公开(公告)号：US09366533B2

公开(公告)日：2016-06-14

申请号：US13881264

申请日：2011-09-22

Applicant: Takeshi Ashida

Inventor： Takeshi Ashida

IPC: G01C17/00 ,  G01C17/28 ,  G01C17/02 ,  G01C17/38

CPC classification number: G01C17/02 ,  G01C17/28 ,  G01C17/38

Abstract: Control section (160) is configured to measure the azimuth of electronic device (100) on the basis of the result detected by geomagnetic sensor (120) for detecting geomagnetism, and on the basis of the result detected by motion sensor (130) for detecting movement of electronic device (100), and is configured, while motion sensor (130) is detecting that electronic device (100) is stationary, to measure the azimuth of electronic device (100) only on the basis of the result detected by motion sensor (130), and the azimuth measured by control section (160) is displayed by display section (170).

Abstract translation: 控制部（160）被配置为基于由用于检测地磁的地磁传感器（120）检测到的结果，并且基于由用于检测的运动传感器（130）检测到的结果来测量电子设备（100）的方位角 电子设备（100）的移动，并且被配置为当运动传感器（130）检测到电子设备（100）是静止的时候，仅基于由运动传感器检测到的结果来测量电子设备（100）的方位角 （130），并且由显示部（170）显示由控制部（160）测量的方位角。

公开(公告)号：US20060252169A1

公开(公告)日：2006-11-09

申请号：US11480377

申请日：2006-07-05

Applicant: Takeshi Ashida

Inventor： Takeshi Ashida

IPC: H01L21/00

CPC classification number: G02B3/0031 ,  G02B3/0075 ,  H01L24/97 ,  H01L33/58 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

Abstract: In a method of manufacturing an optical device, a whole substrate is first prepared which has a plurality of regions corresponding to substrates constituting a plurality of optical devices, respectively. A plurality of chips are then mounted to the plurality of regions, respectively. A whole sealing member having a plurality of sealing members is integrally attached to the whole substrate to form an intermediate body. The intermediate body is divided into the above-described regions. Thus, the optical device having a substrate, a chip as an optical element mounted to the substrate and a sealing member with transparency provided at the substrate for the purpose of sealing the chip is manufactured. This manufacturing method improves the efficiency of manufacturing an optical device.

公开(公告)号：US08828309B2

公开(公告)日：2014-09-09

申请号：US13246255

申请日：2011-09-27

Applicant: Takeshi Ashida

Inventor： Takeshi Ashida

IPC: B29C35/00

CPC classification number: B29C35/0227 ,  B29C35/007 ,  B29C35/049 ,  B29C70/44

Abstract: The composite material formed of a fiber substrate and a matrix is placed in a vacuum bag and then in the molding chamber. Saturated steam of a predetermined temperature needed for the composite material is supplied to the molding chamber, and the temperature and the pressure inside the molding chamber are controlled so that the inside of the molding chamber may be maintained at a predetermined temperature and a predetermined pressure needed for the composite material in order to carry out a curing step.

Abstract translation: 将由纤维基材和基质形成的复合材料放置在真空袋中，然后置于模制室中。 将复合材料所需的预定温度的饱和蒸汽供应到模制室，并且控制模制室内的温度和压力，使得模制室的内部可以保持在预定温度并且需要预定压力 用于复合材料以便进行固化步骤。

公开(公告)号：US06853092B2

公开(公告)日：2005-02-08

申请号：US10682357

申请日：2003-10-09

Applicant: Takeshi Ashida

Inventor： Takeshi Ashida

IPC: H05K1/18 ,  H01L23/12 ,  H01L23/48 ,  H05K1/11 ,  H05K3/28 ,  H05K3/34

CPC classification number: H05K1/111 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/3436 ,  H05K2201/09227 ,  H05K2201/09381 ,  H05K2201/10977 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention provides a circuit board including a plurality of pads for mounting a semiconductor device with bumps and a plurality of wires drawn from the respective pads, a mounting structure for the semiconductor device with bumps, and an electro-optic device and an electronic device. The circuit board has a region where the pitch in the longitudinal direction and the lateral direction of the plurality of pads are different from each other and the wires are preferentially drawn from a wider pitch side of the longitudinal direction or the lateral directions of the pads.

