公开(公告)号：US20190326247A1

公开(公告)日：2019-10-24

申请号：US15960093

申请日：2018-04-23

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： MATTHEW DAVID ROMIG ,  BENJAMIN STASSEN COOK

IPC: H01L23/00 ,  H01L23/495

Abstract: A system includes a substrate; a bond pad; a wire spanning above the substrate, having a first end bonded to the bond pad and a second end extending from the bond pad to terminate in a second end thereof; and a support structure disposed on the substrate, the support structure comprising at least a side wall and extending from the substrate to terminate in an end portion spaced from the substrate to support the wire.

公开(公告)号：US20210063497A1

公开(公告)日：2021-03-04

申请号：US17003693

申请日：2020-08-26

Applicant: Texas Instruments Incorporated

Inventor： YONG DENG ,  JO BITO ,  BENJAMIN STASSEN COOK

IPC: G01R33/00 ,  H05K9/00 ,  G01R33/07

Abstract: In a described example, a structure includes a substrate having a surface with multiple sides. A sensor is positioned within the substrate and a seed layer is over at least four sides of the surface of the substrate. A magnetic shield layer is over the seed layer for the at least four sides of the surface of the substrate.

公开(公告)号：US20160093558A1

公开(公告)日：2016-03-31

申请号：US14848975

申请日：2015-09-09

Applicant: Texas Instruments Incorporated

Inventor： BENJAMIN STASSEN COOK ,  JUAN ALEJANDRO HERBSOMMER ,  YONG LIN ,  RONGWEI ZHANG ,  ABRAM CASTRO ,  MATTHEW DAVID ROMIG

IPC: H01L23/495 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H01L21/288

CPC classification number: H01L23/4952 ,  H01L21/2885 ,  H01L21/4821 ,  H01L21/4825 ,  H01L21/4867 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49572 ,  H01L23/49582 ,  H01L23/49586 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49883 ,  H01L24/05 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/0612 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/1511 ,  H01L2924/1711 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/0665

Abstract: A method of lead frame surface modification includes providing at least one pre-fabricated metal lead frame or package substrate (substrate) unit including a base metal having a die pad and a plurality of contact regions surrounding the die pad. An ink including a material that is a solid or a precursor for a solid that forms a solid upon a curing step or a sintering step that removes a liquid carrier is additively deposited including onto at least one of (i) a region of the die pad and (ii) at one region of at least a first of the contact regions (first contact region). The ink is sintered or cured to remove the liquid carrier so that a substantially solid ink residue remains.

Abstract translation: 引线框架表面改性的方法包括提供至少一个预制金属引线框架或封装基板（基板）单元，其包括具有管芯焊盘和围绕管芯焊盘的多个接触区域的母材。 包括在固化步骤上形成固体的固体的材料或去除液体载体的烧结步骤的材料的油墨被加成沉积，其包括至少一个（i）芯片垫的区域 和（ii）在至少第一接触区域（第一接触区域）的一个区域。 油墨被烧结或固化以除去液体载体，使得残留基本上固体的油墨残余物。

公开(公告)号：US20170271174A1

公开(公告)日：2017-09-21

申请号：US15614819

申请日：2017-06-06

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： YONG LIN ,  RONGWEI ZHANG ,  BENJAMIN STASSEN COOK ,  ABRAM CASTRO

IPC: H01L21/50 ,  H01L23/495 ,  H01L23/00

CPC classification number: H01L21/50 ,  H01L23/12 ,  H01L23/13 ,  H01L23/14 ,  H01L23/15 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49513 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2021/60277 ,  H01L2224/29116 ,  H01L2224/2919 ,  H01L2224/296 ,  H01L2224/32245 ,  H01L2224/45116 ,  H01L2224/45616 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48816 ,  H01L2224/48996 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/80856 ,  H01L2224/83192 ,  H01L2224/8392 ,  H01L2224/83951 ,  H01L2224/8502 ,  H01L2224/85051 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/3511 ,  H01L2924/35121 ,  H01L2224/45099 ,  H01L2924/0665 ,  H01L2924/00

Abstract: A method includes applying a die attach material to a die pad of an integrated circuit. The die attach material is employed as a bonding material to the die pad. The method includes mounting an integrated circuit die to the die pad of the integrated circuit via the die attach material. The method includes printing an adhesion deposition material on the die attach material appearing at the interface of the integrated circuit die and the die pad of the integrated circuit to mitigate delamination between the integrated circuit die and the die pad.

