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公开(公告)号:US6022823A
公开(公告)日:2000-02-08
申请号:US741543
申请日:1996-10-31
CPC分类号: B01J23/52 , C07C67/055
摘要: An improved process for producing high activity and high selectivity supported palladium-gold catalysts is provided. The process involves calcining the support impregnated with a palladium salt and gold salt in a non-reducing atmosphere and at a temperature ranging from 100.degree. C. to 600.degree. C. prior to reducing the metals. Catalysts of the invention are useful for the production of vinyl acetate in the vapor phase by reaction of ethylene, acetic acid and oxygen.
摘要翻译: 提供了一种用于生产高活性和高选择性的钯 - 金催化剂的改进方法。 该方法包括在还原金属之前,在非还原性气氛中和在100℃至600℃的温度范围内煅烧浸有钯盐和金盐的载体。 本发明的催化剂可用于通过乙烯,乙酸和氧的反应在气相中生产乙酸乙烯酯。
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公开(公告)号:US06524645B1
公开(公告)日:2003-02-25
申请号:US08324842
申请日:1994-10-18
申请人: Michael D. Evans , Tae Yong Kim , Henry Hon Law , Te-Sung Wu
发明人: Michael D. Evans , Tae Yong Kim , Henry Hon Law , Te-Sung Wu
IPC分类号: B05D512
CPC分类号: C23C18/1851 , C23C18/1608 , C23C18/1651 , C23C18/1692 , C23C18/1865 , C23C18/1889 , C23C18/32 , C23C18/38 , C23C18/50 , H05K1/0306 , H05K1/16 , H05K1/167 , H05K3/184 , H05K3/24 , H05K3/38 , H05K3/381 , H05K2201/0347 , H05K2203/0565 , H05K2203/1105
摘要: A process for the metalization of substrates is disclosed. The metal either forms a coating over the entire substrate, or it is patternwise deposited on the substrate surface. Metal is patternwise formed on the substrate either by forming a pattern of resist material on the substrate and depositing the material in the interstices defined by the pattern or by forming a patterned resist layer over a metal layer and transferring the pattern into the substrate using conventional techniques. The patterned resist layer is formed on the substrate using conventional techniques. The substrate is treated with reagents that promote the electroless plating of metal on the substrate surface. If the resist material has been previously formed on the substrate surface, the substrate surface is then dried. The remaining resist is then removed from the substrate surface. The substrate surface is then exposed to an electroless plating bath to form nickel onto those portions of the substrate surface that were treated with the sensitizing and activating solutions. The substrate is then heated to at least 180° C. Additional layers of metal are formed on the substrate. After the additional layers are so formed, the substrate is again heated to a temperature of at least about 180° C. after each layer is so formed.
摘要翻译: 公开了一种用于基板金属化的方法。 金属在整个基板上形成涂层,或者在图案上沉积在基板表面上。 通过在衬底上形成抗蚀剂材料图案并将材料沉积在由图案限定的间隙中或通过在金属层上形成图案化的抗蚀剂层并且使用常规技术将图案转移到衬底中来将金属图案化地形成在衬底上 。 使用常规技术在衬底上形成图案化的抗蚀剂层。 用促进金属在基材表面上的化学镀的试剂处理基材。 如果抗蚀剂材料已经预先形成在基板表面上,则基板表面然后被干燥。 然后从基材表面除去剩余的抗蚀剂。 然后将基材表面暴露于无电解镀浴,以在用敏化和活化溶液处理的基材表面的那些部分上形成镍。 然后将衬底加热至至少180℃。在衬底上形成额外的金属层。 在附加层如此形成之后,在形成每个层之后,将衬底再次加热至至少约180℃的温度。
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公开(公告)号:US06549409B1
公开(公告)日:2003-04-15
申请号:US09643159
申请日:2000-08-21
IPC分类号: H05K720
CPC分类号: H05K5/064 , H01L2224/05553 , H01L2224/48091 , H05K1/0203 , H05K3/284 , H05K7/209 , H05K2201/1056 , H05K2201/10734 , H01L2924/00014
摘要: A power converter assembly includes a heat sinking plate, a circuit board structure having a side that faces and is spaced by a gap from a surface of the heat sinking plate that is nearer to said side, a relatively thin, high heat density, dissipative semiconductor component mounted on said side, an encapsulating material filling the gap, and relatively taller, lower heat density, components mounted on the other side of the circuit board, the gap being characterized by an average thermal-resistance of less than 1° C.−in2/Watt.
