公开(公告)号：US20050258736A1

公开(公告)日：2005-11-24

申请号：US11133305

申请日：2005-05-20

申请人： Atsushi Kazama ,  Takeshi Terasaki ,  Makoto Kitano ,  Tatsuya Nagata ,  Takashi Fujimura

发明人： Atsushi Kazama ,  Takeshi Terasaki ,  Makoto Kitano ,  Tatsuya Nagata ,  Takashi Fujimura

IPC分类号： H01J29/86 ,  G09F9/00 ,  G09F9/30 ,  G09F9/313 ,  H01J1/62 ,  H01J29/87 ,  H01J31/12 ,  H01J63/04

CPC分类号： H01J31/123 ,  H01J29/87

摘要： To achieve high resolution, lightening, and thinning in a display apparatus, the display apparatus includes a thin display panel and a control unit. The display panel includes an anode substrate, a cathode substrate forming an electron emitting chamber vacuously sealed between itself and the anode substrate, phosphors formed on the anode substrate, and a pressure support formed on the back of the electron emitting chamber side of the cathode substrate. The pressure support includes a vacuum seal member forming a pressure supporting chamber vacuously sealed between itself and the cathode substrate independently of the electron emitting chamber, and a reinforcement member which is formed of a member having a gap, which is sandwiched between the vacuum seal member and cathode substrate in the pressure supporting member, and at least both end portions of which span a bonding area of the cathode substrate for the anode substrate.

摘要翻译： 为了在显示装置中实现高分辨率，减轻和减薄，显示装置包括薄的显示面板和控制单元。 显示面板包括阳极基板，形成在其自身与阳极基板之间真空密封的电子发射室的阴极基板，形成在阳极基板上的荧光体和形成在阴极基板的电子发射室侧背面的压力支架 。 压力支架包括一个真空密封件，该真空密封件形成一个与电子发射室无关地密封在其本身与阴极基板之间的压力支撑室;以及一个加强件，该加强件由一个具有间隙的部件形成，该加强件夹在真空密封件 和阴极基板，并且其至少两端部跨越阳极基板的阴极基板的接合区域。

公开(公告)号：US07298081B2

公开(公告)日：2007-11-20

申请号：US11132295

申请日：2005-05-19

申请人： Takeshi Terasaki ,  Atsushi Kazama ,  Makoto Kitano ,  Tatsuya Nagata ,  Takashi Fujimura

发明人： Takeshi Terasaki ,  Atsushi Kazama ,  Makoto Kitano ,  Tatsuya Nagata ,  Takashi Fujimura

IPC分类号： H01J1/62

CPC分类号： H01J31/123 ,  H01J29/87

摘要： A display apparatus is disclosed with a vacuum seal member which has a shell structure. The display apparatus includes an anode substrate, a planar cathode substrate forming an electron emitting chamber vacuously sealed between the cathode substrate and the anode substrate, electron sources formed on the cathode substrate, phosphors formed on the anode substrate, and a vacuum seal member forming a pressure balancing chamber on the back of the electron emitting chamber side of the cathode substrate. The vacuum seal member is placed covering the back of the electron emitting chamber side, and has a shell structure for receiving the atmospheric pressure.

摘要翻译： 公开了具有壳结构的真空密封构件的显示装置。 显示装置包括阳极基板，形成在阴极基板和阳极基板之间真空密封的电子发射室的平面阴极基板，形成在阴极基板上的电子源，形成在阳极基板上的荧光体和形成在阳极基板上的真空密封部件 阴极基板的电子发射室侧背面的压力平衡室。 真空密封构件被覆盖在电子发射室侧的背面，并且具有用于接收大气压的壳结构。

公开(公告)号：US20050258735A1

公开(公告)日：2005-11-24

申请号：US11132295

申请日：2005-05-19

申请人： Takeshi Terasaki ,  Atsushi Kazama ,  Makoto Kitano ,  Tatsuya Nagata ,  Takashi Fujimura

发明人： Takeshi Terasaki ,  Atsushi Kazama ,  Makoto Kitano ,  Tatsuya Nagata ,  Takashi Fujimura

IPC分类号： H01J29/86 ,  H01J29/87 ,  H01J31/12

CPC分类号： H01J31/123 ,  H01J29/87

摘要： An object of the present invention is to achieve high resolution, lightening, and thinning of a display apparatus. The display apparatus includes an anode substrate, a planar cathode substrate forming an electron emitting chamber vacuously sealed between the cathode substrate and the anode substrate, electron sources formed on the cathode substrate, phosphors formed on the anode substrate, and a vacuum seal member forming a pressure balancing chamber on the back of the electron emitting chamber side of the cathode substrate. The vacuum seal member is placed covering the back of the electron emitting chamber side, and has a shell structure for receiving the atmospheric pressure.

