公开(公告)号：US07259046B2

公开(公告)日：2007-08-21

申请号：US11075421

申请日：2005-03-09

申请人： Hideo Aoki ,  Yoshiaki Sugizaki ,  Naoko Yamaguchi ,  Chiaki Takubo

发明人： Hideo Aoki ,  Yoshiaki Sugizaki ,  Naoko Yamaguchi ,  Chiaki Takubo

IPC分类号： H01L21/00

CPC分类号： H01L23/49883 ,  H01L21/4867 ,  H01L21/563 ,  H01L22/14 ,  H01L22/20 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/98 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/1134 ,  H01L2224/1146 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/14135 ,  H01L2224/14156 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/81026 ,  H01L2224/81097 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/818 ,  H01L2224/83886 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/05599

摘要： According to one aspect of the present invention, a semiconductor device, comprising a wiring board provided with wires and electrodes; a semiconductor element which is mounted on the wiring board and has plural connection electrodes formed on its surface; and a metal layer of fine metal particles aggregated and bonded which is interposed between the electrodes on the wiring board and the connection electrodes of the semiconductor element to connect between the electrodes and the connection electrodes, is provided.

摘要翻译： 根据本发明的一个方面，提供了一种半导体器件，包括：布线板，其配有导线和电极; 半导体元件，其安装在所述布线板上，并且在其表面上形成有多个连接电极; 并且设置介于导线板上的电极和半导体元件的连接电极之间聚集和结合的金属微粒金属层，以连接电极和连接电极。

公开(公告)号：US20050199989A1

公开(公告)日：2005-09-15

申请号：US11075421

申请日：2005-03-09

申请人： Hideo Aoki ,  Yoshiaki Sugizaki ,  Naoko Yamaguchi ,  Chiaki Takubo

发明人： Hideo Aoki ,  Yoshiaki Sugizaki ,  Naoko Yamaguchi ,  Chiaki Takubo

IPC分类号： H01L23/12 ,  H01L21/60 ,  H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L25/00

CPC分类号： H01L23/49883 ,  H01L21/4867 ,  H01L21/563 ,  H01L22/14 ,  H01L22/20 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/98 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/1134 ,  H01L2224/1146 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/14135 ,  H01L2224/14156 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/81026 ,  H01L2224/81097 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/818 ,  H01L2224/83886 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/05599

摘要： According to one aspect of the present invention, a semiconductor device, comprising a wiring board provided with wires and electrodes; a semiconductor element which is mounted on the wiring board and has plural connection electrodes formed on its surface; and a metal layer of fine metal particles aggregated and bonded which is interposed between the electrodes on the wiring board and the connection electrodes of the semiconductor element to connect between the electrodes and the connection electrodes, is provided.

摘要翻译： 根据本发明的一个方面，提供了一种半导体器件，包括：布线板，其配有导线和电极; 半导体元件，其安装在所述布线板上，并且在其表面上形成有多个连接电极; 并且设置介于导线板上的电极和半导体元件的连接电极之间聚集和结合的金属微粒金属层，以连接电极和连接电极。

公开(公告)号：US07312621B2

公开(公告)日：2007-12-25

申请号：US10401871

申请日：2003-03-31

申请人： Naoko Yamaguchi ,  Yoshiaki Sugizaki ,  Hideo Aoki ,  Toshiro Hiraoka ,  Yasuyuki Hotta ,  Shigeru Matake ,  Misa Sawanobori

发明人： Naoko Yamaguchi ,  Yoshiaki Sugizaki ,  Hideo Aoki ,  Toshiro Hiraoka ,  Yasuyuki Hotta ,  Shigeru Matake ,  Misa Sawanobori

IPC分类号： G01R31/02

CPC分类号： G01R31/2886 ,  G01R31/2863

摘要： A semiconductor test unit comprises a test circuit for inputting/outputting a test signal to/from an examined electronic product, a test signal wiring electrically connected to the test circuit, a contact board electrically connected to an electrode of the examined electronic product and provided with an electrically conductive via to which the test signal is transmitted, a multilayer circuit board electrically connected to the conductive via and the test signal wiring, located under the bottom face of the contact board, and provided with at least one through-hole, and a vacuum attachment mechanism for attaching thereto and holding the examined electronic product, the contact board, and the multilayer circuit board by vacuum. The contact board is made of an insulative material, has top and bottom faces, and is provided with at least one through-hole.

