公开(公告)号：US5408559A

公开(公告)日：1995-04-18

申请号：US150307

申请日：1993-11-12

申请人： Shoichi Takahashi ,  Masando Tozawa ,  Atsushi Sasayama ,  Yoshihiko Kobayashi ,  Hideo Taguchi

发明人： Shoichi Takahashi ,  Masando Tozawa ,  Atsushi Sasayama ,  Yoshihiko Kobayashi ,  Hideo Taguchi

IPC分类号： G02B6/28 ,  G02B6/42 ,  H01L31/0232 ,  H01S5/00 ,  G02B6/36

CPC分类号： G02B6/422 ,  G02B6/4246

摘要： In a transmitting and receiving optoelectronic device, a wave-separating filter (16) is disposed at a position deviated from 45.degree. with respect to the optical axis of transmission light (6), or the internal wall surface of a light passage hole (15A) of a support (15) is inclined with respect to the optical axis of the transmission light (5). In another arrangement, a light-transmitting optical unit (1) and a wave-separating optical unit (13) are provided as separate units, and optical-axis adjustment is performed with only the light-transmitting optical unit (1).

摘要翻译： 在发送和接收光电子器件中，波分离滤光器（16）设置在相对于透射光（6）的光轴偏离45°的位置，或者光通孔（15A）的内壁表面 ）相对于透射光（5）的光轴倾斜。 在另一种布置中，光传输光学单元（1）和波分离光学单元（13）被设置为分离单元，并且仅使用透光光学单元（1）进行光轴调节。

公开(公告)号：US06778486B1

公开(公告)日：2004-08-17

申请号：US09498818

申请日：2000-02-04

申请人： Kouji Arikawa ,  Susumu Tachibana ,  Kazuo Shigematsu ,  Hideo Taguchi ,  Shigeru Nakamura ,  Tetsuya Tomobe

发明人： Kouji Arikawa ,  Susumu Tachibana ,  Kazuo Shigematsu ,  Hideo Taguchi ,  Shigeru Nakamura ,  Tetsuya Tomobe

IPC分类号： G11B700

CPC分类号： G11B7/22 ,  G02B6/4201 ,  G02B6/4214 ,  G11B7/123 ,  G11B7/1275 ,  G11B2007/0006 ,  H01S5/02252 ,  H01S5/02272 ,  H01S5/02292 ,  H01S5/4087

摘要： In a laser module holding a semiconductor laser chip and a reflecting surface, to perform positioning on the semiconductor laser chip with high precision, and reduce the period of production, so as to realize downsizing and cost reduction, reflecting surfaces provided on a silicon substrate has a step portion, and the reflecting surfaces are used as reflecting surface for laser emission light and laser chip positioning surface, for high precision positioning. Further, in a laser module which requires a high level power for recording, slopes opposite to side surfaces of the semiconductor laser chip in a lengthwise direction have a step portion, and in wiring of lower electrodes of the laser chip from the bottom of the sink to an upper portion of the silicon substrate, a slope having an angle with respect to the laser chip lengthwise direction is formed as a gentle slope, then wiring is made via the slope, thus mitigating occurrence of migration.

摘要翻译： 在保持半导体激光器芯片和反射面的激光器模块中，为了在半导体激光器芯片上精确地进行定位并缩短生产周期，为了实现小型化和降低成本，在硅基板上设置的反射面具有 台阶部分，反射面用作激光发射光和激光芯片定位面的反射面，用于高精度定位。 此外，在需要高电平记录的激光模块中，与半导体激光芯片的长度方向的侧面相反的斜面具有阶梯部，并且在从接收器底部的激光芯片的下部电极的配线 形成相对于激光芯片长度方向具有一定角度的倾斜度，作为平缓的坡度，然后通过坡度进行布线，从而减轻迁移的发生。

