公开(公告)号：US20090261362A1

公开(公告)日：2009-10-22

申请号：US12496271

申请日：2009-07-01

申请人： Tetsuzo UEDA ,  Tsunenobu Kimoto ,  Hiroyuki Matsunami ,  Jun Suda ,  Norio Onojima

发明人： Tetsuzo UEDA ,  Tsunenobu Kimoto ,  Hiroyuki Matsunami ,  Jun Suda ,  Norio Onojima

IPC分类号： H01L33/00

CPC分类号： H01L21/02082 ,  H01L21/02378 ,  H01L21/02433 ,  H01L21/02458 ,  H01L21/0254 ,  H01L21/0262 ,  H01L21/02639 ,  H01L21/0265 ,  H01L33/18 ,  H01L33/32

摘要： 4H—InGaAlN alloy based optoelectronic and electronic devices on non-polar face are formed on 4H—AlN or 4H—AlGaN on (11-20) a-face 4H—SiC substrates. Typically, non polar 4H—AlN is grown on 4H—SiC (11-20) by molecular beam epitaxy (MBE). Subsequently, III-V nitride device layers are grown by metal organic chemical vapor deposition (MOCVD) with 4H-polytype for all of the layers. The non-polar device does not contain any built-in electric field due to the spontaneous and piezoelectric polarization. The optoelectronic devices on the non-polar face exhibits higher emission efficiency with shorter emission wavelength because the electrons and holes are not spatially separated in the quantum well. Vertical device configuration for lasers and light emitting diodes (LEDs) using conductive 4H—AlGaN interlayer on conductive 4H—SiC substrates makes the chip size and series resistance smaller. The elimination of such electric field also improves the performance of high speed and high power transistors. The details of the epitaxial growth s and the processing procedures for the non-polar III-V nitride devices on the non-polar SiC substrates are also disclosed.

摘要翻译： 在（11-20）a面4H-SiC衬底上的4H-AlN或4H-AlGaN上形成4H-InGaAlN合金基非极性面上的光电子和电子器件。 通常，非极性4H-AlN通过分子束外延（MBE）在4H-SiC（11-20）上生长。 随后，通过用于所有层的4H-多型金属有机化学气相沉积（MOCVD）生长III-V族氮化物器件层。 由于自发和压电极化，非极性器件不包含任何内置的电场。 由于电子和空穴在量子阱中没有空间分离，非极性面上的光电器件表现出较短的发射波长的发射效率。 在导电4H-SiC衬底上使用导电4H-AlGaN夹层的激光器和发光二极管（LED）的垂直器件配置使芯片尺寸和串联电阻更小。 这种电场的消除也提高了高速和高功率晶体管的性能。 还公开了非极性SiC衬底上的非极性III-V族氮化物器件的外延生长细节和处理步骤。

公开(公告)号：US20050218414A1

公开(公告)日：2005-10-06

申请号：US10812416

申请日：2004-03-30

申请人： Tetsuzo Ueda ,  Tsunenobu Kimoto ,  Hiroyuki Matsunami ,  Jun Suda ,  Norio Onojima

发明人： Tetsuzo Ueda ,  Tsunenobu Kimoto ,  Hiroyuki Matsunami ,  Jun Suda ,  Norio Onojima

IPC分类号： H01L29/26 ,  H01L21/02 ,  H01L21/20 ,  H01L21/338 ,  H01L29/778 ,  H01L29/812 ,  H01L33/18 ,  H01L33/32 ,  H01S5/323 ,  H01L33/00

CPC分类号： H01L21/02082 ,  H01L21/02378 ,  H01L21/02433 ,  H01L21/02458 ,  H01L21/0254 ,  H01L21/0262 ,  H01L21/02639 ,  H01L21/0265 ,  H01L33/18 ,  H01L33/32

摘要： 4H-InGaAlN alloy based optoelectronic and electronic devices on non-polar face are formed on 4H-AlN or 4H-AlGaN on (11-20) a-face 4H-SiC substrates. Typically, non polar 4H-AlN is grown on 4H-SiC (11-20) by molecular beam epitaxy (MBE). Subsequently, III-V nitride device layers are grown by metal organic chemical vapor deposition (MOCVD) with 4H-polytype for all of the layers. The non-polar device does not contain any built-in electric field due to the spontaneous and piezoelectric polarization. The optoelectonic devices on the non-polar face exhibits higher emission efficiency with shorter emission wavelength because the electrons and holes are not spatially separated in the quantum well. Vertical device configuration for lasers and light emitting diodes(LEDs) using conductive 4H-AlGaN interlayer on conductive 4H-SiC substrates makes the chip size and series resistance smaller. The elimination of such electric field also improves the performance of high speed and high power transistors. The details of the epitaxial growth s and the processing procedures for the non-polar III-V nitride devices on the non-polar SiC substrates are also disclosed.

