利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

94 条记录 (耗时 0.028 秒)

    Polarization angle adjustment apparatus for transmitter and receiver equipment
    1.
    发明授权
    Polarization angle adjustment apparatus for transmitter and receiver equipment 失效
    用于发射机和接收机设备的极化角度调节装置

    公开(公告)号：US5696519A

    公开(公告)日：1997-12-09

    申请号：US578270

    申请日：1995-12-26

    申请人： Takuya Suzuki ,  Yoshio Minowa

    发明人： Takuya Suzuki ,  Yoshio Minowa

    IPC分类号： H01Q19/13 ,  H01Q3/00 ,  H01Q3/18

    CPC分类号： H01Q3/18

    摘要： In a polarization angle adjusting mechanism for an antenna apparatus constructed of a supporting base and a transmitter/receiver apparatus equipped with a primary antenna at a right end portion thereof formed in an integral form, the primary antenna being located at a focal portion of an antenna, the supporting base has a cylindrical bearing for receiving a rotation shaft of the transmitter/receiver apparatus at a left end portion thereof, and also a plurality of subdivided projections are provided on this shaft receiving plane along a circumferential direction. On the other hand, projections and grooves fitted to a plurality of projections provided on the supporting base, which can be inserted among these plural grooves, are provided in the circumferential surface of the rotation shaft of the transmitter/receiver apparatus. The rotation shaft is inserted into the supporting base and the transmitter/receiver apparatus is rotated, so that the projections are fitted to the grooves so as to mount the transmitter/receiver apparatus to the supporting base. Similarly, another supporting base is mounted on the right end portion of the transmitter/receiver apparatus. In this manner, the transmitter/receiver apparatus is rotated to thereby adjust the polarization angle.

    摘要翻译： 在用于天线装置的偏振角调整机构中，天线装置由支撑基座和发射器/接收器装置构成，该发射器/接收器装置在其右端部分上形成一体形式的主天线，主天线位于天线的焦点部分 支撑基座具有用于在左端部接收收发装置的旋转轴的圆柱形轴承，并且沿着圆周方向在该轴接收面上设置多个细分突起。 另一方面，在发送/接收装置的旋转轴的圆周表面上设置有可以插入在这些多个槽之间的设置在支撑基座上的多个突起的突起和槽。 旋转轴被插入到支撑基座中，并且发送器/接收器装置旋转，使得突起装配到凹槽，以将发送器/接收器装置安装到支撑基座。 类似地，另一支撑底座安装在发射机/接收机设备的右端部分上。 以这种方式，使发射机/接收机设备旋转，从而调节极化角度。

    Branching filter for transmitter-receiver
    2.
    发明授权
    Branching filter for transmitter-receiver 失效
    发射机接收机分支滤波器

    公开(公告)号：US5576670A

    公开(公告)日：1996-11-19

    申请号：US363414

    申请日：1994-12-23

    申请人： Takuya Suzuki ,  Yoshio Minowa

    发明人： Takuya Suzuki ,  Yoshio Minowa

    IPC分类号： H01P1/209 ,  H01P1/161 ,  H01P1/213 ,  H01P5/02 ,  H01P5/16

    CPC分类号： H01P1/2138

    摘要： A branching filter for a transmitter-receiver which is used in a microwave band comprising an orthogonal-mode transducer (waveguide branching filter), a reception filter comprising a band-eliminating filter 4 which is connected to the extension of the center axis of the waveguide of the orthogonal-mode transducer, and a transmission filter comprising a high pass filter containing a cut off waveguide which is directly and orthogonally connected to the orthogonal-mode transducer. The parts of the branching filter for the transmitter-receiver are integrally manufactured as one body by a lost wax process. Therefore, the branching filter for the transmitter-receiver can be manufactured as a compact-size single body having no patch or linking portion.

    摘要翻译： 一种用于包括正交模式换能器（波导分支滤波器）的微波频带的发射机 - 接收机的分路滤波器，包括与波导的中心轴的延伸部连接的带除滤波器4的接收滤波器 以及包括直接和正交连接到正交模式换能器的截止波导的高通滤波器的发送滤波器。 用于发射机 - 接收机的分路滤波器的部件通过失蜡处理被整体制造为一体。 因此，用于发射机 - 接收机的分路滤波器可以制造成没有贴片或连接部分的紧凑型单体。

    High-frequency circuit package and sensor module
    5.
    发明授权
    High-frequency circuit package and sensor module 有权
    高频电路封装和传感器模块

    公开(公告)号：US09070961B2

    公开(公告)日：2015-06-30

    申请号：US13062349

    申请日：2009-09-02

    申请人： Takuya Suzuki

    发明人： Takuya Suzuki

    IPC分类号： H05K1/11 ,  H05K1/14 ,  H01P5/107 ,  H01L23/552 ,  H01L23/58 ,  H01L23/66 ,  H01L25/18 ,  H05K1/02 ,  H01L23/498 ,  H01L23/50 ,  H05K3/34

