公开(公告)号：US20170362472A1

公开(公告)日：2017-12-21

申请号：US15533182

申请日：2015-12-01

Applicant: TORAY INDUSTRIES, INC.

Inventor： Kazuyuki Matsumura ,  Koichi Fujimaru ,  Daisuke Kanamori

IPC: C09J11/04 ,  C09J171/12 ,  C09J11/06 ,  H01L23/544 ,  H01L23/00 ,  C09J163/00 ,  C09J193/04

CPC classification number: C09J11/04 ,  C09J11/06 ,  C09J163/00 ,  C09J171/12 ,  C09J193/04 ,  C09J201/00 ,  H01L23/544 ,  H01L24/16 ,  H01L24/81 ,  H01L2223/54426 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/16501 ,  H01L2224/8113 ,  H01L2224/81855 ,  H01L2924/3512 ,  C08K3/36 ,  C08L93/04

Abstract: The purpose of the present invention is to provide an adhesive composition which allows an alignment mark to be recognized, ensures sufficient solder wettability of a joining section, and is excellent in suppression of void generation. The adhesive composition includes: a high-molecular compound (A); an epoxy compound (B) having a weight average molecular weight of 100 or more and 3,000 or less; and a flux (C); and inorganic particles (D) which have on the surfaces thereof an alkoxysilane having a phenyl group and which have an average, particle diameter of 30 to 200 nm, the flux (C) containing an acid-modified rosin.

公开(公告)号：US10050005B2

公开(公告)日：2018-08-14

申请号：US15038266

申请日：2014-11-25

Applicant: TORAY INDUSTRIES, INC.

Inventor： Daisuke Kanamori ,  Takuro Oda ,  Toshihisa Nonaka

IPC: C09J163/00 ,  H01L23/00 ,  C08L21/00 ,  H01L21/683 ,  C09D179/08 ,  C08G73/10 ,  C09J179/08 ,  C09J9/02 ,  C09J7/20 ,  C08K3/36 ,  C08L63/00

Abstract: The objective of the present invention is to obtain a semiconductor resin composition having a sufficiently low coefficient of linear expansion of the cured product thereof and a uniform distribution of inorganic particles in the direction of film thickness of a produced semi-cured film thereof. The semiconductor resin composition, which contains (a) an epoxy compound, (b) inorganic particles, (c) a polyimide, and (d) a solvent, is characterized by further containing (e) rubber particles and by the fraction of the (b) inorganic particles in the weight of the total solid fraction resulting from subtracting the weight of the (d) solvent from the total weight of the semiconductor resin composition being 60-92 wt % inclusive.

公开(公告)号：US09617451B2

公开(公告)日：2017-04-11

申请号：US15111265

申请日：2015-01-09

Applicant: TORAY INDUSTRIES, INC.

Inventor： Takuro Oda ,  Daisuke Kanamori ,  Toshihisa Nonaka

IPC: C09J9/02 ,  C09D163/00 ,  C09J7/02 ,  C09J179/08 ,  H01L23/00 ,  H01L21/683 ,  H01L25/065 ,  H01L25/00 ,  C08G73/10 ,  C09J163/00 ,  C08K3/00 ,  H01L23/29 ,  H05K3/32

CPC classification number: C09J9/02 ,  C08G73/106 ,  C08G2170/00 ,  C09D163/00 ,  C09J7/20 ,  C09J163/00 ,  C09J179/08 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  C09J2479/00 ,  C09J2479/08 ,  H01L21/6836 ,  H01L23/293 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/1134 ,  H01L2224/1146 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2731 ,  H01L2224/2732 ,  H01L2224/2741 ,  H01L2224/27416 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81204 ,  H01L2224/81801 ,  H01L2224/81907 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/83948 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2225/06513 ,  H05K3/321 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/05442 ,  H01L2924/00012 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  C08L1/00 ,  H01L2924/07025 ,  H01L2924/05432 ,  H01L2924/05341 ,  H01L2924/05042 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/05032 ,  H01L2924/0498 ,  H01L2924/01026 ,  H01L2924/053 ,  H01L2924/049 ,  H01L2924/0544 ,  H01L2924/01006

Abstract: The present invention provides an adhesive composition having excellent strength in a cracked state, and is an adhesive composition characterized by containing a polyimide (A),a polyfunctional epoxy compound (B), an epoxy curing agent (C), and inorganic particles (D), the ratio of the polyimide (A) in a nonvolatile organic component being 3.0 wt % or more and 30 wt % or less, the ratio of the epoxy curing agent (C) in the nonvolatile organic component being 0.5 wt % or more and 10 wt % or less, and T/M being 400 or more and 8000 or less, where T is the total number of grams of the nonvolatile organic component, and M is the number of moles of epoxy groups in the nonvolatile organic component.

公开(公告)号：US10294395B2

公开(公告)日：2019-05-21

申请号：US15533182

申请日：2015-12-01

Applicant: TORAY INDUSTRIES, INC.

Inventor： Kazuyuki Matsumura ,  Koichi Fujimaru ,  Daisuke Kanamori

IPC: C09J11/04 ,  C09J171/12 ,  C09J11/06 ,  C09J163/00 ,  C09J201/00 ,  C09J193/04 ,  H01L23/544 ,  H01L23/00

Abstract: The purpose of the present invention is to provide an adhesive composition which allows an alignment mark to be recognized, ensures sufficient solder wettability of a joining section, and is excellent in suppression of void generation. The adhesive composition includes: a high-molecular compound (A); an epoxy compound (B) having a weight average molecular weight of 100 or more and 3,000 or less; and a flux (C); and inorganic particles (D) which have on the surfaces thereof an alkoxysilane having a phenyl group and which have an average particle diameter of 30 to 200 nm, the flux (C) containing an acid-modified rosin.