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    Electrical interconnect for die stacked in zig-zag configuration
    8.
    发明授权
    Electrical interconnect for die stacked in zig-zag configuration 有权
    用于以锯齿形配置堆叠的管芯的电互连

    公开(公告)号：US08680687B2

    公开(公告)日：2014-03-25

    申请号：US12821454

    申请日：2010-06-23

    申请人： Reynaldo Co ,  Grant Villavicencio ,  Jeffrey S. Leal ,  Simon J. S. McElrea

    发明人： Reynaldo Co ,  Grant Villavicencio ,  Jeffrey S. Leal ,  Simon J. S. McElrea

    IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

    CPC分类号： H01L25/0657 ,  H01L24/24 ,  H01L24/82 ,  H01L25/50 ,  H01L2224/24145 ,  H01L2224/24226 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/92244 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/14

    摘要： A die (or of a stack of die) is mounted over and elevated above a support, and is electrically connected to circuitry in the support. Pillars of electrically conductive material are formed on a set of bond pads at a mount side of the support, and the elevated die (or at least one die in the elevated stack of die) is electrically connected to the support, by traces of an electrically conductive material contacting interconnect pads on the die to the pillars, and through the pillars to the support. Also, tiered offset stacked die assemblies in a zig-zag configuration, in which the interconnect edges of a first (lower) tier face in a first direction, and the interconnect edges of a second (upper) tier, stacked over the first tier, face in a second direction, different from the first direction, are electrically connected to a support. Die in the first tier are electrically interconnected die-to-die, and the tier is electrically connected to a support, by traces of an electrically conductive material contacting interconnect pads on the die and a first set of bond pads on the support. Pillars of a electrically conductive material are formed on a second set of bond pads, and die in the second tier are electrically interconnected die-to-die, and the tier is electrically connected to the support, by traces of an electrically conductive material contacting interconnect pads on the die to the pillars, and through the pillars to the substrate.

    摘要翻译： 模具（或一堆模具）安装在支撑件上并在支撑件上方升高，并且电连接到支撑件中的电路。 导电材料的支柱形成在支撑件的安装侧的一组接合焊盘上，并且升高的模具（或模具的升高堆叠中的至少一个模具）通过电气迹线电连接到支撑件 导电材料将管芯上的互连焊盘接触到支柱，并且通过支柱到支撑件。 而且，以Z字形配置的分层偏移堆叠模组组件，其中第一（下）层的第一方向上的互连边缘和第二层（第二层）堆叠在第一层上的互连边缘， 在与第一方向不同的第二方向上面对电连接到支撑件。 在第一层中的管芯被电连接到芯片之间，并且该层通过导电材料的痕迹电连接到支撑件，导电材料接触管芯上的互连焊盘和支撑件上的第一组接合焊盘。 导电材料的支柱形成在第二组接合焊盘上，并且第二层中的管芯与管芯电连接，并且该层通过迹线导电材料接触互连 模具上的垫子到柱子上，并通过柱子到基底。

    Electrical interconnect for die stacked in zig-zag configuration
    10.
    发明申请
    Electrical interconnect for die stacked in zig-zag configuration 有权
    用于以锯齿形配置堆叠的管芯的电互连

    公开(公告)号：US20100327461A1

    公开(公告)日：2010-12-30

    申请号：US12821454

    申请日：2010-06-23

    申请人： Reynaldo Co ,  Grant Villavicencio ,  Jeffrey S. Leal ,  Simon J.S. McElrea

    发明人： Reynaldo Co ,  Grant Villavicencio ,  Jeffrey S. Leal ,  Simon J.S. McElrea

    IPC分类号： H01L25/065 ,  H01L21/60 ,  H01L21/77 ,  H01L23/538

    CPC分类号： H01L25/0657 ,  H01L24/24 ,  H01L24/82 ,  H01L25/50 ,  H01L2224/24145 ,  H01L2224/24226 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/92244 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/14

    摘要： A die (or of a stack of die) is mounted over and elevated above a support, and is electrically connected to circuitry in the support. Pillars of electrically conductive material are formed on a set of bond pads at a mount side of the support, and the elevated die (or at least one die in the elevated stack of die) is electrically connected to the support, by traces of an electrically conductive material contacting interconnect pads on the die to the pillars, and through the pillars to the support. Also, tiered offset stacked die assemblies in a zig-zag configuration, in which the interconnect edges of a first (lower) tier face in a first direction, and the interconnect edges of a second (upper) tier, stacked over the first tier, face in a second direction, different from the first direction, are electrically connected to a support. Die in the first tier are electrically interconnected die-to-die, and the tier is electrically connected to a support, by traces of an electrically conductive material contacting interconnect pads on the die and a first set of bond pads on the support. Pillars of a electrically conductive material are formed on a second set of bond pads, and die in the second tier are electrically interconnected die-to-die, and the tier is electrically connected to the support, by traces of an electrically conductive material contacting interconnect pads on the die to the pillars, and through the pillars to the substrate.

    摘要翻译： 模具（或一堆模具）安装在支撑件上并在支撑件上方升高，并且电连接到支撑件中的电路。 导电材料的支柱形成在支撑件的安装侧的一组接合焊盘上，并且升高的模具（或模具的升高堆叠中的至少一个模具）通过电气迹线电连接到支撑件 导电材料将管芯上的互连焊盘接触到支柱，并且通过支柱到支撑件。 而且，以Z字形配置的分层偏移堆叠模组组件，其中第一（下）层的第一方向上的互连边缘和第二层（第二层）堆叠在第一层上的互连边缘， 在与第一方向不同的第二方向上面对电连接到支撑件。 在第一层中的管芯被电连接到芯片之间，并且该层通过导电材料的痕迹电连接到支撑件，导电材料接触管芯上的互连焊盘和支撑件上的第一组接合焊盘。 导电材料的支柱形成在第二组接合焊盘上，并且第二层中的管芯与管芯电连接，并且该层通过迹线导电材料接触互连 模具上的垫子到柱子上，并通过柱子到基底。