公开(公告)号：US20080044878A1

公开(公告)日：2008-02-21

申请号：US10505229

申请日：2003-04-08

申请人： Tetsuya Nagaoka ,  Satoru Yokomizo ,  Kenji Miyamoto ,  Fumio Osakada ,  Keiji Matsumoto ,  Masamichi Takagi ,  Akinori Ota

发明人： Tetsuya Nagaoka ,  Satoru Yokomizo ,  Kenji Miyamoto ,  Fumio Osakada ,  Keiji Matsumoto ,  Masamichi Takagi ,  Akinori Ota

IPC分类号： C07H21/04 ,  C12N1/00 ,  C12P1/02

CPC分类号： C07K14/4716 ,  C12N9/1025 ,  C12N15/815

摘要： The present invention provides a production method of a copolymeric polyester which comprises culturing an ACT1 gene promoter shown under SEQ ID NO: 9, a GAP3 gene promoter shown under SEQ ID NO: 10; a PMA1 gene promoter shown under SEQ ID NO: 11, and, a TEF1 gene promoter shown under SEQ ID NO: 12; a plasmid which contains the gene expression unit comprising said promoter; a transformed cell as resulting from transformation of the said plasmid; and said transformed cell.

摘要翻译： 本发明提供共聚聚酯的制造方法，其包括培养SEQ ID NO：9所示的ACT1基因启动子，SEQ ID NO：10所示的GAP3基因启动子; SEQ ID NO：11所示的PMA1基因启动子和SEQ ID NO：12所示的TEF1基因启动子; 含有包含所述启动子的基因表达单元的质粒; 由所述质粒转化产生的转化细胞; 和转化细胞。

公开(公告)号：US20070087421A1

公开(公告)日：2007-04-19

申请号：US10554934

申请日：2004-05-14

申请人： Yuji Okubo ,  Tetsuya Nagaoka ,  Satoru Yokomizo ,  Keiji Matsumoto ,  Masamichi Takagi ,  Akinori Ohta

发明人： Yuji Okubo ,  Tetsuya Nagaoka ,  Satoru Yokomizo ,  Keiji Matsumoto ,  Masamichi Takagi ,  Akinori Ohta

IPC分类号： C12P7/62 ,  C12N9/18 ,  C07H21/04 ,  C12N15/74 ,  C12N1/21

CPC分类号： C12N9/1025 ,  C12P7/625

摘要： A gene expression cassette comprising an Aeromonas caviae-origin polyhydroxyalkanoic acid (PHA) synthase gene having a mutation introduced thereinto and a promoter and a terminator acting in a yeast; a transformant constructed by transferring the above gene expression cassette into a yeast; and a process for producing a polyester using the above transformant. Thus, it becomes possible to efficiently produce a copolymerized polyester having a high biodegradability and excellent properties by copolymerizing 3-hydroxyalkanoic acids in a yeast.

摘要翻译： 一种基因表达盒，其包含导入其中的突变的气单胞菌来源的聚羟基链烷酸（PHA）合酶基因和启动子和在酵母中起作用的终止子; 通过将上述基因表达盒转移到酵母中构建的转化体; 以及使用上述转化体生产聚酯的方法。 因此，通过在酵母中共聚3-羟基链烷酸，能够有效地制造具有高生物降解性和优异性能的共聚聚酯。

公开(公告)号：US5407819A

公开(公告)日：1995-04-18

申请号：US869380

申请日：1992-04-16

申请人： Hitoshi Yahara ,  Tetsuya Nagaoka ,  Kazuyoshi Yajima ,  Yasuhiro Inenaka ,  Keiji Matsumoto ,  Tetsu Kakutani

发明人： Hitoshi Yahara ,  Tetsuya Nagaoka ,  Kazuyoshi Yajima ,  Yasuhiro Inenaka ,  Keiji Matsumoto ,  Tetsu Kakutani

IPC分类号： C12N9/72 ,  C12N15/58 ,  C12N5/00 ,  C12N15/00 ,  A61K37/547

CPC分类号： C12N9/6459 ,  C12Y304/21069

摘要： A TPA variant with replacement of amino acids is provided. In a typical embodiment, the variant has an amino acid sequence with replacement of the amino acid group consisting of asparagine at the 37th position, serine at the 38th position, glycine at the 39th position, arginine at the 40th position, alanine at the 41st position, and glutamine at the 42nd position from the N-terminus of the amino acid sequence of mature human tissue plasminogen activator.