公开(公告)号：US20130062758A1

公开(公告)日：2013-03-14

申请号：US13422424

申请日：2012-03-16

申请人： Takashi IMOTO ,  Yoriyasu Ando ,  Akira Tanimoto ,  Masaji Iwamoto ,  Yasuo Takemoto ,  Hideo Taguchi ,  Naoto Takebe ,  Koichi Miyashita ,  Jun Tanaka ,  Katsuhiro Ishida ,  Shogo Watanabe ,  Yuichi Sano

发明人： Takashi IMOTO ,  Yoriyasu Ando ,  Akira Tanimoto ,  Masaji Iwamoto ,  Yasuo Takemoto ,  Hideo Taguchi ,  Naoto Takebe ,  Koichi Miyashita ,  Jun Tanaka ,  Katsuhiro Ishida ,  Shogo Watanabe ,  Yuichi Sano

IPC分类号： H01L25/07 ,  H01L23/48

CPC分类号： H01L23/3135 ,  H01L23/145 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49894 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48624 ,  H01L2224/48824 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/83104 ,  H01L2224/92247 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/16225 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/32145 ,  H01L2224/45015 ,  H01L2924/207

摘要： In one embodiment, a semiconductor device has a substrate, a first semiconductor chip, an electrode, a first and second connection member, and a first and second sealing member. The electrode is disposed on the first semiconductor chip and contains Al. The first connection member electrically connects the electrode and the substrate and contains Au or Cu. The first sealing member seals the first semiconductor chip and the first connection member. One or more second semiconductor chips are stacked on the first sealing member. The second sealing member seals the first connection member, the one or more second semiconductor chips, and the one or more second connection members. A ratio of a total weight W1 of Cl ions and Br ions in the first sealing member to a weight W0 of resins of the substrate and the first sealing member is 7.5 ppm or lower.

摘要翻译： 在一个实施例中，半导体器件具有衬底，第一半导体芯片，电极，第一和第二连接构件以及第一和第二密封构件。 电极设置在第一半导体芯片上并且包含Al。 第一连接构件电连接电极和衬底并且包含Au或Cu。 第一密封构件密封第一半导体芯片和第一连接构件。 一个或多个第二半导体芯片堆叠在第一密封构件上。 第二密封构件密封第一连接构件，一个或多个第二半导体芯片和一个或多个第二连接构件。 第一密封部件中的Cl离子和Br离子的总重量W1与基板和第一密封部件的树脂的重量W0的比例为7.5ppm以下。

公开(公告)号：US4234342A

公开(公告)日：1980-11-18

申请号：US963164

申请日：1978-11-22

申请人： Isao Wakasa ,  Shuichi Yamazaki ,  Hideo Taguchi

发明人： Isao Wakasa ,  Shuichi Yamazaki ,  Hideo Taguchi

IPC分类号： C04B14/42 ,  C03C3/078 ,  C03C13/00 ,  C03C13/02 ,  C03C3/04

CPC分类号： C03C3/078 ,  C03C13/002

摘要： A glass composition comprising 54-60% by weight of SiO.sub.2, 13-16% by weight of ZrO.sub.2, 12-15% by weight of Na.sub.2 O, 5.5-14% by weight of MnO and 0-7% by weight of CaO, in which MnO+CaO is 11% by weight or more and MnO.gtoreq.CaO, can produce alkali resistant glass fibers which can be used for reinforcing cement products.

