公开(公告)号：US09647311B2

公开(公告)日：2017-05-09

申请号：US15097538

申请日：2016-04-13

申请人： Sony Corporation

发明人： Hirofumi Kawamura ,  Yasuhiro Okada

IPC分类号： H01P3/16 ,  G01S7/03 ,  H01Q9/04 ,  H04B10/00 ,  H04B10/50 ,  H04B10/516 ,  H04B10/556 ,  H01P5/02 ,  H04B1/3822 ,  G01S13/93

CPC分类号： H01P3/16 ,  G01S7/032 ,  G01S2013/9371 ,  H01P5/02 ,  H01Q9/0407 ,  H01Q9/045 ,  H04B1/3822 ,  H04B10/00 ,  H04B10/501 ,  H04B10/5161 ,  H04B10/556 ,  Y10T29/49016

摘要： A millimeter wave transmission device, the millimeter wave transmission device having (a) a first signal processing board for processing a millimeter wave signal; (b) a second signal processing board signal-coupled to the first signal processing board to receive the millimeter wave signal and perform signal processing with respect to the millimeter wave signal; and (c) a viscoelastic member provided between the first signal processing board and the second signal processing board and having a predetermined relative dielectric constant and a predetermined dielectric dissipation factor. The member constitutes a dielectric transmission path via which the millimeter wave signal is transmitted between the first signal processing board and the signal processing board.

公开(公告)号：US09130608B2

公开(公告)日：2015-09-08

申请号：US14317158

申请日：2014-06-27

申请人： Sony Corporation

发明人： Hirofumi Kawamura

IPC分类号： H03D7/16 ,  H04B1/03 ,  G06K19/077 ,  H01Q1/22 ,  H04B5/00 ,  H04B7/26

CPC分类号： H04B1/03 ,  G06K19/07749 ,  G06K19/07786 ,  H01Q1/2275 ,  H01Q1/2283 ,  H04B5/0025 ,  H04B5/0031 ,  H04B5/0037 ,  H04B7/2606

摘要： A radio transmission system includes: a first electronic device; and a second electronic device having a mounting structure mounted with the first electronic device, wherein a millimeter wave signal transmission line capable of transmitting information in a millimeter wave band is formed between the first electronic device and the second electronic device when the first electronic device is mounted in the mounting structure of the second electronic device, and between the first electronic device and the second electronic device, a transmission object signal is converted into a millimeter wave signal and then the millimeter wave signal is transmitted via the millimeter wave signal transmission line.

摘要翻译： 无线电传输系统包括：第一电子设备; 以及具有安装有第一电子设备的安装结构的第二电子设备，其中当第一电子设备是第一电子设备是第一电子设备时，在第一电子设备和第二电子设备之间形成能够发送毫米波段中的信息的毫米波信号传输线 安装在第二电子设备的安装结构中，并且在第一电子设备和第二电子设备之间，将传输对象信号转换为毫米波信号，然后经由毫米波信号传输线传输毫米波信号。

公开(公告)号：US20150002685A1

公开(公告)日：2015-01-01

申请号：US14487680

申请日：2014-09-16

申请人： Sony Corporation

发明人： Norihito Mihota ,  Hirofumi Kawamura ,  Youtarou Sanada ,  Ryuichi Yasuhara ,  Katsuhiko Ueno

IPC分类号： H04N5/232 ,  H04N5/335

CPC分类号： H04N5/23264 ,  G03B17/00 ,  H01Q9/285 ,  H02J17/00 ,  H02J50/12 ,  H02J50/70 ,  H04N5/23248 ,  H04N5/23258 ,  H04N5/2328 ,  H04N5/335

摘要： An imaging device including: a first substrate having a first communication device; a second substrate having a solid-state imaging device and second communication device to exchange signals with the first substrate; a shake correction section adapted to detect the shake of an enclosure and correct the shake based on the detection result by moving the first substrate in the plane vertical to the optical path; and a millimeter wave signal transmission line that permits transmission of information in the millimeter wave band between the first and second communication devices, wherein a signal to be transmitted between the first and second communication devices is converted into a millimeter wave signal first before being transmitted via the millimeter wave signal transmission line.