摘要翻译： 提供了具有替换氨基酸的TPA变体。 在典型的实施方案中，变体具有氨基酸序列，其替换由第37位天冬酰胺，第38位丝氨酸，第39位甘氨酸，第40位精氨酸，第41位丙氨酸组成的氨基酸组 ，和谷氨酰胺在成熟的人组织纤溶酶原激活物的氨基酸序列的N末端的第42位。

公开(公告)号：US20060160195A1

公开(公告)日：2006-07-20

申请号：US10543385

申请日：2004-02-20

申请人： Emi Ono ,  Yuji Okubo ,  Tetsuya Nagaoka ,  Yoshiharu Doi

发明人： Emi Ono ,  Yuji Okubo ,  Tetsuya Nagaoka ,  Yoshiharu Doi

IPC分类号： C12P7/62 ,  C12N15/74 ,  C12N1/21

CPC分类号： C12N9/93 ,  C12N9/88 ,  C12P7/625

摘要： It is intended to provide a process for industrially safely and/or economically and efficiently producing a polyester by using gene manipulation techniques. A vector applicable to hosts over a wide range which is characterized by having improved industrial safety; a polyester synthase-expressing plasmid wherein at least a polyester synthase gene is transferred into said vector; a transformant capable of synthesizing a polyester which contains the plasmid; and a process for producing a polyester with the use of the plasmid or the transformant.

摘要翻译： 旨在通过使用基因操作技术提供工业上安全和/或经济和有效地生产聚酯的方法。 适用于广泛范围的主体的载体，其特征在于具有改善的工业安全性; 表达聚酯合酶的质粒，其中至少将聚酯合酶基因转移到所述载体中; 能够合成含有质粒的聚酯的转化体; 以及使用质粒或转化体生产聚酯的方法。

公开(公告)号：US20050051810A1

公开(公告)日：2005-03-10

申请号：US10968890

申请日：2004-10-21

申请人： Hiroshi Funakura ,  Eiichi Hosomi ,  Yasuhiro Koshio ,  Tetsuya Nagaoka ,  Junya Nagano ,  Mitsuru Oida ,  Masatoshi Fukuda ,  Atsushi Kurosu ,  Kaoru Kawai ,  Osamu Yamagata

发明人： Hiroshi Funakura ,  Eiichi Hosomi ,  Yasuhiro Koshio ,  Tetsuya Nagaoka ,  Junya Nagano ,  Mitsuru Oida ,  Masatoshi Fukuda ,  Atsushi Kurosu ,  Kaoru Kawai ,  Osamu Yamagata

IPC分类号： H01L23/29 ,  H01L21/56 ,  H01L23/12 ,  H01L23/28 ,  H01L23/31 ,  H01L23/498 ,  H01L29/768

CPC分类号： H01L23/49894 ,  H01L23/3121 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package has (a) a package base, (b) package terminals formed on the package base and used to connect the semiconductor package to another device, (c) a wiring layer formed on the package base and electrically connected to the package terminals, (d) a semiconductor chip mounted on the package base and electrically connected to the wiring layer, (e) a low-elasticity resin layer formed between a resin mold and the wiring layer and between the package base and the resin mold, and (f) the resin mold sealing the package base, the wiring layer, the semiconductor chip, and the low-elasticity resin layer.

摘要翻译： 半导体封装具有（a）封装基座，（b）形成在封装基座上并用于将半导体封装连接到另一器件的封装端子，（c）形成在封装基座上并电连接到封装端子的布线层 ，（d）安装在封装基板上并电连接到布线层的半导体芯片，（e）在树脂模具和布线层之间以及封装基底和树脂模具之间形成的低弹性树脂层，和 f）树脂模具密封封装基座，布线层，半导体芯片和低弹性树脂层。

公开(公告)号：US06960494B2

公开(公告)日：2005-11-01

申请号：US10968890

申请日：2004-10-21

申请人： Hiroshi Funakura ,  Eiichi Hosomi ,  Yasuhiro Koshio ,  Tetsuya Nagaoka ,  Junya Nagano ,  Mitsuru Oida ,  Masatoshi Fukuda ,  Atsushi Kurosu ,  Kaoru Kawai ,  Osamu Yamagata

发明人： Hiroshi Funakura ,  Eiichi Hosomi ,  Yasuhiro Koshio ,  Tetsuya Nagaoka ,  Junya Nagano ,  Mitsuru Oida ,  Masatoshi Fukuda ,  Atsushi Kurosu ,  Kaoru Kawai ,  Osamu Yamagata

IPC分类号： H01L23/29 ,  H01L21/56 ,  H01L23/12 ,  H01L23/28 ,  H01L23/31 ,  H01L23/498 ,  H01L21/44

CPC分类号： H01L23/49894 ,  H01L23/3121 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package has (a) a package base, (b) package terminals formed on the package base and used to connect the semiconductor package to another device, (c) a wiring layer formed on the package base and electrically connected to the package terminals, (d) a semiconductor chip mounted on the package base and electrically connected to the wiring layer, (e) a low-elasticity resin layer formed between a resin mold and the wiring layer and between the package base and the resin mold, and (f) the resin mold sealing the package base, the wiring layer, the semiconductor chip, and the low-elasticity resin layer.

