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    Hermetic-sealing package member, production method therefor, and hermetically-sealed package production method using this hermetic-sealing package member
    1.
    发明授权
    Hermetic-sealing package member, production method therefor, and hermetically-sealed package production method using this hermetic-sealing package member 有权
    密封封装构件，其制造方法以及使用这种密封封装构件的气密封装生产方法

    公开(公告)号：US09561952B2

    公开(公告)日：2017-02-07

    申请号：US15102215

    申请日：2014-12-22

    Applicant: TANAKA KIKINZOKU KOGYO K.K.

    Inventor： Toshinori Ogashiwa ,  Yuya Sasaki ,  Masayuki Miyairi

    IPC: H01L23/28 ,  B81B7/00 ,  H01L51/52 ,  H01L21/56 ,  H01L23/00 ,  B81C1/00 ,  H01L21/50 ,  H01B1/02 ,  H01L23/10

    CPC classification number: B81B7/0045 ,  B81C1/00269 ,  B81C1/00325 ,  B81C2203/019 ,  H01B1/02 ,  H01L21/50 ,  H01L21/56 ,  H01L23/00 ,  H01L23/10 ,  H01L24/94 ,  H01L51/5243 ,  H01L51/5246 ,  H01L2924/0002 ,  H01L2924/10253 ,  H01L2924/16235 ,  H01L2924/16598 ,  H01L2924/167 ,  H01L2924/00

    Abstract: The present invention is to provide an hermetic-sealing package member including a substrate and at least one frame-like sealing material for defining a sealing region formed on the substrate, in which the sealing material is formed of a sintered body obtained by sintering at least one metal powder selected from gold, silver, palladium, or platinum having a purity of 99.9 wt % or greater and an average particle size of 0.005 μm to 1.0 μm, and with respect to an arbitrary cross-section toward an outside from the sealing region, a length of an upper end of the sealing material is shorter than a length of a lower end. Examples of a cross-sectional shape of the sealing material may include one formed to have a base portion having a certain height and at least one mountain portion protruding from the base portion or one formed to have a mountain portion having substantially a triangular shape in which the length of the lower end of the sealing material is a bottom. By use of the hermetic-sealing package member of the present invention, a load is reduced at the time of hermetic-sealing and a sufficient sealing effect can be obtained.

    Abstract translation: 本发明提供一种密封封装构件，其包括基板和至少一个框状密封材料，用于限定形成在基板上的密封区域，其中密封材料由至少烧结获得的烧结体形成 选自纯度为99.9重量％以上，平均粒径为0.005〜1.0微米的金，银，钯或铂的一种金属粉末，并且相对于从密封区域向外侧的任意横截面 密封材料的上端的长度比下端的长度短。 密封材料的截面形状的实例可以包括形成为具有一定高度的基部和从基部突出的至少一个山部或形成为具有基本上三角形形状的山部的一个，其中 密封材料的下端的长度为底部。 通过使用本发明的密封封装构件，在气密密封时减少了负荷，可获得足够的密封效果。

    Package production method and package produced by the method
    3.
    发明授权
    Package production method and package produced by the method 有权

    公开(公告)号：US10125015B2

    公开(公告)日：2018-11-13

    申请号：US15556161

    申请日：2015-08-18

    Applicant: TANAKA KIKINZOKU KOGYO K.K.

    Inventor： Toshinori Ogashiwa ,  Yuya Sasaki ,  Masayuki Miyairi

    IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  B81C1/00 ,  B81C3/00 ,  H01L23/02

    Abstract: The present invention relates to a package production method includes the step of superposing a pair of substrates on each other, and bonding the substrates to each other to hermetically seal the inside of a sealing region surrounded by a sealing material, which is formed on any of the substrates. The sealing material is formed of a sintered body obtained by sintering a metal powder of at least one selected from gold, silver, palladium and platinum, the metal powder having a purity of 99.9% by weight or more and an average particle size of 0.005 μm to 1.0 μm, at least one core material having a width smaller than the width of the sealing material in a cross-sectional shape, and protruding from the periphery is formed on the substrate, and the core material compresses the sealing material to exhibit a sealing effect when the pair of substrates are bonded to each other. Accordingly, a sufficient sealing effect can be exhibited while a pressuring force to the substrate is reduced.

    Through-hole sealing structure
    4.
    发明授权
    Through-hole sealing structure 有权

    公开(公告)号：US11626334B2

    公开(公告)日：2023-04-11

    申请号：US16083162

    申请日：2017-04-06

    Applicant: TANAKA KIKINZOKU KOGYO K.K.

    Inventor： Toshinori Ogashiwa ,  Yuya Sasaki ,  Masayuki Miyairi

    IPC: H01L23/10 ,  H01L21/48 ,  H01L21/683

    Abstract: A sealing structure including: a set of base members forming a sealed space; a through-hole which is formed in at least one of the base members, and communicates with the sealed space; and a sealing member that seals the through-hole. An underlying metal film including a bulk-like metal such as gold is provided on a surface of the base member provided with the through-hole. The sealing member seals the through-hole while being bonded to the underlying metal film, and includes: a sealing material which is bonded to the underlying metal film, and includes a compressed product of a metal powder of gold or the like, the metal powder having a purity of 99.9% by mass or more; and a lid-like metal film which is bonded to the sealing material, and includes a bulk-like metal such as gold. Further, the sealing material includes: an outer periphery-side densified region being in contact with an underlying metal film; and a center-side porous region being in contact with the through-hole. The densified region has a porosity of 10% or less in terms of an area ratio at any cross-section.

    Conductive bonding material, bonding member including the conductive bonding material, and bonding method
    5.
    发明授权
    Conductive bonding material, bonding member including the conductive bonding material, and bonding method 有权

    公开(公告)号：US12157170B2

    公开(公告)日：2024-12-03

    申请号：US17796846

    申请日：2020-09-28

    Applicant: TANAKA KIKINZOKU KOGYO K.K.

    Inventor： Toshinori Ogashiwa ,  Kazuo Ueda

    IPC: H01B5/00 ,  B22F1/05 ,  B22F7/06 ,  H01B1/02 ,  H01L21/52

    Abstract: A bonding method in which applied is a prescribed conductive bonding material, which contains a molded article of a metal powder. The metal powder is one or more selected from the group consisting of a gold powder, a silver powder, a platinum powder, and a palladium powder, and has a purity of 99.9% by mass or more, and an average particle size of 0.005 μm to 1.0 μm, and the conductive bonding material has a compressive deformation rate M, represented by the following expression, of 5% or more and 30% or less when compressed with a compression pressure of 5 MPa. [Expression 1] M={(h1−h2)/h1}×100, wherein h1 represents an average thickness of the conductive bonding material before compression, and h2 represents an average thickness of the conductive bonding material after the compression.

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