摘要翻译： 在（11-20）a面4H-SiC衬底上的4H-AlN或4H-AlGaN上形成4H-InGaAlN合金基非极性面上的光电子和电子器件。 通常，非极性4H-AlN通过分子束外延（MBE）在4H-SiC（11-20）上生长。 随后，通过用于所有层的4H-多型金属有机化学气相沉积（MOCVD）生长III-V族氮化物器件层。 由于自发和压电极化，非极性器件不包含任何内置的电场。 由于电子和空穴在量子阱中空间不分开，非极性面上的光电子器件表现出更高的发射效率，发射波长更短。 在导电4H-SiC衬底上使用导电4H-AlGaN夹层的激光器和发光二极管（LED）的垂直器件配置使芯片尺寸和串联电阻更小。 这种电场的消除也提高了高速和高功率晶体管的性能。 还公开了非极性SiC衬底上的非极性III-V族氮化物器件的外延生长细节和处理步骤。

公开(公告)号：US07625447B2

公开(公告)日：2009-12-01

申请号：US10549683

申请日：2004-03-18

申请人： Jun Suda ,  Hiroyuki Matsunami ,  Norio Onojima

发明人： Jun Suda ,  Hiroyuki Matsunami ,  Norio Onojima

IPC分类号： C30B23/00

CPC分类号： C30B29/406 ,  C30B23/002 ,  C30B29/403 ,  H01L21/02378 ,  H01L21/02458 ,  H01L21/0254 ,  H01L21/02631 ,  H01L21/02658 ,  H01L21/02661

摘要： SiC is a very stable substance, and it is difficult to control the condition of a SiC surface to be suitable for crystal growth in conventional Group III nitride crystal growing apparatuses. This problem is solved as follows. The surface of a SiC substrate 1 is rendered into a step-terrace structure by performing a heating process in an atmosphere of HCl gas. The surface of the SiC substrate 1 is then treated sequentially with aqua regia, hydrochloric acid, and hydrofluoric acid. A small amount of silicon oxide film formed on the surface of the SiC substrate 1 is etched so as to form a clean SiC surface 3 on the substrate surface. The SiC substrate 1 is then installed in a high-vacuum apparatus and the pressure inside is maintained at ultrahigh vacuum (such as 10−6 to 10−8 Pa). In the ultrahigh vacuum state, a process of irradiating the surface with a Ga atomic beam 5 at time t1 at temperature of 800° C. or lower and performing a heating treatment at 800° C. or higher is repeated at least once. The temperature is then set to the growth temperature of an AlN film, and the SiC substrate surface 3 is initially irradiated with Al atoms 8a in ultrahigh vacuum state, followed by the feeding of N atoms 8b.

摘要翻译： SiC是非常稳定的物质，在传统的III族氮化物晶体生长装置中难以控制SiC表面适合于晶体生长的状态。 这个问题解决如下。 通过在HCl气体气氛中进行加热处理，将SiC衬底1的表面制成台阶平台结构。 然后依次用王水，盐酸和氢氟酸处理SiC衬底1的表面。 蚀刻形成在SiC衬底1的表面上的少量氧化硅膜，从而在衬底表面上形成清洁的SiC表面3。 然后将SiC基板1安装在高真空装置中，并且内部的压力保持在超高真空（例如10-6至10-8Pa）。 在超高真空状态下，在800℃以下的温度下在时刻t1的Ga原子束5照射表面，进行800℃以上的加热处理的工序至少重复一次。 然后将温度设定为AlN膜的生长温度，并且首先用超高真空状态的Al原子8a照射SiC衬底表面3，然后馈送N原子8b。

公开(公告)号：US20060180077A1

公开(公告)日：2006-08-17

申请号：US10549683

申请日：2004-03-18

申请人： Jun Suda ,  Hiroyuki Matsunami ,  Norio Onojima

发明人： Jun Suda ,  Hiroyuki Matsunami ,  Norio Onojima

IPC分类号： C30B23/00 ,  C30B25/00 ,  C30B28/12 ,  C30B28/14

CPC分类号： C30B29/406 ,  C30B23/002 ,  C30B29/403 ,  H01L21/02378 ,  H01L21/02458 ,  H01L21/0254 ,  H01L21/02631 ,  H01L21/02658 ,  H01L21/02661