摘要翻译： 包含54-60重量％的SiO 2，13-16重量％的ZrO 2，12-15重量％的Na 2 O，5.5-14重量％的MnO和0-7重量％的CaO的玻璃组合物， MnO + CaO为11重量％以上，MnO> = CaO，可以制造可用于增强水泥制品的耐碱玻璃纤维。

公开(公告)号：US06390030B1

公开(公告)日：2002-05-21

申请号：US09580531

申请日：2000-05-26

申请人： Ryuhei Isogawa ,  Yasuhiro Nobata ,  Masatsune Kondo ,  Shigeru Ogino ,  Kenji Kimura ,  Masayoshi Taki ,  Akihisa Nishimura ,  Masaaki Yamaoka ,  Yoshimasa Negishi ,  Hideo Taguchi ,  Norihiko Saito ,  Atsushi Takumi

发明人： Ryuhei Isogawa ,  Yasuhiro Nobata ,  Masatsune Kondo ,  Shigeru Ogino ,  Kenji Kimura ,  Masayoshi Taki ,  Akihisa Nishimura ,  Masaaki Yamaoka ,  Yoshimasa Negishi ,  Hideo Taguchi ,  Norihiko Saito ,  Atsushi Takumi

IPC分类号： C01B332

CPC分类号： H01M8/0631 ,  B01J8/0496 ,  B01J19/2485 ,  B01J2208/00061 ,  B01J2208/00309 ,  B01J2208/0053 ,  B01J2208/00716 ,  B01J2219/002 ,  B01J2219/00231 ,  C01B3/323 ,  C01B3/38 ,  C01B3/583 ,  C01B2203/0244 ,  C01B2203/044 ,  C01B2203/047 ,  C01B2203/0811 ,  C01B2203/0822 ,  C01B2203/0827 ,  C01B2203/0838 ,  C01B2203/0844 ,  C01B2203/085 ,  C01B2203/0866 ,  C01B2203/0883 ,  C01B2203/1023 ,  C01B2203/1076 ,  C01B2203/1082 ,  C01B2203/1217 ,  C01B2203/1223 ,  C01B2203/1235 ,  C01B2203/1276 ,  C01B2203/1288 ,  C01B2203/143 ,  C01B2203/1604 ,  C01B2203/1609 ,  C01B2203/1619 ,  C01B2203/1633 ,  C01B2203/1638 ,  C01B2203/169 ,  C01B2203/1695 ,  C01B2203/82 ,  Y02P20/128

摘要： A fuel reformer suited for mounting on a vehicle is provided. A raw material gas containing methanol and water is vaporized at a vaporization section 30. The vaporized gas flows horizontally to a reforming section 60 with monolithic catalyst 70. The reforming section is divided into two sides, a front side 62 and a rear side 64, with an interconnecting pipe 66 bent at 180 degrees, for connecting the front and rear sides. By making the material gas flow horizontally, even when the reformer is mounted to a vehicle which has a larger space in its horizontal direction than in its vertical direction, especially a small passenger car, the contact time period between gas and catalyst can be extended. By bending the reforming section by 180 degrees, the size of the reformer can be reduced so that the reformer is suited for mounting on a vehicle having limited space. Because the vaporization section 30 and the CO reducing section 80 can be placed adjacent to each other, by using heat generated at the CO reducing section, the heat loss during pre-heating of the methanol and water can be reduced.

摘要翻译： 提供了适合于安装在车辆上的燃料重整器。 含有甲醇和水的原料气体在蒸发部分30蒸发。汽化的气体水平流动到具有整体催化剂70的重整部分60.重整部分分为两侧，前侧62和后侧64， 具有弯曲180度的互连管66，用于连接前侧和后侧。 通过使材料气体水平地流动，即使将重整器安装到水平方向上的空间大于其垂直方向的车辆，特别是小型乘用车，也可以延长气体与催化剂的接触时间。 通过将重整部分弯曲180度，可以减小重整器的尺寸，使得重整器适合于安装在具有有限空间的车辆上。 由于蒸发部分30和CO还原部分80可以彼此相邻放置，所以通过使用在CO还原部分产生的热量，可以减少甲醇和水的预热期间的热损失。