公开(公告)号：US20160093525A1

公开(公告)日：2016-03-31

申请号：US14848941

申请日：2015-09-09

Applicant: Texas Instruments Incorporated

Inventor： BENJAMIN STASSEN COOK ,  JUAN ALEJANDRO HERBSOMMER ,  MATTHEW DAVID ROMIG ,  STEVEN ALFRED KUMMERL ,  WEI-YAN SHIH

IPC: H01L21/768 ,  H01L23/528

CPC classification number: H01L24/27 ,  H01L21/4867 ,  H01L21/76838 ,  H01L23/528 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L2223/6627 ,  H01L2224/24998 ,  H01L2224/2732 ,  H01L2224/27848 ,  H01L2224/29026 ,  H01L2224/29076 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method forming a packaged semiconductor device includes providing a first semiconductor die (first die) having bond pads thereon mounted face-up on a package substrate or on a die pad of a lead frame (substrate), wherein the substrate includes terminals or contact pads (substrate pads). A first dielectric layer is formed including printing a first dielectric precursor layer including a first ink having a first liquid carrier solvent extending from the substrate pads to the bond pads. A first interconnect precursor layer is printed including a second ink having a second liquid carrier over the first dielectric layer extending from the substrate pads to the bond pads. Sintering or curing the first interconnect precursor layer removes at least the second liquid carrier to form an electrically conductive interconnect including an ink residue which connects respective substrate pads to respective bond pads.

Abstract translation: 一种形成封装半导体器件的方法包括提供一种第一半导体管芯（第一管芯），其上具有接合焊盘，其面朝上安装在封装衬底上或引线框架（衬底）的管芯焊盘上，其中衬底包括端子或接触焊盘 （基板焊盘）。 形成第一电介质层，包括印刷第一电介质前体层，该第一电介质前体层包括具有从衬底焊盘延伸到接合焊盘的第一液体载体溶剂的第一油墨。 印刷第一互连前体层，其包括在从衬底焊盘延伸到接合焊盘的第一介电层上方具有第二液体载体的第二油墨。 烧结或固化第一互连前体层至少去除第二液体载体以形成包括将各个衬底焊盘连接到各个焊盘的墨残余物的导电互连。

公开(公告)号：US20200212879A1

公开(公告)日：2020-07-02

申请号：US16235512

申请日：2018-12-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： BICHOY BAHR ,  BAHER S. HAROUN ,  BENJAMIN STASSEN COOK

IPC: H03H9/17 ,  H03H9/02 ,  G01R23/02

Abstract: A pressure sensor apparatus is disclosed. The pressure sensor apparatus includes a bulk acoustic wave (BAW) die having a die interface side and a pressure contact side, a sensor BAW resonator and a reference BAW resonator disposed on the die interface side of the BAW die, a control circuit die coupled to the die interface side of the BAW die via an attachment layer, and an extended opening on the pressure contact side that extends into a depth of the BAW die and is generally aligned with the sensor BAW resonator, the extended opening being configured to translate an external pressure on the pressure contact side onto the sensor BAW resonator.

公开(公告)号：US20200083147A1

公开(公告)日：2020-03-12

申请号：US16123100

申请日：2018-09-06

Applicant: Texas Instruments Incorporated

Inventor： JO BITO ,  BENJAMIN STASSEN COOK ,  STEVEN KUMMERL

IPC: H01L23/495 ,  H01L23/498

Abstract: A packaged semiconductor device includes an IC die having bump features that are coupled to bond pads flip chip attached to a custom LF. The custom LF includes metal structures including metal leads on at least 2 sides, and printed metal providing a printed LF portion including printed metal traces that connect to and extend inward from at least one of the metal leads over the dielectric support material that are coupled to FC pads configured for receiving the bump features including at least some of the printed metal traces coupled to the bond pads on the IC die. The IC die is flip chip mounted on the printed LF portion so that the bump features are connected to the FC pads.