    CPC分类号： H05K1/0218 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/552 ,  H01L23/585 ,  H01L23/66 ,  H01L25/0652 ,  H01L25/18 ,  H01L2223/6622 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2225/0652 ,  H01L2924/15321 ,  H01L2924/1903 ,  H01L2924/19032 ,  H01L2924/3011 ,  H01P3/081 ,  H01P5/107 ,  H01Q9/04 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0237 ,  H05K1/0243 ,  H05K3/3436 ,  H05K2201/09618 ,  H05K2201/10151 ,  H05K2201/10734

    摘要： Shielding of high-frequency circuits is achieved using a simple and inexpensive configuration not using any lid. A high-frequency circuit mounting substrate (20) is disposed, on an underside surface layer of which are disposed high-frequency circuits (21 and 22) and is formed a first grounding conductor that has same electric potential as grounding conductors of the high-frequency circuits and that surrounds the high-frequency circuits. A mother control substrate (3) is disposed, on which the high-frequency circuit mounting substrate (20) is mounted in such a way that the high-frequency circuits are sandwiched therebetween and on which a second grounding conductor is formed in a region facing the high-frequency circuits. Plural first lands are formed on the first grounding conductor of the high-frequency circuit mounting substrate (20) to surround the high-frequency circuits. Plural second lands are formed that are electrically connected to the second grounding conductor at positions on a surface layer of the mother control substrate (3) which face the first lands. Plural solder balls (30G2) are disposed for connecting the first lands and the second lands. The high-frequency circuits are housed in pseudo shielding cavities surrounded by the solder balls (30G2), the grounding conductors of the high-frequency circuits, and the first and second grounding conductors.

    摘要翻译： 使用不使用任何盖子的简单且便宜的配置来实现高频电路的屏蔽。 高频电路安装基板（20）设置在其下表面层上，设置有高频电路（21和22），并形成与第一接地导体相同的电位的第一接地导体， 频率电路，并且围绕高频电路。 设置母控制基板（3），其上安装有高频电路安装基板（20），使得高频电路夹在其间并在其上形成有第二接地导体的区域 高频电路。 多个第一焊盘形成在高频电路安装基板（20）的第一接地导体上，以围绕高频电路。 形成在母板控制基板（3）的面对第一焊盘的位置处与第二接地导体电连接的多个第二焊盘。 多个焊球（30G2）被设置用于连接第一焊盘和第二焊盘。 高频电路容纳在由焊球（30G2），高频电路的接地导体以及第一和第二接地导体包围的伪屏蔽腔中。

    Waveguide connection between a multilayer waveguide substrate and a metal waveguide substrate including a choke structure in the multilayer waveguide
    6.
    发明授权
    Waveguide connection between a multilayer waveguide substrate and a metal waveguide substrate including a choke structure in the multilayer waveguide 有权
    在多层波导基板和包括多层波导中的扼流结构的金属波导基板之间的波导连接

    公开(公告)号：US07994881B2

    公开(公告)日：2011-08-09

    申请号：US12307755

    申请日：2007-10-30

    申请人： Takuya Suzuki

    发明人： Takuya Suzuki

    IPC分类号： H01P1/04

    CPC分类号： H01P1/042 ,  H01P3/121

    摘要： A rectangular conductor pattern is formed around a first waveguide on a multilayer dielectric substrate facing a metal substrate, with an end at about λ/4 away from a long side edge of the first waveguide, where λ is a free-space wavelength of a signal wave. A conductor opening is formed between the end of the conduction pattern and the long side edge of the first waveguide, with a length longer than a long side of the first waveguide and shorter than about λ. A closed-ended dielectric transmission path is formed in the multilayer dielectric substrate in the layer direction, with a length of about λg/4, where λg is an in-substrate effective wavelength of the signal wave.

    摘要翻译： 在面向金属基板的多层电介质基板上的第一波导周围形成矩形导体图案，其端部距离第一波导的长边缘大约λ/ 4，其中λ是信号的自由空间波长 波。 导体开口形成在导电图案的端部和第一波导的长边缘之间，其长度比第一波导的长边长并且短于约λ。 在多层电介质基板中沿层方向形成封闭电介质传输路径，长度约为λg/ 4，其中λg为信号波的衬底内有效波长。

    HIGH-FREQUENCY CIRCUIT PACKAGE AND SENSOR MODULE
    7.
    发明申请
    HIGH-FREQUENCY CIRCUIT PACKAGE AND SENSOR MODULE 有权
    高频电路封装和传感器模块

    公开(公告)号：US20110163919A1

    公开(公告)日：2011-07-07

    申请号：US13062349

    申请日：2009-09-02

    申请人： Takuya Suzuki

    发明人： Takuya Suzuki

    IPC分类号： H05K9/00 ,  H01Q1/38

    CPC分类号： H05K1/0218 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/552 ,  H01L23/585 ,  H01L23/66 ,  H01L25/0652 ,  H01L25/18 ,  H01L2223/6622 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2225/0652 ,  H01L2924/15321 ,  H01L2924/1903 ,  H01L2924/19032 ,  H01L2924/3011 ,  H01P3/081 ,  H01P5/107 ,  H01Q9/04 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0237 ,  H05K1/0243 ,  H05K3/3436 ,  H05K2201/09618 ,  H05K2201/10151 ,  H05K2201/10734