Abstract translation: 本发明提供了一种电路板，包括用于安装具有凸块的半导体器件的多个焊盘和从相应的焊盘拉出的多个电线，用于具有凸块的半导体器件的安装结构，以及电光器件和电子器件 。 电路板具有多个焊盘的纵向和横向上的间距彼此不同的区域，并且电线优选地从焊盘的纵向方向或横向方向的较宽节距侧拉出。

公开(公告)号：USD613192S1

公开(公告)日：2010-04-06

申请号：US29337434

申请日：2009-05-21

Applicant: Toru Hosoda ,  Kohei Tomita ,  Takeshi Ashida ,  Hidetomo Ohtsuki ,  Koyuru Nakano

Designer： Toru Hosoda ,  Kohei Tomita ,  Takeshi Ashida ,  Hidetomo Ohtsuki ,  Koyuru Nakano

公开(公告)号：US07268303B2

公开(公告)日：2007-09-11

申请号：US10682780

申请日：2003-10-09

Applicant: Takeshi Ashida

Inventor： Takeshi Ashida

IPC: H05K1/16

CPC classification number: H01L23/50 ,  H01L23/3128 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/11822 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/111 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/09772 ,  H05K2201/0989 ,  H05K2201/10734 ,  H05K2201/10977 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In a circuit board including a pad for mounting a ball grid array and a wiring, a mounting structure of the ball grid array, an electro-optic device, and an electronic device, the circuit board includes a pad for mounting the ball grid array, a wiring for connecting the pad and an external terminal, and a soldering resist having an opening portion exposing the pad and the wiring.

Abstract translation: 在包括用于安装球栅阵列的焊盘和布线的电路板，球栅阵列的安装结构，电光器件和电子器件中，电路板包括用于安装球栅阵列的焊盘， 用于连接焊盘和外部端子的布线，以及具有露出焊盘和布线的开口部分的焊接抗蚀剂。

公开(公告)号：US07004376B2

公开(公告)日：2006-02-28

申请号：US10666546

申请日：2003-09-19

Applicant: Takeshi Ashida

Inventor： Takeshi Ashida

IPC: B23K31/02 ,  B23K35/12 ,  H01L29/40

CPC classification number: B23K3/0638 ,  B23K2101/40 ,  G02F1/13452 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K3/1225 ,  H05K3/3484 ,  H05K2201/10734 ,  H05K2203/043 ,  H05K2203/0545 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

Abstract: There is provided a mask for use in printing solder on a plurality of terminals formed on a substrate so as to correspond to a plurality of terminals of an IC package. The mask has openings through which the solder is applied, and the openings are larger than the terminals. Although a wiring line adjacent to the terminals may be covered with the solder, a reflow process causes the solder to be divided into a first portion and a second portion, thus preventing short-circuits between the wiring line and the terminals.

Abstract translation: 提供了用于在形成在基板上的多个端子上印刷焊料以对应于IC封装的多个端子的掩模。 掩模具有开口，通过该开口施加焊料，并且开口大于端子。 尽管与端子相邻的布线可以被焊料覆盖，但是回流工艺使得焊料被分成第一部分和第二部分，从而防止布线和端子之间的短路。

公开(公告)号：US20130221884A1

公开(公告)日：2013-08-29

申请号：US13882659

申请日：2011-10-26

Applicant: Takeshi Ashida ,  Hiroshi Hibino ,  Naoto Kobayashi ,  Michihiro Nakagawa ,  Nobuki Kitano ,  Masaki Kouno

Inventor： Takeshi Ashida ,  Hiroshi Hibino ,  Naoto Kobayashi ,  Michihiro Nakagawa ,  Nobuki Kitano ,  Masaki Kouno

IPC: H02P6/14

CPC classification number: H02P6/14 ,  H02M7/5395 ,  H02M2001/0054 ,  H02P6/153 ,  H02P2209/09 ,  Y02B70/1491

Abstract: A carrier generating unit applies a carrier that monotonically decreases to a switching control unit during either one of a first period that is a period immediately following a period in which a voltage command value is a value not more than a minimum value of the carrier, the voltage command value taking a first predetermined value larger than the minimum value of the carrier in the first period, and a second period that is a period immediately preceding a period in which the voltage command value is not less than a maximum value of the carrier, the voltage command value taking a second predetermined value smaller than the maximum value in the second period.

