摘要:
An operation assuring structure of an electronic circuit board in a connector for the electronic circuit board including an insert plate portion disposed on an end portion of an electronic circuit board and adapted to be inserted into a receiving port of a connector, a plurality of signal electronic pads arranged on a surface of the insert plate portion, and a plurality of signal contacts disposed within the receiving port of the connector and adapted to be contacted to the signal electrode pads, wherein a cut-off grounding contact, which is not conductive to the electronic circuit board, is interposed between the signal contacts within the receiving port, and the cut-off grounding contact has a length dimension enough to extend in parallel to the signal contacts and to interpose a distal end thereof between the signal electrode pads on the insert plate portion.
摘要:
An IC chip and overhang portions are stuck to tape by an adhesive agent layer having elasticity. A plurality of solder balls are attached to the tape. By soldering the solder balls to a printed board, a semiconductor device is mounted. In the case where a temperature cycle has been caused, thermal stress occurs between the IC chip and the printed board or between the hangover portion and the printed board because of a difference in coefficient of thermal expansion between the IC chip or the hangover portion and the printed board. However, this thermal stress is absorbed by the elasticity of the adhesive agent layer. As a result, little thermal stress is applied to solder balls. Even if the above described temperature cycle is repeated, therefore, the solder balls are electrically connected to the printed board stably over a long period of time. In addition, the area of the tape is widened by the area of the hangover portions. Accordingly, a larger number of solder balls can be attached to the tape without reducing the size of each of the solder balls.
摘要:
In a laser module holding a semiconductor laser chip and a reflecting surface, to perform positioning on the semiconductor laser chip with high precision, and reduce the period of production, so as to realize downsizing and cost reduction, reflecting surfaces provided on a silicon substrate has a step portion, and the reflecting surfaces are used as reflecting surface for laser emission light and laser chip positioning surface, for high precision positioning. Further, in a laser module which requires a high level power for recording, slopes opposite to side surfaces of the semiconductor laser chip in a lengthwise direction have a step portion, and in wiring of lower electrodes of the laser chip from the bottom of the sink to an upper portion of the silicon substrate, a slope having an angle with respect to the laser chip lengthwise direction is formed as a gentle slope, then wiring is made via the slope, thus mitigating occurrence of migration.
摘要:
In one embodiment, a semiconductor device has a substrate, a first semiconductor chip, an electrode, a first and second connection member, and a first and second sealing member. The electrode is disposed on the first semiconductor chip and contains Al. The first connection member electrically connects the electrode and the substrate and contains Au or Cu. The first sealing member seals the first semiconductor chip and the first connection member. One or more second semiconductor chips are stacked on the first sealing member. The second sealing member seals the first connection member, the one or more second semiconductor chips, and the one or more second connection members. A ratio of a total weight W1 of Cl ions and Br ions in the first sealing member to a weight W0 of resins of the substrate and the first sealing member is 7.5 ppm or lower.
摘要:
A glass composition comprising 54-60% by weight of SiO.sub.2, 13-16% by weight of ZrO.sub.2, 12-15% by weight of Na.sub.2 O, 5.5-14% by weight of MnO and 0-7% by weight of CaO, in which MnO+CaO is 11% by weight or more and MnO.gtoreq.CaO, can produce alkali resistant glass fibers which can be used for reinforcing cement products.
摘要:
A fuel reformer suited for mounting on a vehicle is provided. A raw material gas containing methanol and water is vaporized at a vaporization section 30. The vaporized gas flows horizontally to a reforming section 60 with monolithic catalyst 70. The reforming section is divided into two sides, a front side 62 and a rear side 64, with an interconnecting pipe 66 bent at 180 degrees, for connecting the front and rear sides. By making the material gas flow horizontally, even when the reformer is mounted to a vehicle which has a larger space in its horizontal direction than in its vertical direction, especially a small passenger car, the contact time period between gas and catalyst can be extended. By bending the reforming section by 180 degrees, the size of the reformer can be reduced so that the reformer is suited for mounting on a vehicle having limited space. Because the vaporization section 30 and the CO reducing section 80 can be placed adjacent to each other, by using heat generated at the CO reducing section, the heat loss during pre-heating of the methanol and water can be reduced.
摘要:
A semiconductor device of a type having a pin grid array, comprises a printed circuit board and a planar metal stem with a plurality of through holes. The stem is made of metal having a coefficient of thermal expansion .alpha.s. The printed circuit board has a predetermined wiring pattern on its upper surface and is made of a material having a maximum coefficient .alpha.p in the widthwise direction. The printed circuit board is superposed over the upper surface of the metal stem. A plurality of lead pins have upper portions inserted into the through holes of the stem and board and are in alignment with each other when the board and the stem are superposed one upon another. Connecting members connect the upper portions of the lead pins with their corresponding wiring patterns. In the semiconductor device, the absolute value .DELTA..alpha. of the difference between the maximum coefficient .alpha.p of the board and the coefficient .alpha.s of the stem (.DELTA..alpha.=.alpha.p -.alpha.s) is less than or equal to "1.52.times.10.sup.-4 /L" (.DELTA..alpha..ltoreq.1.52 .times.10.sup.-4 /L).
摘要:
In a transmitting and receiving optoelectronic device, a wave-separating filter (16) is disposed at a position deviated from 45.degree. with respect to the optical axis of transmission light (6), or the internal wall surface of a light passage hole (15A) of a support (15) is inclined with respect to the optical axis of the transmission light (5). In another arrangement, a light-transmitting optical unit (1) and a wave-separating optical unit (13) are provided as separate units, and optical-axis adjustment is performed with only the light-transmitting optical unit (1).
摘要:
A metal cover plate for covering a semiconductor chip mounted on a package base plate comprises an upper central portion, a flange extending outwardly from outer edges of the central portion, and a side wall portion extending perpendicularly from the flange along all sides thereof. The central portion has at least one portion in parallel with the package base plate. The central portion is formed with reinforcing portions in the form ridges of gable roofs and valleys in cross section, formed along diagonal lines of the central portion or in the form of a ridge or rib substantially semicircular in cross section extending upwardly or downwardly along each diagonal line. Deflection of the top wall portion of the package during pressure application is thus be minimized.
摘要:
A nozzle plate for spinning glass fiber including a flat plate portion and a multiplicity of nozzles projecting from the flat plate portion. Each of the nozzles comprises a greater diameter portion located at its flat plate portion side and a smaller diameter portion located at its tip side. The smaller diameter portion has an inner diameter of 0.3 mm to 1.0 mm and a length of 0.5 mm to 2.0 mm, and the greater diameter portion has an inner diameter of 1.1 mm to 2.5 mm, and the length of the nozzle projecting from the flat plate portion is in range of 4.0 mm to 6.0 mm. By use of this nozzle plate for spining glass fiber, a fine glass fiber having a diameter smaller than 3 .mu.m can be manufactured in a stable manner.