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31 条记录 (耗时 0.024 秒)

    Thermally curable solder resist composition
    3.
    发明授权
    Thermally curable solder resist composition 有权
    耐热可固化阻焊组合物

    公开(公告)号：US08420745B2

    公开(公告)日：2013-04-16

    申请号：US13216653

    申请日：2011-08-24

    申请人： Jhy-Long Jeng ,  Jeng-Yu Tsai ,  Shur-Fen Liu ,  Jinn-Shing King

    发明人： Jhy-Long Jeng ,  Jeng-Yu Tsai ,  Shur-Fen Liu ,  Jinn-Shing King

    IPC分类号： C08G59/14 ,  C08G59/40 ,  C08G59/22 ,  C08L63/00 ,  H05K3/28

    CPC分类号： C08G59/066 ,  C08G59/22 ,  H05K1/0393 ,  H05K3/285 ,  H05K2201/0145

    摘要： A thermally curable solder resist composition for a flexible printed circuit board is provided. The solder resist composition includes (a) 50-100 parts by weight of an epoxy resin, wherein the epoxy resin includes at least an aliphatic polyester modified epoxy resin having formula (I) or (II), in which, each of R1 and R2, independently, is a C6-38 saturated or an unsaturated carbon chain, R3 is ether, phenyl, a C6-38 heterocyclic or C6-38 saturated carbon chain, n is an integer of 1-10 and the aliphatic polyester modified epoxy resin had a molecular weight of 1000-5000; (b) 1-10 parts by weight of a curing agent; and (c) 1-10 parts by weight of a catalyst.

    摘要翻译： 提供了一种用于柔性印刷电路板的热固化阻焊组合物。 阻焊剂组合物包含（a）50-100重量份的环氧树脂，其中环氧树脂至少包含具有式（I）或（II）的脂族聚酯改性环氧树脂，其中R1和R2各自 独立地是C6-38饱和或不饱和碳链，R3是醚，苯基，C6-38杂环或C6-38饱和碳链，n是1-10的整数，脂肪族聚酯改性环氧树脂具有 分子量1000-5000; （b）1-10重量份的固化剂; 和（c）1-10重量份的催化剂。

    Coating composition of positive photosensitive polyimide
    6.
    发明申请
    Coating composition of positive photosensitive polyimide 审中-公开
    正光敏聚酰亚胺的涂料组合物

    公开(公告)号：US20050282958A1

    公开(公告)日：2005-12-22

    申请号：US10868821

    申请日：2004-06-17

    申请人： Jyh-Long Jeng ,  Jinn-Shing King ,  Charng-Shing Lu

    发明人： Jyh-Long Jeng ,  Jinn-Shing King ,  Charng-Shing Lu

    IPC分类号： C08K3/00 ,  C08K5/42

    CPC分类号： C08K5/42 ,  C08L79/08

    摘要： A coating composition of positive photosensitive polyimide is disclosed, which includes an organic solvent and the following components dissolved in the organic solvent: (a) a polyimide having a phenolic hydroxyl group or carboxyl group at the end of a principal chain of the polymer; (b) a compound having a phenolic hydroxyl group; and (c) a quinonediazide sulfonate as a photosensitive agent. The amount of the components (b) and (c) are 1-50 parts by weight per 100 parts by weight the component (a) in the coating composition. A film of the coating composition can be developed with an alkaline aqueous solution, which has a high photosensitivity, excellent resolution, low post-cure temperature, high film residual rate in thickness, and a pattern having a tapered-angle at the cross section. The coating solution can be used for forming an insulating layer in displays or in other suitable applications.