公开(公告)号：US5025347A

公开(公告)日：1991-06-18

申请号：US336429

申请日：1989-04-11

申请人： Masamichi Shindo ,  Toshiharu Sakurai ,  Hideo Taguchi ,  Nobu Izawa

发明人： Masamichi Shindo ,  Toshiharu Sakurai ,  Hideo Taguchi ,  Nobu Izawa

IPC分类号： H01L23/12 ,  H01L23/04 ,  H01L23/045 ,  H01L23/373

CPC分类号： H01L23/045 ,  H01L23/3731 ,  H01L23/3736 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/16152

摘要： A semiconductor device of a type having a pin grid array, comprises a printed circuit board and a planar metal stem with a plurality of through holes. The stem is made of metal having a coefficient of thermal expansion .alpha.s. The printed circuit board has a predetermined wiring pattern on its upper surface and is made of a material having a maximum coefficient .alpha.p in the widthwise direction. The printed circuit board is superposed over the upper surface of the metal stem. A plurality of lead pins have upper portions inserted into the through holes of the stem and board and are in alignment with each other when the board and the stem are superposed one upon another. Connecting members connect the upper portions of the lead pins with their corresponding wiring patterns. In the semiconductor device, the absolute value .DELTA..alpha. of the difference between the maximum coefficient .alpha.p of the board and the coefficient .alpha.s of the stem (.DELTA..alpha.=.alpha.p -.alpha.s) is less than or equal to "1.52.times.10.sup.-4 /L" (.DELTA..alpha..ltoreq.1.52 .times.10.sup.-4 /L).

摘要翻译： 具有针格阵列的类型的半导体器件包括印刷电路板和具有多个通孔的平面金属杆。 杆由具有热膨胀系数αs的金属制成。 印刷电路板在其上表面上具有预定的布线图案，并且由在宽度方向上具有最大系数αp的材料制成。 印刷电路板重叠在金属杆的上表面上。 多个引导销具有插入到杆和板的通孔中的上部，并且当板和杆彼此叠置时彼此对准。 连接构件将引脚的上部与其对应的布线图案相连。 在半导体器件中，板的最大系数αp与茎的系数αs之差（DELTAα=αp-αs）的绝对值DELTAα小于或等于“1.52×10 -3” 4 / L“（DELTAα

公开(公告)号：US5944540A

公开(公告)日：1999-08-31

申请号：US95754

申请日：1998-06-11

申请人： Junichi Asada ,  Hideo Taguchi ,  Isao Baba ,  Toshiyasu Ito

发明人： Junichi Asada ,  Hideo Taguchi ,  Isao Baba ,  Toshiyasu Ito

IPC分类号： H01R13/658 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H05K9/00 ,  H01R4/66

CPC分类号： H01R12/721 ,  H05K9/0039 ,  H01R23/688 ,  H05K1/0218 ,  H05K1/117 ,  H05K3/3405

摘要： An operation assuring structure of an electronic circuit board in a connector for the electronic circuit board including an insert plate portion disposed on an end portion of an electronic circuit board and adapted to be inserted into a receiving port of a connector, a plurality of signal electronic pads arranged on a surface of the insert plate portion, and a plurality of signal contacts disposed within the receiving port of the connector and adapted to be contacted to the signal electrode pads, wherein a cut-off grounding contact, which is not conductive to the electronic circuit board, is interposed between the signal contacts within the receiving port, and the cut-off grounding contact has a length dimension enough to extend in parallel to the signal contacts and to interpose a distal end thereof between the signal electrode pads on the insert plate portion.