摘要： SiC is a very stable substance, and it is difficult to control the condition of a SiC surface to be suitable for crystal growth in conventional Group III nitride crystal growing apparatuses. This problem is solved as follows. The surface of a SiC substrate 1 is rendered into a step-terrace structure by performing a heating process in an atmosphere of HCl gas. The surface of the SiC substrate 1 is then treated sequentially with aqua regia, hydrochloric acid, and hydrofluoric acid. A small amount of silicon oxide film formed on the surface of the SiC substrate 1 is etched so as to form a clean SiC surface 3 on the substrate surface. The SiC substrate 1 is then installed in a high-vacuum apparatus and the pressure inside is maintained at ultrahigh vacuum (such as 10−6 to 10−8 Pa). In the ultrahigh vacuum state, a process of irradiating the surface with a Ga atomic beam 5 at time t1 at temperature of 800° C. or lower and performing a heating treatment at 800° C. or higher is repeated at least once. The temperature is then set to the growth temperature of an AlN film, and the SiC substrate surface 3 is initially irradiated with —Al atoms 8a in ultrahigh vacuum state, followed by the feeding of N atoms 8b.

摘要翻译： SiC是非常稳定的物质，在传统的III族氮化物晶体生长装置中难以控制SiC表面适合于晶体生长的状态。 这个问题解决如下。 通过在HCl气体气氛中进行加热处理，将SiC衬底1的表面制成台阶平台结构。 然后依次用王水，盐酸和氢氟酸处理SiC衬底1的表面。 蚀刻形成在SiC衬底1的表面上的少量氧化硅膜，从而在衬底表面上形成清洁的SiC表面3。 然后将SiC基板1安装在高真空装置中，并且内部的压力保持在超高真空（例如10 -6至10 -8 Pa）。 在超高真空状态下，在800℃以下的温度下，在时刻t 1的Ga原子束5照射表面，进行800℃以上的加热处理，至少重复一次。 然后将温度设定为AlN膜的生长温度，并且首先用超高真空状态的-Al原子8a照射SiC衬底表面3，然后馈送N原子8b。

公开(公告)号：US20080277696A1

公开(公告)日：2008-11-13

申请号：US12179320

申请日：2008-07-24

申请人： Kazuhiro Fujikawa ,  Shin Harada ,  Kenichi Hirotsu ,  Satoshi Hatsukawa ,  Takashi Hoshino ,  Hiroyuki Matsunami ,  Tsunenobu Kimoto

发明人： Kazuhiro Fujikawa ,  Shin Harada ,  Kenichi Hirotsu ,  Satoshi Hatsukawa ,  Takashi Hoshino ,  Hiroyuki Matsunami ,  Tsunenobu Kimoto

IPC分类号： H01L29/808

CPC分类号： H01L29/0634 ,  H01L29/1058 ,  H01L29/1066 ,  H01L29/42316 ,  H01L29/66893 ,  H01L29/808

摘要： A lateral junction field effect transistor includes a first gate electrode layer arranged in a third semiconductor layer between source/drain region layers, having a lower surface extending on the second semiconductor layer, and doped with p-type impurities more heavily than the second semiconductor layer, and a second gate electrode layer arranged in a fifth semiconductor layer between the source/drain region layers, having a lower surface extending on a fourth semiconductor layer, having substantially the same concentration of p-type impurities as the first gate electrode layer, and having the same potential as the first gate electrode layer. Thereby, the lateral junction field effect transistor has a structure, which can reduce an on-resistance while maintaining good breakdown voltage properties.