摘要翻译： 一种成像装置，包括：具有第一通信装置的第一基板; 具有固态成像装置的第二基板和与第一基板交换信号的第二通信装置; 抖动校正部，其适于通过在与所述光路垂直的平面中移动所述第一基板，基于所述检测结果来检测所述外壳的抖动并修正所述抖动; 以及允许在第一和第二通信设备之间的毫米波段中的信息传输的毫米波信号传输线，其中在第一和第二通信设备之间传输的信号首先被转换为毫米波信号，然后经过 毫米波信号传输线。

公开(公告)号：US20140035388A1

公开(公告)日：2014-02-06

申请号：US14045062

申请日：2013-10-03

申请人： Sony Corporation

发明人： Hirofumi Kawamura ,  Yasuhiro Okada

IPC分类号： H04B10/00

CPC分类号： H01P3/16 ,  G01S7/032 ,  G01S2013/9371 ,  H01P5/02 ,  H01Q9/0407 ,  H01Q9/045 ,  H04B1/3822 ,  H04B10/00 ,  H04B10/501 ,  H04B10/5161 ,  H04B10/556 ,  Y10T29/49016

摘要： A millimeter wave transmission device, the millimeter wave transmission device with (a) a first signal processing board for processing a millimeter wave signal; (b) a second signal processing board signal-coupled to the first signal processing board to receive the millimeter wave signal and perform signal processing with respect to the millimeter wave signal; and (c) a member provided between the first signal processing board and the second signal processing board and having a predetermined relative dielectric constant and a predetermined dielectric dissipation factor. The member constitutes a dielectric transmission path via which the millimeter wave signal is transmitted between the first signal processing board and the signal processing board.

摘要翻译： 一种毫米波传输装置，所述毫米波传输装置具有（a）用于处理毫米波信号的第一信号处理板; （b）信号耦合到第一信号处理板以接收毫米波信号并相对于毫米波信号执行信号处理的第二信号处理板; 和（c）设置在第一信号处理板和第二信号处理板之间并且具有预定的相对介电常数和预定的介电损耗系数的元件。 该构件构成了在第一信号处理板和信号处理板之间传输毫米波信号的电介质传输路径。

公开(公告)号：US20160211566A1

公开(公告)日：2016-07-21

申请号：US15083986

申请日：2016-03-29

申请人： Sony Corporation

发明人： Hidekazu KIKUCHI ,  Takayuki Mogi ,  Yoshiyuki Akiyama ,  Hirofumi Kawamura

IPC分类号： H01P5/02 ,  H01P3/12

CPC分类号： H01P5/02 ,  H01P1/208 ,  H01P3/12 ,  H01P3/121 ,  H01P3/165 ,  H01P5/024 ,  H01P5/082 ,  H01P5/087 ,  H01P5/1022 ,  H01P5/107 ,  H01P5/18 ,  H01P5/182 ,  H01P5/188 ,  H01R13/6461 ,  H01R13/665 ,  H01R24/28 ,  H01R24/76 ,  H01R2103/00 ,  H04B3/56 ,  H04B7/24 ,  H05K1/0225 ,  H05K1/0239 ,  H05K2201/093 ,  H05K2201/09672 ,  H05K2201/0969 ,  H05K2201/09754

摘要： A signal transmission system including: a first connector apparatus, and a second connector apparatus that is coupled with the first connector apparatus. The first connector apparatus and the second connector apparatus are coupled together to form an electromagnetic field coupling unit, and a transmission object signal is converted into a radio signal, which is then transmitted through the electromagnetic field coupling unit, between the first connector apparatus and the second connector apparatus.

公开(公告)号：US20150137336A1

公开(公告)日：2015-05-21

申请号：US14609658

申请日：2015-01-30

申请人： Sony Corporation

发明人： Hirofumi Kawamura ,  Yasuhiro Okada

IPC分类号： H01Q21/00 ,  H01L23/66 ,  H01Q9/04

CPC分类号： H01Q21/00 ,  H01L23/48 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01042 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1903 ,  H01L2924/19104 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H01P3/121 ,  H01P3/122 ,  H01Q9/0407 ,  H01Q23/00 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A millimeter-wave dielectric transmission device. The millimeter-wave dielectric transmission device includes a semiconductor chip provided on one interposer substrate and capable of millimeter-wave dielectric transmission, an antenna structure connected to the semiconductor chip, two semiconductor packages including a molded resin configured to cover the semiconductor chip and the antenna structure, and a dielectric transmission path provided between the two semiconductor packages to transmit a millimeter wave signal. The semiconductor packages are mounted such that the antenna structures thereof are arranged with the dielectric transmission path interposed therebetween.