摘要翻译： 一种用于电子电路板的连接器中的电子电路板结构的操作，包括设置在电子电路板的端部上并适于插入连接器的接收端口的插入板部分，多个信号电子 布置在插入板部分的表面上的焊盘以及设置在连接器的接收端口内并且适于与信号电极焊盘接触的多个信号触点，其中截止接地触点对于 电子电路板插入在接收端口内的信号触点之间，并且截止接地触头具有足够的长度尺寸以足以平行于信号触头延伸并且将其远端插入到插入件上的信号电极焊盘之间 板部分。

公开(公告)号：US5096081A

公开(公告)日：1992-03-17

申请号：US313555

申请日：1989-02-22

申请人： Masamichi Shindo ,  Toshiharu Sakurai ,  Hideo Taguchi ,  Nobu Izawa

发明人： Masamichi Shindo ,  Toshiharu Sakurai ,  Hideo Taguchi ,  Nobu Izawa

IPC分类号： H01L23/02 ,  H01L23/04

CPC分类号： H01L23/04 ,  H01L2924/0002

摘要： A metal cover plate for covering a semiconductor chip mounted on a package base plate comprises an upper central portion, a flange extending outwardly from outer edges of the central portion, and a side wall portion extending perpendicularly from the flange along all sides thereof. The central portion has at least one portion in parallel with the package base plate. The central portion is formed with reinforcing portions in the form ridges of gable roofs and valleys in cross section, formed along diagonal lines of the central portion or in the form of a ridge or rib substantially semicircular in cross section extending upwardly or downwardly along each diagonal line. Deflection of the top wall portion of the package during pressure application is thus be minimized.

公开(公告)号：US5017205A

公开(公告)日：1991-05-21

申请号：US502178

申请日：1990-03-30

申请人： Kozo Shioura ,  Hideo Taguchi

发明人： Kozo Shioura ,  Hideo Taguchi

IPC分类号： C03B37/083 ,  C03B37/095 ,  D01D4/02

CPC分类号： C03B37/083 ,  C03B37/095

摘要： A nozzle plate for spinning glass fiber including a flat plate portion and a multiplicity of nozzles projecting from the flat plate portion. Each of the nozzles comprises a greater diameter portion located at its flat plate portion side and a smaller diameter portion located at its tip side. The smaller diameter portion has an inner diameter of 0.3 mm to 1.0 mm and a length of 0.5 mm to 2.0 mm, and the greater diameter portion has an inner diameter of 1.1 mm to 2.5 mm, and the length of the nozzle projecting from the flat plate portion is in range of 4.0 mm to 6.0 mm. By use of this nozzle plate for spining glass fiber, a fine glass fiber having a diameter smaller than 3 .mu.m can be manufactured in a stable manner.

公开(公告)号：US06913411B2

公开(公告)日：2005-07-05

申请号：US10276012

申请日：2002-03-01

申请人： Jindai Yamakawa ,  Mamoru Sano ,  Hideo Taguchi

发明人： Jindai Yamakawa ,  Mamoru Sano ,  Hideo Taguchi

IPC分类号： A44C5/10 ,  A44C5/02

CPC分类号： A44C5/105 ,  Y10T403/32893 ,  Y10T403/49 ,  Y10T403/55 ,  Y10T403/553

摘要： A coupling structure of a watch band in which a coupling member such as a coupling pin or a hair pin does not sup from a coupling hole even if a user practices strenuous sports or a rotation and a twist are always applied to the coupling portion due to use for years, and a method of manufacturing a piece member for the band coupling structure. In a coupling structure of a band comprising a plurality of piece members, a projection protruded in a central direction of a coupling hole from an internal wall of the coupling hole is formed on an outer end of the coupling hole in the piece member positioned on an outside in a transverse direction, and a coupling member is inserted in the coupling hole provided in the transverse direction of the piece member and is engaged with the projection, thereby coupling the piece members to each other.

摘要翻译： 即使用户进行剧烈运动或旋转和扭转，连接销或发针等联接构件也不会从联接孔延伸，因此，由于 使用多年，以及制造用于带状耦合结构的片状构件的方法。 在包括多个片状构件的带的联接结构中，在位于所述连接孔的所述构件中的所述接合孔的外端上形成有从所述接合孔的内壁在连接孔的中心方向突出的突出部 在横向方向外侧，并且联接构件插入到沿着构件的横向方向设置的联接孔中并与突起接合，从而将构件彼此联接。