，当根据模式信号增加外部数据信号的总线宽度时，地址控制单元选择内部地址信号的高位。 因此，可以防止未使用的外部地址端子的发生，从而能够增加可访问的外部存储器容量。