    摘要： Shielding of high-frequency circuits is achieved using a simple and inexpensive configuration not using any lid. A high-frequency circuit mounting substrate (20) is disposed, on an underside surface layer of which are disposed high-frequency circuits (21 and 22) and is formed a first grounding conductor that has same electric potential as grounding conductors of the high-frequency circuits and that surrounds the high-frequency circuits. A mother control substrate (3) is disposed, on which the high-frequency circuit mounting substrate (20) is mounted in such a way that the high-frequency circuits are sandwiched therebetween and on which a second grounding conductor is formed in a region facing the high-frequency circuits. Plural first lands are formed on the first grounding conductor of the high-frequency circuit mounting substrate (20) to surround the high-frequency circuits. Plural second lands are formed that are electrically connected to the second grounding conductor at positions on a surface layer of the mother control substrate (3) which face the first lands. Plural solder balls (30G2) are disposed for connecting the first lands and the second lands. The high-frequency circuits are housed in pseudo shielding cavities surrounded by the solder balls (30G2), the grounding conductors of the high-frequency circuits, and the first and second grounding conductors.

    摘要翻译： 使用不使用任何盖子的简单且便宜的配置来实现高频电路的屏蔽。 高频电路安装基板（20）设置在其下表面层上，设置有高频电路（21和22），并形成与第一接地导体相同的电位的第一接地导体， 频率电路，并且围绕高频电路。 设置母控制基板（3），其上安装有高频电路安装基板（20），使得高频电路夹在其间并在其上形成有第二接地导体的区域 高频电路。 多个第一焊盘形成在高频电路安装基板（20）的第一接地导体上，以围绕高频电路。 形成在母板控制基板（3）的面对第一焊盘的位置处与第二接地导体电连接的多个第二焊盘。 多个焊球（30G2）被设置用于连接第一焊盘和第二焊盘。 高频电路容纳在由焊球（30G2），高频电路的接地导体以及第一和第二接地导体包围的伪屏蔽腔中。

    Battery driven video reproduction apparatus
    8.
    发明授权
    Battery driven video reproduction apparatus 有权
    电池驱动视频再现设备

    公开(公告)号：US07725009B2

    公开(公告)日：2010-05-25

    申请号：US11176777

    申请日：2005-07-07

    申请人： Takuya Suzuki

    发明人： Takuya Suzuki

    IPC分类号： H04N5/00

    CPC分类号： H04N21/462 ,  H04N5/57 ,  H04N5/63 ,  H04N5/85 ,  H04N21/4325 ,  H04N21/4424

    摘要： A video reproduction apparatus detects the remaining time of a movie being reproduced and a battery's availability and calculates therefrom power available before reproducing the movie ends, and uses the power as calculated and a table representing a relationship between the liquid crystal display device's screen brightness and power consumption to calculate and set the liquid crystal display device's screen brightness to prevent the battery from running out while the movie is being reproduced.

    摘要翻译： 视频再现装置检测正在再现的电影的剩余时间和电池的可用性，并且从其计算再现电影结束之前的可用电力，并且使用所计算的电力和表示液晶显示装置的屏幕亮度和功率之间的关系的表 消耗来计算和设置液晶显示设备的屏幕亮度，以防止在电影被再现时电池电量耗尽。

    SEMICONDUCTOR CHIP AND RADIO FREQUENCY CIRCUIT
    9.
    发明申请
    SEMICONDUCTOR CHIP AND RADIO FREQUENCY CIRCUIT 有权
    半导体芯片和无线电频率电路

    公开(公告)号：US20100117711A1

    公开(公告)日：2010-05-13

    申请号：US12527877

    申请日：2007-11-15

    申请人： Takuya Suzuki ,  Kenji Kawakami ,  Ko Kanaya ,  Yoichi Kitamura

    发明人： Takuya Suzuki ,  Kenji Kawakami ,  Ko Kanaya ,  Yoichi Kitamura

    IPC分类号： G06F7/44 ,  H01L23/48

    CPC分类号： H03D7/02 ,  H01L23/66 ,  H01L2223/6644 ,  H01L2924/0002 ,  H01L2924/3011 ,  H03D9/0633 ,  H01L2924/00

    摘要： A two-terminal semiconductor device is formed on a semiconductor substrate. Two wiring patterns are respectively connected to terminals of the semiconductor device, and two electrode pads are respectively connected to the wiring patterns for connecting a signal input/output circuit formed on a separate substrate. Two parallel wiring patterns are respectively connected to the wiring patterns, and two reactance-circuit connection electrode pads are respectively connected to the parallel wiring patterns for electrically connecting a reactance circuit formed on the separate substrate separately from the signal input/output circuit.

    摘要翻译： 在半导体衬底上形成二端子半导体器件。 两个布线图案分别连接到半导体器件的端子，并且两个电极焊盘分别连接到用于连接形成在单独基板上的信号输入/输出电路的布线图案。 两个平行布线图案分别连接到布线图案，并且两个电抗电路连接电极焊盘分别连接到并行布线图案，用于将形成在单独基板上的电抗电路与信号输入/输出电路分开地电连接。