Abstract translation: 载波产生单元在紧接在电压指令值是不大于载波的最小值的周期之后的周期的第一周期中的任何一个期间中，向切换控制单元应用单调降低的载波， 电压指令值取第一预定值大于第一周期中的载波的最小值，以及第二周期，其是紧接在电压指令值不小于载波的最大值的周期之前的周期， 所述电压指令值取第二预定值小于所述第二周期中的最大值。

公开(公告)号：US08260344B2

公开(公告)日：2012-09-04

申请号：US12510194

申请日：2009-07-27

Applicant: Takeshi Ashida ,  Atsuo Soma ,  Satoshi Sato

Inventor： Takeshi Ashida ,  Atsuo Soma ,  Satoshi Sato

IPC: H04M1/00 ,  G01C22/00 ,  G06F11/30

CPC classification number: G01C22/006 ,  H04M2250/12

Abstract: In a mobile phone device 1 including a three-axial direction vibration sensor 16 for detecting the walking of a user carrying the mobile phone device 1 and counting the number of walking steps, when an incoming call is received, vibrations due to a notification operation by a vibrator 14 or a speaker 15 are transmitted to the three-axial direction vibration sensor 16. As a result, the three-axial direction vibration sensor 16 inevitably detects unintended vibrations in addition to vibrations from walking, causing the number of walking steps to be miscounted. To prevent this and perform the accurate detection of walking, in the present invention, the detection of walking is performed without using, among vibrations in three directions detected by the three-axial direction vibration sensor 16, vibrations in the same direction as the direction of vibrations caused by a notification operation by the vibrator 14 or the speaker 15.

Abstract translation: 在包括用于检测携带移动电话装置1的用户的行走并计数行走步数的三轴方向振动传感器16的移动电话装置1中，当接收到来电时，由于通知操作引起的振动 振动器14或扬声器15被传递到三轴方向振动传感器16.结果，三轴方向振动传感器16除了来自步行的振动之外，不可避免地会检测出非预期的振动，导致步行步数为 误会了 为了防止这种情况并进行行走的准确检测，在本发明中，在三轴方向振动传感器16检测到的三个方向的振动中，不进行与向 由振动器14或扬声器15的通知操作引起的振动。

公开(公告)号：US08222059B2

公开(公告)日：2012-07-17

申请号：US12163669

申请日：2008-06-27

Applicant: Takeshi Ashida

Inventor： Takeshi Ashida

IPC: H01L21/00

CPC classification number: G02B3/0031 ,  G02B3/0075 ,  H01L24/97 ,  H01L33/58 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

Abstract: In a method of manufacturing an optical device, a whole substrate is first prepared which has a plurality of regions corresponding to substrates constituting a plurality of optical devices, respectively. A plurality of chips are then mounted to the plurality of regions, respectively. A whole sealing member having a plurality of sealing members is integrally attached to the whole substrate to form an intermediate body. The intermediate body is divided into the above-described regions. Thus, the optical device having a substrate, a chip as an optical element mounted to the substrate and a sealing member with transparency provided at the substrate for the purpose of sealing the chip is manufactured. This manufacturing method improves the efficiency of manufacturing an optical device.

Abstract translation: 在制造光学器件的方法中，首先准备具有分别对应于构成多个光学器件的基板的多个区域的整个基板。 然后分别将多个芯片安装到多个区域。 具有多个密封构件的整体密封构件一体地附接到整个基板以形成中间体。 中间体分为上述区域。 因此，制造了具有基板，作为安装在基板上的光学元件的芯片的光学元件和设置在基板上的用于密封芯片的透明的密封部件。 该制造方法提高了光学器件的制造效率。