中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

105 records (took 0.02 seconds)

    H2-based plasma treatment to eliminate within-batch and batch-to-batch etch drift
    3.
    发明授权
    H2-based plasma treatment to eliminate within-batch and batch-to-batch etch drift 有权
    基于H2的等离子体处理，以消除批次间和批次间蚀刻漂移

    公开(公告)号：US07727906B1

    公开(公告)日：2010-06-01

    申请号：US11493679

    申请日：2006-07-26

    Applicant: Sunil Shanker ,  Chi-I Lang ,  Minh Anh Nguyen ,  Judy H. Huang

    Inventor： Sunil Shanker ,  Chi-I Lang ,  Minh Anh Nguyen ,  Judy H. Huang

    IPC: H01L21/31

    CPC classification number: C23C16/045 ,  C23C16/4404 ,  C23C16/4405 ,  H01J37/32165 ,  H01L21/31604

    Abstract: This invention relates to electronic device fabrication for making devices such as semiconductor wafers and resolves the detrimental fluorine loading effect on deposition in the reaction chamber of a HDP CVD apparatus used for forming dielectric layers in high aspect ratio, narrow width recessed features with a repeating dep/etch/dep process. The detrimental fluorine loading effect in the chamber on deposition uniformity is reduced and wafers are provided having less deposition thickness variations by employing the method using a passivation treatment and precoating of the chamber before substrates are processed. In a preferred process, after each wafer of a batch is finished, the passivation steps are repeated. In a further preferred process, after all the wafers of a batch are finished, the passivation and precoat procedure is repeated. A preferred passivation gas is a mixture of hydrogen and oxygen.

    Abstract translation: 本发明涉及用于制造诸如半导体晶片的器件的电子器件制造，并且解决了用于形成具有高纵横比，窄宽度凹陷特征的电介质层的HDP CVD设备的反应室中沉积的有害氟负载效应，具有重复的dep / etch / dep进程。 通过采用钝化处理的方法和在处理基板之前对涂层进行涂布，在沉积均匀性方面降低了室中对有害的氟负载效应并提供具有较小沉积厚度变化的晶片。 在优选的方法中，在批次的每个晶片完成之后，重复钝化步骤。 在另一优选方法中，在批料的所有晶片完成之后，重复钝化和预涂步骤。 优选的钝化气体是氢和氧的混合物。

    CVD flowable gap fill
    5.
    发明授权
    CVD flowable gap fill 有权
    CVD可流动缝隙填充

    公开(公告)号：US07915139B1

    公开(公告)日：2011-03-29

    申请号：US12508461

    申请日：2009-07-23

    Applicant: Chi-I Lang ,  Judy H. Huang ,  Michael Barnes ,  Sunil Shanker

    Inventor： Chi-I Lang ,  Judy H. Huang ,  Michael Barnes ,  Sunil Shanker

    IPC: H01L21/00

    CPC classification number: H01L21/76837 ,  H01L21/02164 ,  H01L21/02216 ,  H01L21/02271 ,  H01L21/0234 ,  H01L21/31612 ,  H01L21/76826

    Abstract: The present invention meets these needs by providing improved methods of filling gaps. In certain embodiments, the methods involve placing a substrate into a reaction chamber and introducing a vapor phase silicon-containing compound and oxidant into the chamber. Reactor conditions are controlled so that the silicon-containing compound and the oxidant are made to react and condense onto the substrate. The chemical reaction causes the formation of a flowable film, in some instances containing Si—OH, Si—H and Si—O bonds. The flowable film fills gaps on the substrates. The flowable film is then converted into a silicon oxide film, for example by plasma or thermal annealing. The methods of this invention may be used to fill high aspect ratio gaps, including gaps having aspect ratios ranging from 3:1 to 10:1.

    Abstract translation: 本发明通过提供填充间隙的改进方法来满足这些需要。 在某些实施方案中，所述方法包括将基材置于反应室中并将气相含硅化合物和氧化剂引入所述​​室中。 控制反应器条件使得含硅化合物和氧化剂反应并冷凝到基底上。 化学反应导致形成可流动的膜，在某些情况下，含有Si-OH，Si-H和Si-O键。 可流动膜填充基板上的间隙。 然后将可流动膜转化成氧化硅膜，例如通过等离子体或热退火。 本发明的方法可用于填充高纵横比间隙，包括具有3:1至10:1的纵横比的间隙。

    Flowable film dielectric gap fill process
    6.
    发明授权
    Flowable film dielectric gap fill process 有权
    可流动薄膜电介质间隙填充工艺

    公开(公告)号：US07524735B1

    公开(公告)日：2009-04-28

    申请号：US11447594

    申请日：2006-06-05

    Applicant: Vishal Gauri ,  Raashina Humayun ,  Chi-I Lang ,  Judy H. Huang ,  Michael Barnes ,  Sunil Shanker

    Inventor： Vishal Gauri ,  Raashina Humayun ,  Chi-I Lang ,  Judy H. Huang ,  Michael Barnes ,  Sunil Shanker

    IPC: H01L21/762

    CPC classification number: H01L21/31 ,  C23C16/045 ,  C23C16/401 ,  C23C16/56 ,  H01L21/02164 ,  H01L21/02271 ,  H01L21/0234 ,  H01L21/3121 ,  H01L21/3122 ,  H01L21/31608 ,  H01L21/76224

    Abstract: Methods of this invention relate to filling gaps on substrates with a solid dielectric material by forming a flowable film in the gap. The flowable film provides consistent, void-free gap fill. The film is then converted to a solid dielectric material. In this manner gaps on the substrate are filled with a solid dielectric material. According to various embodiments, the methods involve reacting a dielectric precursor with an oxidant to form the dielectric material. In certain embodiments, the dielectric precursor condenses and subsequently reacts with the oxidant to form dielectric material. In certain embodiments, vapor phase reactants react to form a condensed flowable film.

