公开(公告)号：US20170271174A1

公开(公告)日：2017-09-21

申请号：US15614819

申请日：2017-06-06

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： YONG LIN ,  RONGWEI ZHANG ,  BENJAMIN STASSEN COOK ,  ABRAM CASTRO

IPC: H01L21/50 ,  H01L23/495 ,  H01L23/00

CPC classification number: H01L21/50 ,  H01L23/12 ,  H01L23/13 ,  H01L23/14 ,  H01L23/15 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49513 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2021/60277 ,  H01L2224/29116 ,  H01L2224/2919 ,  H01L2224/296 ,  H01L2224/32245 ,  H01L2224/45116 ,  H01L2224/45616 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48816 ,  H01L2224/48996 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/80856 ,  H01L2224/83192 ,  H01L2224/8392 ,  H01L2224/83951 ,  H01L2224/8502 ,  H01L2224/85051 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/3511 ,  H01L2924/35121 ,  H01L2224/45099 ,  H01L2924/0665 ,  H01L2924/00

Abstract: A method includes applying a die attach material to a die pad of an integrated circuit. The die attach material is employed as a bonding material to the die pad. The method includes mounting an integrated circuit die to the die pad of the integrated circuit via the die attach material. The method includes printing an adhesion deposition material on the die attach material appearing at the interface of the integrated circuit die and the die pad of the integrated circuit to mitigate delamination between the integrated circuit die and the die pad.

公开(公告)号：US20170194170A1

公开(公告)日：2017-07-06

申请号：US14985034

申请日：2015-12-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： YONG LIN ,  RONGWEI ZHANG ,  BENJAMIN STASSEN COOK ,  ABRAM CASTRO

IPC: H01L21/50 ,  H01L23/495 ,  H01L23/00

Abstract: A method includes applying a die attach material to a die pad of an integrated circuit. The die attach material is employed as a bonding material to the die pad. The method includes mounting an integrated circuit die to the die pad of the integrated circuit via the die attach material. The method includes printing an adhesion deposition material on the die attach material appearing at the interface of the integrated circuit die and the die pad of the integrated circuit to mitigate delamination between the integrated circuit die and the die pad.

公开(公告)号：US20160093558A1

公开(公告)日：2016-03-31

申请号：US14848975

申请日：2015-09-09

Applicant: Texas Instruments Incorporated

Inventor： BENJAMIN STASSEN COOK ,  JUAN ALEJANDRO HERBSOMMER ,  YONG LIN ,  RONGWEI ZHANG ,  ABRAM CASTRO ,  MATTHEW DAVID ROMIG

IPC: H01L23/495 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H01L21/288

CPC classification number: H01L23/4952 ,  H01L21/2885 ,  H01L21/4821 ,  H01L21/4825 ,  H01L21/4867 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49572 ,  H01L23/49582 ,  H01L23/49586 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49883 ,  H01L24/05 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/0612 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/1511 ,  H01L2924/1711 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/0665

Abstract: A method of lead frame surface modification includes providing at least one pre-fabricated metal lead frame or package substrate (substrate) unit including a base metal having a die pad and a plurality of contact regions surrounding the die pad. An ink including a material that is a solid or a precursor for a solid that forms a solid upon a curing step or a sintering step that removes a liquid carrier is additively deposited including onto at least one of (i) a region of the die pad and (ii) at one region of at least a first of the contact regions (first contact region). The ink is sintered or cured to remove the liquid carrier so that a substantially solid ink residue remains.

Abstract translation: 引线框架表面改性的方法包括提供至少一个预制金属引线框架或封装基板（基板）单元，其包括具有管芯焊盘和围绕管芯焊盘的多个接触区域的母材。 包括在固化步骤上形成固体的固体的材料或去除液体载体的烧结步骤的材料的油墨被加成沉积，其包括至少一个（i）芯片垫的区域 和（ii）在至少第一接触区域（第一接触区域）的一个区域。 油墨被烧结或固化以除去液体载体，使得残留基本上固体的油墨残余物。

公开(公告)号：US20160064630A1

公开(公告)日：2016-03-03

申请号：US14818969

申请日：2015-08-05

Applicant: Texas Instruments Incorporated

Inventor： ABRAM CASTRO

IPC: H01L33/58 ,  H01L33/62 ,  H01L33/54 ,  H01L33/00 ,  H01L33/50

CPC classification number: H01L33/58 ,  H01L33/20 ,  H01L33/486 ,  H01L33/505 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0066

Abstract: A flip chip light emitting diode (LED) package includes an LED die having a first substrate, a p-type region and an n-type region including an active layer in between, a metal contact on the p-type region (anode contact) and a metal contact on the n-type region (cathode contact). A package substrate or lead frame includes a dielectric material that has a first metal through via (first metal post) and second metal through via (second metal post) spaced apart from one another and embedded in the dielectric material. A first metal pad is on a bottom side of the first metal post and a second metal pad is on a bottom side of the second metal post. An interconnect metal paste or metal ink residual (metal residual) is between the anode contact and first metal post and between the cathode contact and the second metal post.

Abstract translation: 倒装芯片发光二极管（LED）封装包括具有第一基板，p型区域和在其间包括有源层的n型区域的LED管芯，在p型区域（阳极接触件）上的金属接触件， 和在n型区域（阴极接触）上的金属接触。 封装衬底或引线框架包括具有第一金属通孔（第一金属柱）和第二金属通孔（第二金属柱）的电介质材料，其彼此间隔开并嵌入电介质材料中。 第一金属垫位于第一金属柱的底侧，第二金属垫位于第二金属柱的底侧。 在阳极接触和第一金属柱之间以及阴极接触件和第二金属柱之间，互连金属浆料或金属油墨残留物（金属残留物）。