摘要翻译： 横向结型场效应晶体管包括布置在源/漏区域之间的第三半导体层中的第一栅电极层，具有在第二半导体层上延伸的下表面，并且掺杂有比第二半导体层更重的p型杂质 以及布置在源极/漏极区域之间的第五半导体层中的第二栅极电极层，具有在第四半导体层上延伸的下表面，具有与第一栅极电极层基本相同的p型杂质浓度，以及 具有与第一栅极电极层相同的电位。 因此，横向结型场效应晶体管具有可以在保持良好的击穿电压特性的同时降低导通电阻的结构。

公开(公告)号：US20050233539A1

公开(公告)日：2005-10-20

申请号：US11105587

申请日：2005-04-14

申请人： Yuuichi Takeuchi ,  Rajesh Malhan ,  Hiroyuki Matsunami ,  Tsunenobu Kimoto

发明人： Yuuichi Takeuchi ,  Rajesh Malhan ,  Hiroyuki Matsunami ,  Tsunenobu Kimoto

IPC分类号： C30B23/02 ,  H01L21/04 ,  H01L21/306 ,  H01L21/337 ,  H01L21/76 ,  H01L29/04 ,  H01L29/24 ,  H01L29/78 ,  H01L29/808

CPC分类号： H01L29/045 ,  H01L29/66068 ,  H01L29/7828 ,  H01L29/8083

摘要： A method for manufacturing a silicon carbide semiconductor device includes the steps of: forming a trench mask on an upper surface of a semiconductor substrate; forming the trench such that the trench having an aspect ratio equal to or larger than 2 and having a trench slanting angle equal to or larger than 80 degrees is formed; and removing a damage portion in such a manner that the damage portion disposed on an inner surface of the trench formed in the semiconductor substrate in the step of forming the trench is etched and removed in hydrogen atmosphere under decompression pressure at a temperature equal to or higher than 1600° C.

摘要翻译： 一种制造碳化硅半导体器件的方法包括以下步骤：在半导体衬底的上表面上形成沟槽掩模; 形成沟槽，使得形成具有等于或大于2并且具有等于或大于80度的沟槽倾斜角的纵横比的沟槽; 并且以这样的方式去除损伤部分，即在形成沟槽的步骤中形成在半导体衬底的沟槽的内表面上的损伤部分在氢气气氛中在等于或等于更高的温度的减压下被蚀刻和去除 比1600℃

公开(公告)号：US06870189B1

公开(公告)日：2005-03-22

申请号：US10168265

申请日：2000-09-11

申请人： Shin Harada ,  Kenichi Hirotsu ,  Hiroyuki Matsunami ,  Tsunenobu Kimoto

发明人： Shin Harada ,  Kenichi Hirotsu ,  Hiroyuki Matsunami ,  Tsunenobu Kimoto

IPC分类号： H01L21/337 ,  H01L29/24 ,  H01L29/772 ,  H01L29/808 ,  H01L31/0312 ,  H01L29/80 ,  H01L31/112

CPC分类号： H01L29/0843 ,  H01L29/1058 ,  H01L29/1066 ,  H01L29/1608 ,  H01L29/66901 ,  H01L29/66909 ,  H01L29/7722 ,  H01L29/808 ,  H01L29/8083

摘要： A junction field effect transistor (JFET) is provided that is capable of a high voltage resistance, high current switching operation, that operates with a low loss, and that has little variation. This JFET is provided with a gate region (2) of a second conductivity type provided on a surface of a semiconductor substrate, a source region (1) of a first conductivity type, a channel region (10) of the first conductivity type that adjoins the source region, a confining region (5) of the second conductivity type that adjoins the gate region and confines the channel region, a drain region (3) of the first conductivity type provided on a reverse face, and a drift region (4) of the first conductivity type that continuously lies in a direction of thickness of the substrate from a channel to a drain. A concentration of an impurity of the first conductivity type in the drift region and the channel region is lower than a concentration of an impurity of the first conductivity type in the source region and the drain region and a concentration of an impurity of the second conductivity type in the confining region.

摘要翻译： 提供了一种结型场效应晶体管（JFET），其具有能够以低损耗工作并且几乎没有变化的高电压电阻，高电流切换操作。 该JFET设置有设置在半导体衬底的表面上的第二导电类型的栅极区域（2），第一导电类型的源极区域（1），第一导电类型的沟道区域（10） 源极区域，邻接栅极区域并限制沟道区域的第二导电类型的约束区域（5），设置在反面上的第一导电类型的漏极区域（3）和漂移区域（4） 的第一导电类型，其连续地位于从通道到漏极的衬底的厚度方向上。 漂移区域和沟道区域中的第一导电类型的杂质的浓度低于源极区域和漏极区域中的第一导电类型的杂质浓度和第二导电类型的杂质浓度 在限制区域。

公开(公告)号：US06660084B1

公开(公告)日：2003-12-09

申请号：US10069503

申请日：2002-02-27

申请人： Hiromu Shiomi ,  Tsunenobu Kimoto ,  Hiroyuki Matsunami

发明人： Hiromu Shiomi ,  Tsunenobu Kimoto ,  Hiroyuki Matsunami

IPC分类号： C30B2502

CPC分类号： C30B23/00 ,  C30B23/02 ,  C30B29/36

摘要： A method of growing a 4H-poly type SiC single crystal 40, characterized in that the 4H-poly type SiC single crystal 40 is grown on a seed crystal 30 comprised of an SiC single crystal where a {03-38} plane 30u or a plane which is inclined at off angle &agr;, within about 10°, with respect to the {03-38} plane, is exposed.