摘要翻译： 毫米波电介质传输装置。 毫米波介质传输装置包括设置在一个插入器基板上并能够进行毫米波电介质传输的半导体芯片，连接到半导体芯片的天线结构，包括被配置为覆盖半导体芯片和天线的模制树脂的两个半导体封装 结构，以及设置在两个半导体封装之间以传输毫米波信号的电介质传输路径。 安装半导体封装，使得其天线结构被布置成介于其间的电介质传输路径。

公开(公告)号：US20150002360A1

公开(公告)日：2015-01-01

申请号：US14487711

申请日：2014-09-16

申请人： Sony Corporation

发明人： Hirofumi Kawamura

IPC分类号： H01Q21/00

CPC分类号： H01Q21/0075 ,  H01L23/66 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/19032 ,  H01L2924/19039 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01P1/047 ,  H01P5/08 ,  H05K1/0219 ,  H05K1/0243 ,  H05K1/025 ,  H05K2201/09727 ,  H05K2201/10166 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Disclosed herein is a semiconductor device including: a semiconductor circuit element configured to process an electrical signal having a predetermined frequency; and a transmission line configured to be connected to the semiconductor circuit element via a wire and transmit the electrical signal. An impedance matching pattern having a symmetric shape with respect to a direction of the transmission line is provided in the transmission line.

摘要翻译： 本文公开了一种半导体器件，包括：半导体电路元件，被配置为处理具有预定频率的电信号; 以及传输线，其被配置为经由导线连接到所述半导体电路元件并传输所述电信号。 在传输线中设置有相对于传输线方向具有对称形状的阻抗匹配图案。

公开(公告)号：US20140015988A1

公开(公告)日：2014-01-16

申请号：US14025359

申请日：2013-09-12

申请人： Sony Corporation

发明人： Norihito Mihota ,  Hirofumi Kawamura ,  Youtarou Sanada ,  Ryuichi Yasuhara ,  Katsuhiko Ueno

IPC分类号： H04N5/232

CPC分类号： H04N5/23264 ,  G03B17/00 ,  H01Q9/285 ,  H02J17/00 ,  H02J50/12 ,  H02J50/70 ,  H04N5/23248 ,  H04N5/23258 ,  H04N5/2328 ,  H04N5/335

摘要： An imaging device including: a first substrate having a first communication device; a second substrate having a solid-state imaging device and second communication device to exchange signals with the first substrate; a shake correction section adapted to detect the shake of an enclosure and correct the shake based on the detection result by moving the first substrate in the plane vertical to the optical path; and a millimeter wave signal transmission line that permits transmission of information in the millimeter wave band between the first and second communication devices, wherein a signal to be transmitted between the first and second communication devices is converted into a millimeter wave signal first before being transmitted via the millimeter wave signal transmission line.

摘要翻译： 一种成像装置，包括：具有第一通信装置的第一基板; 具有固态成像装置的第二基板和与第一基板交换信号的第二通信装置; 抖动校正部，其适于通过在与所述光路垂直的平面中移动所述第一基板，基于所述检测结果来检测所述外壳的抖动并修正所述抖动; 以及允许在第一和第二通信设备之间的毫米波段中的信息传输的毫米波信号传输线，其中在第一和第二通信设备之间传输的信号首先被转换为毫米波信号，然后经过 毫米波信号传输线。

公开(公告)号：US10193598B2

公开(公告)日：2019-01-29

申请号：US15560718

申请日：2016-04-12

申请人： Sony Corporation

发明人： Ken Matsui ,  Masayoshi Abe ,  Osamu Kozakai ,  Hirofumi Kawamura ,  Hiroaki Fujita ,  Takashi Miyamoto

IPC分类号： H04B5/02 ,  G06K19/07 ,  G06K19/073 ,  G06K19/077 ,  H04B7/08 ,  H02J7/02 ,  H02J50/10

摘要： A communication apparatus according to the disclosure includes one or a plurality of sensors, a communicator that performs proximity wireless communication, and a connection section that couples one of a plurality of antennae to the communicator, on a basis of a detection result of the one or the plurality of sensors.

公开(公告)号：US09705202B2

公开(公告)日：2017-07-11

申请号：US14609658

申请日：2015-01-30

申请人： Sony Corporation

发明人： Hirofumi Kawamura ,  Yasuhiro Okada

IPC分类号： H04B1/38 ,  H01Q21/00 ,  H01L23/48 ,  H01L23/66 ,  H01L25/065 ,  H01L25/10 ,  H01P3/12 ,  H01Q9/04 ,  H01Q23/00 ,  H01L23/00

CPC分类号： H01Q21/00 ,  H01L23/48 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01042 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1903 ,  H01L2924/19104 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H01P3/121 ,  H01P3/122 ,  H01Q9/0407 ,  H01Q23/00 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A millimeter-wave dielectric transmission device. The millimeter-wave dielectric transmission device includes a semiconductor chip provided on one interposer substrate and capable of millimeter-wave dielectric transmission, an antenna structure connected to the semiconductor chip, two semiconductor packages including a molded resin configured to cover the semiconductor chip and the antenna structure, and a dielectric transmission path provided between the two semiconductor packages to transmit a millimeter wave signal. The semiconductor packages are mounted such that the antenna structures thereof are arranged with the dielectric transmission path interposed therebetween.