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公开(公告)号：US06663946B2
公开(公告)日：2003-12-16
申请号：US10091114
申请日：2002-02-28
申请人： Takuji Seri , Katsura Hayashi , Tadashi Nagasawa , Kenji Kume , Takahiro Matsunaga , Isao Miyatani
发明人： Takuji Seri , Katsura Hayashi , Tadashi Nagasawa , Kenji Kume , Takahiro Matsunaga , Isao Miyatani
IPC分类号： B32B900
CPC分类号： H05K1/036 , H01L23/49894 , H01L24/17 , H01L2224/16225 , H01L2224/16237 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H05K1/024 , H05K3/20 , H05K3/4069 , H05K3/4614 , H05K3/4632 , H05K2201/0141 , H05K2201/0209 , H05K2201/068 , Y10S428/901 , Y10T428/24917 , Y10T428/24975 , Y10T428/25 , Y10T428/31547 , Y10T428/31696 , Y10T428/31909 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： An object of the invention is to satisfy all of a high-density wiring package, soldering thermal resistance, an insulating property and high-frequency transmission characteristics. The invention is a multi-layer wiring substrate having a lamination of a plurality of dielectric layers which are each provided with a wiring conductor made of a metallic foil on at least one of upper and bottom surfaces of the dielectric layer, the wiring conductors between which the dielectric layer is disposed being electrically connected with each other via a through conductor formed in the dielectric layer; on this occasion, the dielectric layers each individually are composed of a liquid crystal polymer layer and cladding layers made of a polyphenyleneether-type organic substance and formed on upper and bottom surfaces of the liquid crystal polymer layer.
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2.发明申请公开(公告)号：US20110051386A1
公开(公告)日：2011-03-03
申请号：US12745223
申请日：2008-11-28
申请人： Tadashi Nagasawa , Katsura Hayashi
发明人： Tadashi Nagasawa , Katsura Hayashi
CPC分类号： H05K1/115 , H01L21/486 , H01L23/49827 , H01L2224/16225 , H01L2224/16227 , H01L2924/00014 , H05K3/0035 , H05K3/0055 , H05K3/421 , H05K3/4673 , H05K2201/0195 , H05K2201/0209 , H05K2201/09845 , H05K2201/09863 , Y10T29/49165 , H01L2224/0401
摘要： A circuit board (2) includes an insulation layer (7) where a via conductor (10) is embedded. The via conductor (10) includes: a first conductor portion (10a) having an lower portion narrower than an upper portion; and a second conductor portion (10b) which is formed immediately below the first conductor portion (10a), connected to the first conductor portion (10a), and has a maximum width greater than the upper end width of the first conductor portion (10a). The insulation layer (7) has a plurality of indentations (T1a, T1b) on the surface in contact with the via conductor (10). Convex portions (T2a, T2b) of the via conductor are arranged in the indentations (T1a, T1b).
摘要翻译： 电路板（2）包括嵌入通孔导体（10）的绝缘层（7）。 通孔导体（10）包括：第一导体部分（10a），其具有比上部更窄的下部; 和形成在第一导体部分（10a）正下方的第二导体部分（10b），其连接到第一导体部分（10a），并且具有大于第一导体部分（10a）的上端宽度的最大宽度， 。 绝缘层（7）在与通孔导体（10）接触的表面上具有多个凹口（T1a，T1b）。 通孔导体的凸部（T2a，T2b）布置在凹陷（T1a，T1b）中。
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3.发明授权公开(公告)号：US08431832B2
公开(公告)日：2013-04-30
申请号：US12745223
申请日：2008-11-28
申请人： Tadashi Nagasawa , Katsura Hayashi
发明人： Tadashi Nagasawa , Katsura Hayashi
CPC分类号： H05K1/115 , H01L21/486 , H01L23/49827 , H01L2224/16225 , H01L2224/16227 , H01L2924/00014 , H05K3/0035 , H05K3/0055 , H05K3/421 , H05K3/4673 , H05K2201/0195 , H05K2201/0209 , H05K2201/09845 , H05K2201/09863 , Y10T29/49165 , H01L2224/0401
摘要： A circuit board (2) includes an insulation layer (7) where a via conductor (10) is embedded. The via conductor (10) includes: a first conductor portion (10a) having an lower portion narrower than an upper portion; and a second conductor portion (10b) which is formed immediately below the first conductor portion (10a), connected to the first conductor portion (10a), and has a maximum width greater than the upper end width of the first conductor portion (10a). The insulation layer (7) has a plurality of indentations (T1a, T1b) on the surface in contact with the via conductor (10). Convex portions (T2a, T2b) of the via conductor are arranged in the indentations (T1a, T1b).
摘要翻译： 电路板（2）包括嵌入通孔导体（10）的绝缘层（7）。 通孔导体（10）包括：第一导体部分（10a），其具有比上部更窄的下部; 和形成在第一导体部分（10a）正下方的第二导体部分（10b），其连接到第一导体部分（10a），并且具有大于第一导体部分（10a）的上端宽度的最大宽度， 。 绝缘层（7）在与通孔导体（10）接触的表面上具有多个凹口（T1a，T1b）。 通孔导体的凸部（T2a，T2b）布置在凹口（T1a，T1b）中。
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4.发明申请公开(公告)号：US20100065318A1
公开(公告)日：2010-03-18
申请号：US12516751
申请日：2007-11-27
CPC分类号： H05K1/115 , H01L23/49827 , H01L2224/16225 , H01L2224/16227 , H01L2924/00014 , H05K3/0035 , H05K3/386 , H05K3/4602 , H05K2201/0195 , H05K2201/09563 , H05K2201/09827 , H05K2201/09836 , H05K2201/09854 , H01L2224/0401
摘要： A circuit board according to an embodiment of the present invention relates to a circuit board 2 including an insulating layer 7 and a via conductor 8 embedded in the insulating layer 7. The via conductor 8 has a narrowed portion 80 inclined with respect to a horizontal direction X.