公开(公告)号：US06836012B2

公开(公告)日：2004-12-28

申请号：US10108363

申请日：2002-03-29

申请人： Hiroshi Funakura ,  Eiichi Hosomi ,  Yasuhiro Koshio ,  Tetsuya Nagaoka ,  Junya Nagano ,  Mitsuru Oida ,  Masatoshi Fukuda ,  Atsushi Kurosu ,  Kaoru Kawai ,  Osamu Yamagata

发明人： Hiroshi Funakura ,  Eiichi Hosomi ,  Yasuhiro Koshio ,  Tetsuya Nagaoka ,  Junya Nagano ,  Mitsuru Oida ,  Masatoshi Fukuda ,  Atsushi Kurosu ,  Kaoru Kawai ,  Osamu Yamagata

IPC分类号： H01L2314

CPC分类号： H01L23/49894 ,  H01L23/3121 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package has (a) a package base, (b) package terminals formed on the package base and used to connect the semiconductor package to another device, (c) a wiring layer formed on the package base and electrically connected to the package terminals, (d) a semiconductor chip mounted on the package base and electrically connected to the wiring layer, (e) a low-elasticity resin layer formed between a resin mold and the wiring layer and between the package base and the resin mold, and (f) the resin mold sealing the package base, the wiring layer, the semiconductor chip, and the low-elasticity resin layer.

摘要翻译： 半导体封装具有（a）封装基座，（b）形成在封装基座上并用于将半导体封装连接到另一器件的封装端子，（c）形成在封装基座上并电连接到封装端子的布线层 ，（d）安装在封装基板上并电连接到布线层的半导体芯片，（e）在树脂模具和布线层之间以及封装基底和树脂模具之间形成的低弹性树脂层，和 f）树脂模具密封封装基座，布线层，半导体芯片和低弹性树脂层。

公开(公告)号：US5292050A

公开(公告)日：1994-03-08

申请号：US985111

申请日：1992-12-03

申请人： Tetsuya Nagaoka ,  Kazuhiro Yamamori

发明人： Tetsuya Nagaoka ,  Kazuhiro Yamamori

IPC分类号： H01L21/00 ,  H01L21/60 ,  H01L21/603

CPC分类号： H01L24/85 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082

摘要： A wire bonder comprises a pattern recognition mechanism. The pattern recognition mechanism includes a TV camera head, a camera control unit, a program research unit, and a bonder controller. The bonder controller includes a microcomputer, a control circuit, and a servo drive unit. The TV camera head and camera control unit detect locations of a first bonding pad formed on a first semiconductor chip and a second bonding pad formed on a second semiconductor chip. The program research unit calculates amounts of shift of the detected locations of the first and second bonding pads from reference locations thereof. The microcomputer corrects locations of first and second bonding points and those of first and second cutting points in accordance with the calculated amounts of shift. The control circuit and servo drive unit control the first and second bonding points and the first and second cutting points based on the corrected locations.

摘要翻译： 引线接合器包括图案识别机构。 图案识别机构包括电视摄像机头，照相机控制单元，程序研究单元和接合器控制器。 接合器控制器包括微型计算机，控制电路和伺服驱动单元。 电视摄像机头和照相机控制单元检测形成在第一半导体芯片上的第一焊盘的位置和形成在第二半导体芯片上的第二焊盘。 程序研究单元从其参考位置计算第一和第二接合焊盘的检测位置的偏移量。 微型计算机根据计算出的移位量校正第一和第二接合点的位置以及第一和第二切割点的位置。 控制电路和伺服驱动单元基于校正的位置来控制第一和第二接合点以及第一和第二切割点。

公开(公告)号：US5045919A

公开(公告)日：1991-09-03

申请号：US579664

申请日：1990-09-10

申请人： Tetsuya Nagaoka

发明人： Tetsuya Nagaoka

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L23/495

CPC分类号： H01L24/49 ,  H01L23/49541 ,  H01L24/05 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/49171 ,  H01L2224/49179 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/92247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12033

摘要： Bonding pads for deriving out electrodes of semiconductor elements formed on a pellet to the exterior are formed on the pellet. The pellet is mounted on a bed. Inner lead portions of a lead frame are arranged on the surrounding portion of the bed to extend radially away from the bed. A distance between those of the inner lead portions which are disposed in position corresponding to the corner portion of the bed is set larger than a distance between those of the inner lead portions which are disposed in the other position. The bonding pads are electrically connected to the inner lead portions by means of bonding wires. The pellet, bed, inner lead portions and bonding wires are sealed into a plastic package.

摘要翻译： 在颗粒（11）上形成用于将形成在颗粒（11）上的半导体元件的电极导出到外部的接合焊盘（12）。 颗粒（11）安装在床（13）上。 引线框架的内引线部分（14）布置在床（13）的周围部分上以径向远离床（13）延伸。 设置在与床（13）的角部相对应的位置的内引线部（14）之间的距离（DELTA W1）被设定为大于内引线部的距离（DELTA W2） 14）设置在另一位置。 接合焊盘（12）通过接合线（16）与内引线部分（14）电连接。 颗粒（11），床（13），内引线部分（14）和接合线（16）被密封成塑料封装。