摘要翻译: 电力转换器组件包括散热板,电路板结构,其侧面面向并与散热板的更靠近所述侧的表面间隔开一个相对薄的高热密度耗散半导体 安装在所述侧面的部件,填充间隙的封装材料以及安装在电路板的另一侧上的部件相对较高,较低的热密度,该间隙的特征在于平均热阻小于1℃。 in2 /瓦特。
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公开(公告)号:US06316737B1
公开(公告)日:2001-11-13
申请号:US09393952
申请日:1999-09-09
IPC分类号: H05K116
CPC分类号: H05K1/111 , H01L2224/48091 , H01L2924/01079 , H05K1/0306 , H05K1/182 , H05K3/3436 , H05K3/3452 , H05K2201/0179 , H05K2201/09572 , H05K2201/09745 , H05K2201/10477 , H05K2201/10666 , H05K2203/0455 , Y02P70/611 , Y02P70/613 , H01L2924/00014
摘要: In general, in one aspect, the invention features a connection between a through-hole in a circuit board and a contact region on a component. The contact region has a surface bearing a depression. A continuous solder column has one end of that forms a solder joint with an inner wall of the through-hole and the other end of that forms a solder joint with the contact region.
摘要翻译: 通常,一方面,本发明的特征在于电路板中的通孔与部件上的接触区域之间的连接。 接触区域具有带凹陷的表面。 连续的焊料柱的一端与通孔的内壁形成焊接点,另一端与接触区域形成焊接点。
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公开(公告)号:US5509508A
公开(公告)日:1996-04-23
申请号:US238652
申请日:1994-05-05
申请人: Michael D. Evans
发明人: Michael D. Evans
IPC分类号: F16D65/00 , F16D65/092 , F16D65/097 , F16D65/40
CPC分类号: F16D65/0971 , F16D65/0006
摘要: A device (10) is provided for a disc brake pad (11) having a backing plate (20) and actuated by a hydraulic piston (34). The retainer (10) includes tab members (14) for frictionally engaging the backing plate (20). Clip arms (16) are also provided for engaging the piston (34), and a shim (12) is provided to insulate the piston (34) from the backing plate (20). The tab members (14), clip arms (16) and shim (12) are integrated into a one-piece unit.
摘要翻译: 设置有用于具有背板(20)并由液压活塞(34)致动的盘式制动衬块(11)的装置(10)。 保持器(10)包括用于与背板(20)摩擦接合的翼片构件(14)。 夹臂(16)还设置用于接合活塞(34),并且提供垫片(12)以使活塞(34)与背板(20)绝缘。 突片构件(14),夹臂(16)和垫片(12)被集成成一体式单元。
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公开(公告)号:US5189808A
公开(公告)日:1993-03-02
申请号:US709927
申请日:1991-06-03
申请人: Michael D. Evans , Curtis L. Gnagy , William F. Herold , Christopher W. Lagerberg , Bruce W. Nelson
发明人: Michael D. Evans , Curtis L. Gnagy , William F. Herold , Christopher W. Lagerberg , Bruce W. Nelson
摘要: A gauge for measuring the depth of a hole countersink in a workpiece for a fastener, or for measuring the protrusion height of a fastener head above the surface of the workpiece, includes a tapered cylindrical case for holding a transducer such as an LVDT, and a probe assembly removably mounted on the lower end of the case. The probe assembly includes a foot having an annular contact ring at its lower end for contacting the workpiece around the hole or around the fastener head to establish the reference position from which the measurement is to be taken. A probe is mounted in a well in the foot for axial sliding movement therein and is captured within the food by a connector which is screwed onto the upper end of the foot. The connector screws into the lower end of the case and a stud of the LVDT extends through a bore in the end of the case and the connector to contact the top end of the probe on measure the axial position of the probe while it is sensing the countersink depth or the fastener head protrusion. A cable connects the LVDT to a digital indicator to provide a readout of the measurement taken.
摘要翻译: 用于测量用于紧固件的工件中的孔埋头孔的深度或用于测量紧固件头部在工件表面上的突出高度的测量器包括用于保持诸如LVDT的换能器的锥形圆柱形壳体,以及 探头组件可移除地安装在壳体的下端。 探针组件包括一个脚,其下端具有环形接触环,用于使工件围绕孔或围绕紧固件头部接触,以建立将要进行测量的参考位置。 探针安装在足部中的井中,用于在其中轴向滑动运动,并且通过螺纹连接到脚的上端的连接器捕获在食物内。 连接器螺钉插入壳体的下端,并且LVDT的螺柱延伸穿过壳体的端部的孔,并且连接器在测量探头的轴向位置时接触探头的顶端,同时它感测到 锪孔深度或紧固件头突起。 电缆将LVDT连接到数字指示器以提供所测量的读数。
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公开(公告)号:US5730258A
公开(公告)日:1998-03-24
申请号:US684571
申请日:1996-07-19
申请人: Michael D. Evans
发明人: Michael D. Evans
IPC分类号: F16D55/2265 , F16D65/14
CPC分类号: F16D55/22655
摘要: A bushing assembly (30) for a caliper disk brake includes a pair of bushings (32) opposingly disposed on a common centerline (34) in a caliper brake bolt bore (56). Each bushing (32) has a cylindrical body section (40) and a flange (50) extending from the body section (40). The body section (40) has a plurality of ribs (52) extending radially inward from the inner surface (54) of the body section (40) and a circumferential groove (60) in the outer surface (62) of the body section (40). The groove (60) is configured to seat a retainer ring (36) that prevents the bushing (32) from being ejected from the bolt bore (56) in which the bushings (32) are installed. The bushing assembly (30) prevents the caliper arm (16) from binding to the caliper bolts (18) when corrosion builds around the caliper bolt (18) by providing a space (72) between the second ends (44) of the bushings (32).