摘要翻译： 根据本发明实施例的电路板涉及一种包含绝缘层7和嵌入绝缘层7中的通路导体8的电路板2.通孔导体8具有相对于水平方向倾斜的窄边部分80 X。
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公开(公告)号：US20090314526A1
公开(公告)日：2009-12-24
申请号：US12162770
申请日：2007-01-29
申请人： Tadashi Nagasawa , Masaharu Shirai , Kenji Kume , Yutaka Tsukada
发明人： Tadashi Nagasawa , Masaharu Shirai , Kenji Kume , Yutaka Tsukada
CPC分类号： H05K3/381 , B32B3/30 , B32B7/12 , B32B15/043 , B32B15/08 , B32B15/20 , B32B27/38 , B32B2255/205 , B32B2255/26 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2264/10 , B32B2264/102 , B32B2264/107 , B32B2307/202 , B32B2307/206 , B32B2307/306 , C09J7/22 , H05K1/0373 , H05K3/4661 , H05K2201/0209 , H05K2201/09045 , H05K2201/09563 , H05K2201/2072 , H05K2203/095 , Y10T428/24479 , Y10T428/24612
摘要： The invention relates to a resin film having a high adhesiveness to other materials, an adhesive sheet, a circuit board and an electronic apparatus in which an adhesive layer and the resin film are firmly adhered. A resin film (1) includes a plurality of projected portions (10) each having a filler (9) in an apex portion (10a) and a resin material. The projected portions (10) are formed on at least one surface of a sheet portion (16).
摘要翻译： 本发明涉及一种与其他材料具有高粘合性的树脂膜，粘合片，电路板和电子设备，其中粘合剂层和树脂膜牢固地粘合。 树脂膜（1）包括在顶部（10a）中具有填充物（9）的多个突起部（10）和树脂材料。 突出部分（10）形成在片材部分（16）的至少一个表面上。
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公开(公告)号：US08338717B2
公开(公告)日：2012-12-25
申请号：US12845582
申请日：2010-07-28
申请人： Tadashi Nagasawa
发明人： Tadashi Nagasawa
IPC分类号： H05K1/11
CPC分类号： H05K1/036 , H01L2224/16225 , H05K1/0366 , H05K1/0373 , H05K3/4602 , H05K2201/0209 , H05K2201/029
摘要： A circuit substrate includes a base and conductive layers disposed on lower and upper surfaces of the substrate. The base includes resin layers and the conductive layers overlapping with each other in a plan view. The resin layers include first resin layers and a second resin layer interposed between the first resin layers. The first resin layer has a filler and the second resin layer has no filler or a filler whose amount is 1 volume % or less and smaller than an amount of the filler in the first resin layer.
摘要翻译： 电路基板包括设置在基板的下表面和上表面上的基底和导电层。 基底包括树脂层，并且导电层在平面图中彼此重叠。 树脂层包括第一树脂层和介于第一树脂层之间的第二树脂层。 第一树脂层具有填料，第二树脂层不含有第一树脂层中的填料量或1体积％以下的填料。
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公开(公告)号：US08129623B2
公开(公告)日：2012-03-06
申请号：US12162770
申请日：2007-01-29
申请人： Tadashi Nagasawa , Masaharu Shirai , Kenji Kume , Yutaka Tsukada
发明人： Tadashi Nagasawa , Masaharu Shirai , Kenji Kume , Yutaka Tsukada
CPC分类号： H05K3/381 , B32B3/30 , B32B7/12 , B32B15/043 , B32B15/08 , B32B15/20 , B32B27/38 , B32B2255/205 , B32B2255/26 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2264/10 , B32B2264/102 , B32B2264/107 , B32B2307/202 , B32B2307/206 , B32B2307/306 , C09J7/22 , H05K1/0373 , H05K3/4661 , H05K2201/0209 , H05K2201/09045 , H05K2201/09563 , H05K2201/2072 , H05K2203/095 , Y10T428/24479 , Y10T428/24612
摘要： The invention relates to a resin film having a high adhesiveness to other materials, an adhesive sheet, a circuit board and an electronic apparatus in which an adhesive layer and the resin film are firmly adhered. A resin film (1) includes a plurality of projected portions (10) each having a filler (9) in an apex portion (10a) and a resin material. The projected portions (10) are formed on at least one surface of a sheet portion (16).
摘要翻译： 本发明涉及一种与其他材料具有高粘合性的树脂膜，粘合片，电路板和电子设备，其中粘合剂层和树脂膜牢固地粘合。 树脂膜（1）包括在顶部（10a）中具有填充物（9）的多个突起部（10）和树脂材料。 突出部分（10）形成在片材部分（16）的至少一个表面上。
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