公开(公告)号：US20240413058A1

公开(公告)日：2024-12-12

申请号：US18810024

申请日：2024-08-20

Applicant: Texas Instruments Incorporated

Inventor： JO BITO ,  BENJAMIN STASSEN COOK ,  STEVEN KUMMERL

IPC: H01L23/495 ,  H01L23/498

Abstract: A packaged semiconductor device includes an IC die having bump features that are coupled to bond pads flip chip attached to a custom LF. The custom LF includes metal structures including metal leads on at least 2 sides, and printed metal providing a printed LF portion including printed metal traces that connect to and extend inward from at least one of the metal leads over the dielectric support material that are coupled to FC pads configured for receiving the bump features including at least some of the printed metal traces coupled to the bond pads on the IC die. The IC die is flip chip mounted on the printed LF portion so that the bump features are connected to the FC pads.

公开(公告)号：US20170194170A1

公开(公告)日：2017-07-06

申请号：US14985034

申请日：2015-12-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： YONG LIN ,  RONGWEI ZHANG ,  BENJAMIN STASSEN COOK ,  ABRAM CASTRO

IPC: H01L21/50 ,  H01L23/495 ,  H01L23/00

Abstract: A method includes applying a die attach material to a die pad of an integrated circuit. The die attach material is employed as a bonding material to the die pad. The method includes mounting an integrated circuit die to the die pad of the integrated circuit via the die attach material. The method includes printing an adhesion deposition material on the die attach material appearing at the interface of the integrated circuit die and the die pad of the integrated circuit to mitigate delamination between the integrated circuit die and the die pad.

公开(公告)号：US20160093548A1

公开(公告)日：2016-03-31

申请号：US14849026

申请日：2015-09-09

Applicant: Texas Instruments Incorporated

Inventor： BENJAMIN STASSEN COOK ,  JUAN ALEJANDRO HERBSOMMER ,  DJANGO TROMBLEY ,  STEVEN ALFRED KUMMERL ,  PAUL EMERSON

IPC: H01L23/31 ,  H01L21/288 ,  H01L23/522 ,  H01L23/00

CPC classification number: H01L23/3121 ,  H01L21/288 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/5227 ,  H01L24/09 ,  H01L2224/08268 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/13055 ,  H01L2924/146 ,  H05K1/092 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/0179 ,  H05K2201/0999 ,  H05K2201/10151

Abstract: A method forming packaged semiconductor devices includes providing a completed semiconductor package having a die with bond pads coupled to package pins. Sensor precursors including an ink and a liquid carrier are additively printed directly on the die or package to provide precursors for electrodes and a sensing material between the sensor electrodes. Sintering or curing removes the liquid carrier such that an ink residue remains to provide the sensor electrodes and sensing material. The sensor electrodes electrically coupled to the pins or bond pads or the die includes a wireless coupling structure coupled to the bond pads and the method includes additively printing an ink then sintering or curing to form a complementary wireless coupling structure on the completed semiconductor package coupled to the sensor electrodes so that sensing signals sensed by the sensor are wirelessly transmitted to the bond pads after being received by the wireless coupling structure.

Abstract translation: 形成封装半导体器件的方法包括提供具有与封装引脚耦合的接合焊盘的芯片的完整半导体封装。 包括油墨和液体载体的传感器前体被直接加印在模具或包装上，以提供用于电极的前体和传感器电极之间的传感材料。 烧结或固化除去液体载体，使得残留墨水以提供传感器电极和传感材料。 电耦合到引脚或接合焊盘或芯片的传感器电极包括耦合到接合焊盘的无线耦合结构，并且该方法包括相加地印刷油墨然后烧结或固化以在完成的半导体封装上形成互补的无线耦合结构，其耦合到 传感器电极使得由传感器感测的感测信号在被无线耦合结构接收之后被无线传输到接合焊盘。