摘要翻译: 用于卡钳式盘式制动器的衬套组件(30)包括一对衬套(32),其相对设置在制动钳制动器螺栓孔(56)中的公共中心线(34)上。 每个衬套(32)具有圆柱体部分(40)和从主体部分(40)延伸的凸缘(50)。 主体部分(40)具有从主体部分(40)的内表面(54)径向向内延伸的多个肋(52)和主体部分的外表面(62)中的周向凹槽(60) 40)。 凹槽(60)构造成安置一个止动环(36),该保持环防止衬套(32)从其中安装衬套(32)的螺栓孔(56)弹出。 当通过在衬套的第二端(44)之间设置空间(72)时,衬套组件(30)防止卡钳臂(16)与卡钳螺栓(18)结合, 32)。
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公开(公告)号:US5683758A
公开(公告)日:1997-11-04
申请号:US573923
申请日:1995-12-18
CPC分类号: H01L21/4807 , H01L21/486 , H05K3/0029 , H05K1/0306 , H05K2203/1105 , H05K3/0055 , H05K3/4076 , Y10T29/49163 , Y10T29/49165
摘要: A method of forming a via hole in a substrate includes forming an opening in a substrate thereby forming a slag and then heating the substrate to recombine the slag with the substrate.
摘要翻译: 在衬底中形成通孔的方法包括在衬底中形成开口,从而形成炉渣,然后加热衬底以使炉渣与衬底重新组合。
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公开(公告)号:US5671515A
公开(公告)日:1997-09-30
申请号:US630486
申请日:1996-04-10
申请人: Michael D. Evans
发明人: Michael D. Evans
CPC分类号: A44B11/263 , A44B11/006 , A63B55/408 , Y10T24/44564 , Y10T24/45529
摘要: A clasp (10) for connecting two items includes two interconnecting members (11, 12). One member (11) utilizes a rivet (14) to engage one of the items, for example, a golf towel (23). That member (11) also has a receiver (24) formed therein which has a slot (25). The other member (12) has a tab (28) with a flexible button (30) extending upwardly therefrom. The tab (28) is received in the slot (25) until the button (30) snaps up through an aperture (21) in the cover (18) of the receiver (24). The members (11, 12) are thus attached to each other but the attachment can be disengaged merely by depressing the button (30) and sliding the tab (28) out of the slot (25). The other end of the member (12) has a foldable flap (26) which can be formed into a loop (40) to engage another item, for example, a portion (39) of a golf bag.
摘要翻译: 用于连接两个物品的扣环(10)包括两个互连构件(11,12)。 一个构件(11)利用铆钉(14)接合物品之一,例如高尔夫球巾(23)。 该构件(11)还具有形成在其中的具有槽(25)的接收器(24)。 另一个构件(12)具有带有从其向上延伸的柔性按钮(30)的突片(28)。 突片(28)被容纳在槽(25)中,直到按钮(30)通过接收器(24)的盖(18)中的孔(21)向上夹持。 构件(11,12)因此彼此附接,但是仅通过按压按钮(30)并将突片(28)滑出槽(25)就可以使附件脱离。 构件(12)的另一端具有可折叠翼片(26),该折叠翼片可以形成为环(40)以接合另一物品,例如高尔夫球袋的一部分(39)。
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公开(公告)号:US5449955A
公开(公告)日:1995-09-12
申请号:US221731
申请日:1994-04-01
IPC分类号: H01R12/32 , H01L21/60 , H01L23/498 , H01L25/16 , H01R12/04 , H05K1/09 , H05K1/14 , H05K3/24 , H05K3/38 , H01L23/48 , H01L29/46 , H01L29/54 , H01L29/62
CPC分类号: H05K3/3452 , H01L23/49866 , H01L25/16 , H05K3/244 , H05K3/388 , H01L2924/0002 , H05K2203/0315
摘要: A multilayer composite interconnection for use in circuits including thin film elements and electrical interconnections includes a copper barrier layer interposed between a nickel layer and a gold layer of the interconnection. The copper layer is in a thickness sufficient to bar or at least to restrict diffusion of nickel through the gold layer under processing and operating conditions. The interconnection multilayer composite interconnection includes in an ascending order, titanium, palladium or palladium-titanium alloy, copper, nickel, copper barrier and gold layers.
摘要翻译: 用于包括薄膜元件和电互连的电路的多层复合互连包括介于镍层和互连金层之间的铜阻挡层。 铜层的厚度足以阻止或至少在加工和操作条件下限制镍通过金层的扩散。 互连多层复合互连以升序方式包括钛,钯或钯 - 钛合金,铜,镍,铜屏障和金层。
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