摘要翻译： 本发明的目的是实现显示装置的高分辨率，减轻和减薄。 显示装置包括阳极基板，形成在阴极基板和阳极基板之间真空密封的电子发射室的平面阴极基板，形成在阴极基板上的电子源，形成在阳极基板上的荧光体和形成在阳极基板上的真空密封部件 阴极基板的电子发射室侧背面的压力平衡室。 真空密封构件被覆盖在电子发射室侧的背面，并且具有用于接收大气压的壳结构。

公开(公告)号：US06331730B1

公开(公告)日：2001-12-18

申请号：US09296466

申请日：1999-04-22

申请人： Takeshi Terasaki ,  Hideo Miura ,  Chikara Nakajima ,  Makoto Kitano

发明人： Takeshi Terasaki ,  Hideo Miura ,  Chikara Nakajima ,  Makoto Kitano

IPC分类号： H02K1936

CPC分类号： H01L24/01 ,  H01L23/049 ,  H01L23/3121 ,  H01L24/33 ,  H01L2224/83385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

摘要： A push-in type semiconductor chip has a semiconductor device, a support electrode body bonded to one of the end portions of the semiconductor chip and supported by, and fixed to, a heat spreader at a support fixing portion thereof, a lead electrode body bonded to the other end portion of the semiconductor chip and an insulating/sealing member disposed at the bond portion between the semiconductor chip and the support electrode body and at the bond portion between the semiconductor chip and the lead electrode body. The support electrode body includes a first portion having an outer diameter different from that of the support fixing portion at which the support electrode body is supported and fixed by the heat spreader. By setting a predetermined relationship between the outer diameters of the first portion and the support fixing portion, deformation and breakage of the semiconductor chip during assembly can be prevented.

摘要翻译： 推入型半导体芯片具有半导体器件，支撑电极体，其结合到半导体芯片的一个端部并由其支撑固定部分上的散热器支撑并固定到其上，引线电极体接合 到半导体芯片的另一端部以及设置在半导体芯片和支撑电极体之间的接合部以及半导体芯片和引线电极体的接合部的绝缘/密封构件。 支撑电极体包括具有与支撑固定部分不同的外径的第一部分，支撑电极主体由散热器支撑和固定。 通过设置第一部分的外径和支撑固定部分之间的预定关系，可以防止组装期间半导体芯片的变形和断裂。

公开(公告)号：US06844219B2

公开(公告)日：2005-01-18

申请号：US10136409

申请日：2002-05-02

申请人： Makoto Kitano ,  Akihiro Yaguchi ,  Naotaka Tanaka ,  Takeshi Terasaki ,  Ichiro Anjoh ,  Ryo Haruta ,  Asao Nishimura ,  Junichi Saeki

发明人： Makoto Kitano ,  Akihiro Yaguchi ,  Naotaka Tanaka ,  Takeshi Terasaki ,  Ichiro Anjoh ,  Ryo Haruta ,  Asao Nishimura ,  Junichi Saeki

IPC分类号： H01L23/12 ,  H01L21/60 ,  H01L23/00 ,  H01L23/02 ,  H01L23/16 ,  H01L23/31 ,  H01L23/488 ,  H01L23/495 ,  H01L23/498 ,  H05K3/34 ,  H01L21/44

CPC分类号： H01L23/16 ,  H01L23/3128 ,  H01L23/49572 ,  H01L23/49816 ,  H01L23/562 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H05K3/3426 ,  H05K3/3436 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor device which can improve the connection reliability of solder bumps and productivity in manufacturing. Insulating tape having wiring patterns on its surface is bonded to a lead frame. Semiconductor elements are loaded and circuit formed surfaces and sides of the semiconductor elements are sealed with sealing resin. After arrangements of individual semiconductor devices are formed, the lead frame is separated into individual metal plates to form individual semiconductor devices. Such simultaneous production of a plurality of semiconductor devices enhances productivity, and improves flatness of the insulating tape, whereby the connection reliability of solder bumps is improved.

摘要翻译： 可以提高焊料凸块的连接可靠性和制造生产率的半导体器件。 在其表面具有布线图案的绝缘带被粘合到引线框架上。 半导体元件被加载并且电路形成的表面和半导体元件的侧面被密封树脂​​密封。 在形成各个半导体器件的布置之后，将引线框架分离成单独的金属板以形成单独的半导体器件。 这种同时生产多个半导体器件提高了生产率，并且提高了绝缘带的平坦度，从而提高了焊料凸块的连接可靠性。

公开(公告)号：US06465876B1

公开(公告)日：2002-10-15

申请号：US08974682

申请日：1997-11-19

申请人： Makoto Kitano ,  Akihiro Yaguchi ,  Naotaka Tanaka ,  Takeshi Terasaki ,  Ichiro Anjoh ,  Ryo Haruta ,  Asao Nishimura ,  Junichi Saeki