    Abstract translation: 本发明的方法涉及通过在间隙中形成可流动的膜来填充具有固体电介质材料的衬底上的间隙。 可流动膜提供一致的，无空隙的间隙填充。 然后将膜转化成固体电介质材料。 以这种方式，用固体电介质材料填充衬底上的间隙。 根据各种实施方案，所述方法包括使电介质前体与氧化剂反应以形成电介质材料。 在某些实施方案中，电介质前体冷凝并随后与氧化剂反应以形成电介质材料。 在某些实施方案中，气相反应物反应形成冷凝的可流动的膜。

    CVD flowable gap fill
    7.
    发明授权
    CVD flowable gap fill 有权

    公开(公告)号：US08580697B1

    公开(公告)日：2013-11-12

    申请号：US13031077

    申请日：2011-02-18

    Applicant: Chi-I Lang ,  Judy H. Huang ,  Michael Barnes ,  Sunil Shanker

    Inventor： Chi-I Lang ,  Judy H. Huang ,  Michael Barnes ,  Sunil Shanker

    IPC: H01L21/02

    CPC classification number: H01L21/76837 ,  H01L21/02164 ,  H01L21/02216 ,  H01L21/02271 ,  H01L21/0234 ,  H01L21/31612 ,  H01L21/76826

    Abstract: The present invention meets these needs by providing improved methods of filling gaps. In certain embodiments, the methods involve placing a substrate into a reaction chamber and introducing a vapor phase silicon-containing compound and oxidant into the chamber. Reactor conditions are controlled so that the silicon-containing compound and the oxidant are made to react and condense onto the substrate. The chemical reaction causes the formation of a flowable film, in some instances containing Si—OH, Si—H and Si—O bonds. The flowable film fills gaps on the substrates. The flowable film is then converted into a silicon oxide film, for example by plasma or thermal annealing. The methods of this invention may be used to fill high aspect ratio gaps, including gaps having aspect ratios ranging from 3:1 to 10:1.

    Vapor based combinatorial processing
    9.
    发明授权
    Vapor based combinatorial processing 有权
    气相组合处理

    公开(公告)号：US08334015B2

    公开(公告)日：2012-12-18

    申请号：US12013759

    申请日：2008-01-14

    Applicant: Tony P. Chiang ,  Sunil Shanker ,  Chi-I Lang

    Inventor： Tony P. Chiang ,  Sunil Shanker ,  Chi-I Lang

    IPC: C23C16/04

    CPC classification number: C23C16/45574 ,  C23C16/45544 ,  C23C16/45548

    Abstract: A combinatorial processing chamber and method are provided. In the method a fluid volume flows over a surface of a substrate with differing portions of the fluid volume having different constituent components to concurrently expose segregated regions of the substrate to a mixture of the constituent components that differ from constituent components to which adjacent regions are exposed. Differently processed segregated regions are generated through the multiple flowings.

    Abstract translation: 提供组合处理室和方法。 在该方法中，流体体积在衬底的表面上流动，具有不同部分的流体体积具有不同构成组分，以同时将衬底的偏析区域暴露于与构成组分的混合物中，所述构成组分与相邻区域暴露于其中的构成组分不同 。 通过多个流动产生不同处理的分离区域。

    VAPOR BASED COMBINATORIAL PROCESSING
    10.
    发明申请
    VAPOR BASED COMBINATORIAL PROCESSING 有权
    基于蒸汽的组合加工

    公开(公告)号：US20120090545A1

    公开(公告)日：2012-04-19

    申请号：US13332813

    申请日：2011-12-21

    Applicant: Tony P. Chiang ,  Sunil Shanker ,  Chi-I Lang

    Inventor： Tony P. Chiang ,  Sunil Shanker ,  Chi-I Lang

    IPC: C23C16/455

    CPC classification number: C23C16/45574 ,  C23C16/45544 ,  C23C16/45548

    Abstract: A combinatorial processing chamber and method are provided. In the method a fluid volume flows over a surface of a substrate with differing portions of the fluid volume having different constituent components to concurrently expose segregated regions of the substrate to a mixture of the constituent components that differ from constituent components to which adjacent regions are exposed. Differently processed segregated regions are generated through the multiple flowings.

    Abstract translation: 提供组合处理室和方法。 在该方法中，流体体积在衬底的表面上流动，具有不同部分的流体体积具有不同构成组分，以同时将衬底的偏析区域暴露于与构成组分的混合物中，所述构成组分与相邻区域暴露于其中的构成组分不同 。 通过多个流动产生不同处理的分离区域。

Patent Agency Ranking