摘要翻译： 一种生长4H-多晶型SiC单晶40的方法，其特征在于，4H-多晶型SiC单晶40在由SiC单晶构成的晶种30上生长，其中{03-38}面30u或 相对于{03-38}平面倾斜偏角α在约10°内的平面被暴露。

公开(公告)号：US07671388B2

公开(公告)日：2010-03-02

申请号：US12552212

申请日：2009-09-01

申请人： Kazuhiro Fujikawa ,  Shin Harada ,  Kenichi Hirotsu ,  Satoshi Hatsukawa ,  Takashi Hoshino ,  Hiroyuki Matsunami ,  Tsunenobu Kimoto

发明人： Kazuhiro Fujikawa ,  Shin Harada ,  Kenichi Hirotsu ,  Satoshi Hatsukawa ,  Takashi Hoshino ,  Hiroyuki Matsunami ,  Tsunenobu Kimoto

IPC分类号： H01L29/78

CPC分类号： H01L29/0634 ,  H01L29/1058 ,  H01L29/1066 ,  H01L29/42316 ,  H01L29/66893 ,  H01L29/808

摘要： A lateral junction field effect transistor includes a first gate electrode layer arranged in a third semiconductor layer between source/drain region layers, having a lower surface extending on the second semiconductor layer, and doped with p-type impurities more heavily than the second semiconductor layer, and a second gate electrode layer arranged in a fifth semiconductor layer between the source/drain region layers, having a lower surface extending on a fourth semiconductor layer, having substantially the same concentration of p-type impurities as the first gate electrode layer, and having the same potential as the first gate electrode layer. Thereby, the lateral junction field effect transistor has a structure, which can reduce an on-resistance while maintaining good breakdown voltage properties.

公开(公告)号：US07420232B2

公开(公告)日：2008-09-02

申请号：US11402701

申请日：2006-04-11

申请人： Kazuhiro Fujikawa ,  Shin Harada ,  Kenichi Hirotsu ,  Satoshi Hatsukawa ,  Takashi Hoshino ,  Hiroyuki Matsunami ,  Tsunenobu Kimoto

发明人： Kazuhiro Fujikawa ,  Shin Harada ,  Kenichi Hirotsu ,  Satoshi Hatsukawa ,  Takashi Hoshino ,  Hiroyuki Matsunami ,  Tsunenobu Kimoto

IPC分类号： H01L29/80 ,  H01L31/112

CPC分类号： H01L29/0634 ,  H01L29/1058 ,  H01L29/1066 ,  H01L29/42316 ,  H01L29/66893 ,  H01L29/808

摘要： A lateral junction field effect transistor includes a first gate electrode layer arranged in a third semiconductor layer between source/drain region layers, having a lower surface extending on the second semiconductor layer, and doped with p-type impurities more heavily than the second semiconductor layer, and a second gate electrode layer arranged in a fifth semiconductor layer between the source/drain region layers, having a lower surface extending on a fourth semiconductor layer, having substantially the same concentration of p-type impurities as the first gate electrode layer, and having the same potential as the first gate electrode layer. Thereby, the lateral junction field effect transistor has a structure, which can reduce an on-resistance while maintaining good breakdown voltage properties.

摘要翻译： 横向结型场效应晶体管包括布置在源/漏区域之间的第三半导体层中的第一栅电极层，具有在第二半导体层上延伸的下表面，并且掺杂有比第二半导体层更重的p型杂质 以及布置在源极/漏极区域之间的第五半导体层中的第二栅极电极层，具有在第四半导体层上延伸的下表面，具有与第一栅极电极层基本相同的p型杂质浓度，以及 具有与第一栅极电极层相同的电位。 因此，横向结型场效应晶体管具有可以在保持良好的击穿电压特性的同时降低导通电阻的结构。