发明人： Makoto Kitano ,  Akihiro Yaguchi ,  Naotaka Tanaka ,  Takeshi Terasaki ,  Ichiro Anjoh ,  Ryo Haruta ,  Asao Nishimura ,  Junichi Saeki

IPC分类号： H01L2302

CPC分类号： H01L23/16 ,  H01L23/3128 ,  H01L23/49572 ,  H01L23/49816 ,  H01L23/562 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H05K3/3426 ,  H05K3/3436 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor device which can improve the connection reliability of solder bumps and productivity in manufacturing. Insulating tape having wiring patterns on its surface is bond ed to a lead frame. Semiconductor elements are loaded and circuit formed surfaces and sides of the semiconductor elements are sealed with sealing resin. After arrangements of individual semiconductor devices are formed, the lead frame is separated into individual metal plates to form individual semiconductor devices. Such simultaneous production of a plurality of semiconductor devices enhances productivity, and improves flatness of the insulating tape, whereby the connection reliability of solder bumps is improved.

摘要翻译： 可以提高焊料凸块的连接可靠性和制造生产率的半导体器件。 在其表面上具有布线图案的绝缘带与引线框架结合。 半导体元件被加载并且电路形成的表面和半导体元件的侧面被密封树脂​​密封。 在形成各个半导体器件的布置之后，将引线框架分离成单独的金属板以形成单独的半导体器件。 这种同时生产多个半导体器件提高了生产率，并且提高了绝缘带的平坦度，从而提高了焊料凸块的连接可靠性。

公开(公告)号：US20060003219A1

公开(公告)日：2006-01-05

申请号：US11169775

申请日：2005-06-30

申请人： Ryuji Kohno ,  Tatsuya Nagata ,  Makoto Kitano

发明人： Ryuji Kohno ,  Tatsuya Nagata ,  Makoto Kitano

IPC分类号： H01M2/08 ,  H01M8/10 ,  H01M8/02

CPC分类号： H01M8/04208 ,  H01M8/0247 ,  H01M8/04186 ,  H01M8/248

摘要： It is an object of the present invention to provide a fuel cell having a pressurizing mechanism which can optimize pressure applied to a membrane electrode assembly (MEA) working as a power-generating element to realize high-efficiency power generation and an electronic device equipped with the same. The fuel cell 10A comprises the membrane electrode assembly module 20 which consumes the liquid fuel 40 to generate power, and the fuel chamber 30 for supplying the liquid fuel 40 which it holds inside to the membrane electrode assembly module 20 from the aperture 31, wherein it is provided with the pressurizing member 60 on the membrane electrode assembly module 20, clamping member 53 for fixing the pressurizing member 60 and fuel chamber 30, and elastic member for applying a pressure on the membrane electrode assembly module 20 in its thickness direction, to solve the problems.

摘要翻译： 本发明的目的是提供一种具有加压机构的燃料电池，该加压机构能够优化施加于作为发电元件的膜电极组件（MEA）的压力，以实现高效发电，以及配备有 一样。 燃料电池10A包括消耗液体燃料40以产生动力的膜电极组件模块20，以及用于从孔31向液体燃料40供给到膜电极组件模块20内的液体燃料40的燃料室30，其中 在膜电极组件模块20上设置有加压构件60，用于固定加压构件60和燃料室30的夹紧构件53以及在膜电极组件模块20的厚度方向上施加压力的弹性构件， 解决问题。

公开(公告)号：US20060003196A1

公开(公告)日：2006-01-05

申请号：US11171218

申请日：2005-07-01

申请人： Ryuji Kohno ,  Tatsuya Nagata ,  Makoto Kitano

发明人： Ryuji Kohno ,  Tatsuya Nagata ,  Makoto Kitano

IPC分类号： H01M8/00

CPC分类号： H01M8/04201 ,  H01M8/04186 ,  H01M8/04208 ,  H01M8/1011 ,  Y02E60/523

摘要： It is an object of the present invention to provide a fuel cell which can supply a liquid fuel, without changing its composition, to every corner of the membrane electrode assemblies arranged two- dimensionally over a wide area, to generate power at a high efficiency. The fuel cell 10A comprises the membrane electrode assembly modules 20 which consume the liquid fuel 40 to generate power, and the fuel chamber 30 which holds the liquid fuel 40 inside and has the principal plane on which the membrane electrode assembly modules 20 are arranged, wherein the fuel chamber 30 is provided with the fuel injection hole 33 inside, through which the liquid fuel 40 is supplied under pressure from the outside, and the fuel supply gear 42 inside, which is located to come close to the membrane electrode assembly modules 20, the fuel supply gear 42 being provided, on the surface, with the fine pores 43 through which the liquid fuel 40 can pass.

