摘要:
A semiconductor device includes a semiconductor structure, a logic circuit, a plurality of first memory cells and through vias. The logic circuit is disposed at a first level over the semiconductor substrate. The first memory cells are disposed at a second level over the semiconductor substrate, wherein the second level is stacked on top and overlapped with the first level. Each of the first memory cells include a latch circuit and conductive elements. The latch circuit is formed of N-type field effect transistors (NFETs) and P-type field effect transistors (PFETs). The conductive elements are extending above the NFETs and the PFETs and electrically coupled to the NFETs and the PFETs. The through vias are extending from the second level to the first level and electrically connecting the conductive elements to the logic circuit by a vertical conduction path.
摘要:
The present disclosure relates to methods for fabricating a field-effect transistor. The method includes performing a pocket implantation to a semiconductor substrate; thereafter forming a polysilicon layer on the semiconductor substrate; and patterning the polysilicon layer to form a polysilicon gate.The field-effect transistor (FET) includes a well of a first type dopant, formed in a semiconductor substrate; a metal gate disposed on the semiconductor substrate and overlying the well; a channel formed in the semiconductor substrate and underlying the metal gate; source and drain regions of a second type dopant opposite from the first type, the source and drain regions being formed in the semiconductor substrate and on opposite sides of the channel; and a pocket doping profile of the first type dopant and being defined in the well to form a continuous and uniform doping region from the source region to the drain region.
摘要:
SRAM cells and SRAM cell arrays are described. In one embodiment, an SRAM cell includes a first inverter and a second inverter cross-coupled with the first inverter to form a first data storage node and a complimentary second data storage node for latching a value. The SRAM cell further includes a first pass-gate transistor and a switch transistor. A first source/drain of the first pass-gate transistor is coupled to the first data storage node, and a second source/drain of the first pass-gate transistor is coupled to a first bit line. The first source/drain of the switch transistor is coupled to the gate of the first pass-gate transistor.
摘要:
SRAM cells and SRAM cell arrays are described. In one embodiment, an SRAM cell includes a first inverter and a second inverter cross-coupled with the first inverter to form a first data storage node and a complimentary second data storage node for latching a value. The SRAM cell further includes a first pass-gate transistor and a switch transistor. A first source/drain of the first pass-gate transistor is coupled to the first data storage node, and a second source/drain of the first pass-gate transistor is coupled to a first bit line. The first source/drain of the switch transistor is coupled to the gate of the first pass-gate transistor.
摘要:
A SRAM device with metal gate transistors is provided. The SRAM device includes a PMOS structure and an NMOS structure over a substrate. Each of the PMOS and the NMOS structure includes a p-type metallic work function layer and an n-type metallic work function layer. The p-type work metallic function layer and the n-type metallic work function layer form a combined work function for the PMOS and the NMOS structures.
摘要:
A method includes setting a current level of a write signal to a first non-zero value for a first period of time. The write signal is provided to a memory element during the first period of time. The current level of the write signal is adjusted from the first non-zero value to a second non-zero value, different from the first non-zero value, for a second period of time. The write signal is provided to the memory element during the second period of time. The current level of the write signal is adjusted from the second non-zero value to a third value, different from the first non-zero value and different from the second non-zero value, for a third period of time. The write signal is provided to the memory element during the third period of time.
摘要:
A memory array and a method for forming the memory array are disclosed. The memory array includes memory elements, selectors and conductive vias. Each selector includes two pairs of fin structures. The conductive vias are electrically coupled to the two pairs of fin structures of the selectors.
摘要:
Costs may be avoided and yields improved by applying scanning probe microscopy to substrates in the midst of an integrated circuit fabrication process sequence. Scanning probe microscopy may be used to provide conductance data. Conductance data may relate to device characteristics that are normally not available until the conclusion of device manufacturing. The substrates may be selectively treated to ameliorate a condition revealed by the data. Some substrates may be selectively discarded based on the data to avoid the expense of further processing. A process maintenance operation may be selectively carried out based on the data.
摘要:
A layout of a memory device is stored on a non-transitory computer-readable medium. The layout includes a plurality of active area regions, a lowermost interconnect layer, a plurality of memory cells, and a word line. The lowermost interconnect layer includes a first conductive layer over the plurality of active area regions, and a second conductive layer over the first conductive layer. The plurality of memory cells includes the plurality of active area regions. The word line is in the second conductive layer, and is coupled to the plurality of memory cells.
摘要:
A circuit comprises a first voltage line, a second voltage line parallel to the first voltage line, and a bit line between the first voltage line and the second voltage line. The bit line is separated from the first voltage line by a minimum distance allowed by a design rule. The bit line is closer to the first voltage line than to the second voltage line. A first capacitance value between the bit line and the first voltage line is different than a second capacitance value between the bit line and the second voltage line.