    摘要翻译： 公开了一种正性感光性聚酰亚胺的涂料组合物，其包含有机溶剂和溶解在有机溶剂中的以下成分：（a）在聚合物主链末端具有酚羟基或羧基的聚酰亚胺; （b）具有酚羟基的化合物; 和（c）醌二叠氮化物磺酸盐作为感光剂。 组分（b）和（c）的量相对于涂料组合物中的组分（a）每100重量份为1-50重量份。 涂料组合物的膜可以用碱性水溶液显影，其具有高的光敏性，优异的分辨率，低固化温度，高的膜厚残留率和在截面上具有锥角的图案。 涂布溶液可用于在显示器中或在其它合适的应用中形成绝缘层。

    Thermoplastic polyimide composition
    7.
    发明授权
    Thermoplastic polyimide composition 有权
    热塑性聚酰亚胺组合物

    公开(公告)号：US07459518B2

    公开(公告)日：2008-12-02

    申请号：US11543123

    申请日：2006-10-05

    申请人： Shu-Chu Shih ,  Charng-Shing Lu ,  Jinn-Shing King

    发明人： Shu-Chu Shih ,  Charng-Shing Lu ,  Jinn-Shing King

    IPC分类号： C08G73/10 ,  C08G69/16 ,  C08K3/26 ,  C08K3/34 ,  C08K3/36

    CPC分类号： C08G73/106 ,  C08L79/08 ,  H05K3/386 ,  H05K3/389 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0209

    摘要： A thermoplastic polyimide composition, comprising a silane-modified polyimide (A); and a polar solvent (B), wherein the silane-modified polyimide (A) is obtained by reacting a polyimide (a) and an epoxy-containing silane (b). The polyimide (a) contains repeating units represented by the general formulae I and II, wherein the molar fraction of the repeating unit of formula II is at least 10%, X represents a quadrivalent aromatic group, Ar1 represents a bivalent aromatic group, and Ar2 represents a bivalent aromatic group containing an OH or COOH group.

    摘要翻译： 一种热塑性聚酰亚胺组合物，其包含硅烷改性的聚酰亚胺（A）; 和极性溶剂（B），其中通过使聚酰亚胺（a）和含环氧基的硅烷（b）反应得到硅烷改性的聚酰亚胺（A）。 聚酰亚胺（a）含有由通式I和II表示的重复单元，其中式II的重复单元的摩尔分数为至少10％，X表示四价芳基，Ar 1表示二价芳基，Ar 2 表示含有OH或COOH基团的二价芳基。

    Structure of an interleaving striped capacitor substrate
    9.
    发明授权
    Structure of an interleaving striped capacitor substrate 失效
    交错条纹电容器基板的结构

    公开(公告)号：US07102876B2

    公开(公告)日：2006-09-05

    申请号：US11039924

    申请日：2005-01-24

    申请人： Min-Lin Lee ,  Chin-Sun Shyu ,  Shur-Fen Liu ,  Jing-Pin Pan ,  Jinn-Shing King

    发明人： Min-Lin Lee ,  Chin-Sun Shyu ,  Shur-Fen Liu ,  Jing-Pin Pan ,  Jinn-Shing King

    IPC分类号： H01G4/20

    CPC分类号： H01G4/35 ,  H01G4/20 ,  H05K1/162 ,  H05K2201/0187 ,  H05K2201/0195 ,  H05K2201/0355

    摘要： An interleaving striped capacitor substrate structure for pressing-type print circuit boards is disclosed. To meet the high-frequency, high-speed, and high-density requirements in modern electronic systems, the interleaving striped capacitor substrate structure uses several dielectric materials of different dielectric coefficients to make a dielectric layer. One dielectric layer can be stacked on another to form a multi-layered capacitor substrate so that a single capacitor substrate can provide the highest capacitance required for the decoupling capacitor to suppress high-frequency noise signals, and the lower dielectric coefficient substrate required for high-speed signal transmission. This simultaneously achieves the effects of reducing high-frequency transmission time and suppressing high-frequency noise.

    摘要翻译： 公开了一种用于按压式印刷电路板的交错条纹电容器基底结构。 为了满足现代电子系统的高频，高速和高密度要求，交错条纹电容器基板结构使用不同介电系数的几种介电材料制成介电层。 一个电介质层可以堆叠在另一个上以形成多层电容器基板，使得单个电容器基板可以提供去耦电容器所需的最高电容以抑制高频噪声信号，并且高电平基板所需的低介电系数基板， 速度信号传输。 这同时实现了降低高频传输时间并抑制高频噪声的效果。