摘要翻译： 本发明的一个目的是提供一种燃料电池，其可以在不改变其组成的情况下将液体燃料供应到在广泛区域上二维布置的膜电极组件的每个角部，以高效率发电。 燃料电池10A包括消耗液体燃料40以产生动力的膜电极组件模块20和将液体燃料40保持在内部并且具有其上布置有膜电极组件模块20的主平面的燃料室30， 其中燃料室30内设有燃料喷射孔33，液体燃料40通过该燃料喷射孔33从外部受到压力供给，燃料供给齿轮42位于靠近膜电极组件模块20的位置 燃料供给齿轮42在表面上设置有液体燃料40可以通过的细孔43。

公开(公告)号：US5837567A

公开(公告)日：1998-11-17

申请号：US829230

申请日：1997-03-31

申请人： Naotaka Tanaka ,  Akihiro Yaguchi ,  Makoto Kitano ,  Tatsuya Nagata ,  Tetsuo Kumazawa ,  Atsushi Nakamura ,  Hiromichi Suzuki ,  Masayoshi Tsugane

发明人： Naotaka Tanaka ,  Akihiro Yaguchi ,  Makoto Kitano ,  Tatsuya Nagata ,  Tetsuo Kumazawa ,  Atsushi Nakamura ,  Hiromichi Suzuki ,  Masayoshi Tsugane

IPC分类号： H01L21/56 ,  H01L23/495 ,  H01L21/44

CPC分类号： H01L23/49558 ,  H01L21/565 ,  H01L23/49541 ,  H01L23/49548 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/181

摘要： A lead frame for use with a plastic encapsulated semiconductor device includes a tab on which the semiconductor chip is mounted, chip pad supporting leads, inner leads to be electrically coupled with the semiconductor chip, outer leads formed in a monoblock structure together with the inner leads, and a frame for supporting the chip pad supporting leads and outer leads. In the lead frame, there is disposed a dam member only between the outer leads. Alternatively, dummy outer leads are formed between the frame and leads adjacent thereto so as to connect the dummy leads to the outer leads by the dam member. The frame is removed after the semiconductor device is assembled.

摘要翻译： 与塑料封装的半导体器件一起使用的引线框架包括其上安装有半导体芯片的突片，芯片焊盘支撑引线，与半导体芯片电耦合的内部引线，与内部引线一起形成为整体结构的外部引线 以及用于支撑芯片焊盘支撑引线和外引线的框架。 在引线框架中，仅在外引线之间设置阻挡构件。 或者，在框架和与其相邻的导线之间形成虚设外引线，以便通过坝构件将虚拟引线连接到外引线。 在组装半导体器件之后移除框架。

公开(公告)号：US07862952B2

公开(公告)日：2011-01-04

申请号：US11176358

申请日：2005-07-08

申请人： Ryuji Kohno ,  Tatsuya Nagata ,  Makoto Kitano ,  Masahiro Seido ,  Kazuhiko Nakagawa

发明人： Ryuji Kohno ,  Tatsuya Nagata ,  Makoto Kitano ,  Masahiro Seido ,  Kazuhiko Nakagawa

IPC分类号： H01M8/10 ,  H01M4/64

CPC分类号： H01M8/242 ,  H01M8/0206 ,  H01M8/0247 ,  H01M8/0271 ,  H01M8/04208 ,  H01M8/1011 ,  H01M8/1097 ,  H01M8/241 ,  H01M8/2418 ,  H01M2250/30 ,  Y02B90/18 ,  Y02E60/523 ,  Y02P70/56

摘要： According to the present invention, there is provided a membrane electrode composite module including a membrane electrode composite formed by sandwiching both surfaces of an electrolyte membrane between gas diffusion electrodes, an anode current collecting plate having fuel flow holes through which fuel flows, and a cathode current collecting plate having oxygen flow holes through which oxygen flows, wherein both surfaces of the membrane electrode composite are sandwiched between the anode current collecting plate and the cathode current collecting plate, the membrane electrode composite module further including films made of a synthetic resin (a first film and a second film) which are a base of the anode current collecting plate and a base of the cathode current collecting plate.

摘要翻译： 根据本发明，提供了一种膜电极复合模块，其包括通过将电解质膜的两个表面夹在气体扩散电极之间而形成的膜电极复合体，具有燃料流动的燃料流通孔的阳极集电板和阴极 集电板，其具有通过氧气流动的氧气流通孔，其中膜电极复合体的两个表面夹在阳极集电板和阴极集电板之间，该膜电极复合模块还包括由合成树脂制成的膜 第一膜和第二膜），其是阳极集电板的基底和阴极集电板的基底。