摘要翻译： 半导体测试单元包括用于向被检查的电子产品输入/输出测试信号的测试电路，电连接到测试电路的测试信号布线，与所检查的电子产品的电极电连接并提供 测试信号传输到的导电通孔，与导电通孔电连接的多层电路板和位于接触板底面下方的测试信号布线，并具有至少一个通孔，以及 用于附接到其上的真空附着机构，并通过真空保持所检查的电子产品，接触板和多层电路板。 接触板由绝缘材料制成，具有顶面和底面，并且设置有至少一个通孔。

公开(公告)号：US09153746B2

公开(公告)日：2015-10-06

申请号：US13601568

申请日：2012-08-31

申请人： Akihiro Kojima ,  Yosuke Akimoto ,  Hideyuki Tomizawa ,  Hideko Mukaida ,  Miyoko Shimada ,  Yoshiaki Sugizaki ,  Hideto Furuyama

发明人： Akihiro Kojima ,  Yosuke Akimoto ,  Hideyuki Tomizawa ,  Hideko Mukaida ,  Miyoko Shimada ,  Yoshiaki Sugizaki ,  Hideto Furuyama

IPC分类号： H01L33/52 ,  H01L33/00 ,  H01L33/38 ,  H01L21/50

CPC分类号： H01L33/486 ,  H01L33/387 ,  H01L33/62

摘要： According to an embodiment, a semiconductor light emitting device includes a semiconductor layer having a light emitting layer. The device also includes a p-side electrode provided on a first region including the light emitting layer; an n-side electrode provided on a second region layer not including the light emitting layer; and a first insulating film having a first opening communicating with the p-side electrode and a second opening communicating with the n-side electrode. A p-side interconnection is provided on the first insulating film and electrically connected to the p-side electrode through the first opening. An n-side interconnection is provided on the first insulating film and electrically connected to the n-side electrode through the second opening. The p-side interconnection has a plurality of protrusive parts protruding toward the n-side interconnection, and the n-side interconnection has a plurality of portions extending between the protrusive parts of the p-side interconnection.

摘要翻译： 根据实施例，半导体发光器件包括具有发光层的半导体层。 该装置还包括设置在包括发光层的第一区域上的p侧电极; 设置在不包括发光层的第二区域层上的n侧电极; 以及具有与p侧电极连通的第一开口的第一绝缘膜和与n侧电极连通的第二开口。 p侧互连设置在第一绝缘膜上，并通过第一开口与p侧电极电连接。 n侧互连设置在第一绝缘膜上，并通过第二开口与n侧电极电连接。 p侧互连具有向n侧互连突出的多个突出部，并且n侧互连具有在p侧互连的突出部之间延伸的多个部分。

公开(公告)号：US09099619B2

公开(公告)日：2015-08-04

申请号：US13419684

申请日：2012-03-14

申请人： Hiroshi Koizumi ,  Naoaki Sakurai ,  Yoshiaki Sugizaki ,  Yasuhide Okada ,  Tomomichi Naka ,  Masahiro Uekita ,  Akihiro Kojima ,  Yosuke Akimoto

发明人： Hiroshi Koizumi ,  Naoaki Sakurai ,  Yoshiaki Sugizaki ,  Yasuhide Okada ,  Tomomichi Naka ,  Masahiro Uekita ,  Akihiro Kojima ,  Yosuke Akimoto

IPC分类号： H01L29/20 ,  H01L21/00 ,  H01L33/50 ,  H01L33/00

CPC分类号： H01L33/508 ,  H01L33/0079 ,  H01L33/504 ,  H01L33/505 ,  H01L2933/0016 ,  H01L2933/0041

摘要： According to one embodiment, a semiconductor light emitting device includes a light emitting section and a wavelength conversion section. The light emitting section is configured to emit light. The wavelength conversion section is provided on one major surface side of the light emitting section. The wavelength conversion section contains a phosphor. The wavelength conversion section has a distribution of amount of the phosphor based on a distribution of wavelength of the light emitted from the light emitting section.

摘要翻译： 根据一个实施例，半导体发光器件包括发光部分和波长转换部分。 发光部被配置为发光。 波长转换部设置在发光部的一个主表面侧。 波长转换部分包含磷光体。 波长转换部分具有基于从发光部分发射的光的波长分布的荧光体的量的分布。

公开(公告)号：US08913287B2

公开(公告)日：2014-12-16

申请号：US13315732

申请日：2011-12-09

申请人： Ken Iguchi ,  Hiroyuki Tsuchihashi ,  Isao Yahata ,  Takahiro Kawaguchi ,  Hiroyuki Taguchi ,  Hiroyuki Taki ,  Yoshiaki Sugizaki ,  Kikuo Mizutani ,  Chiaki Iizuka ,  Hidetoshi Yokochi

发明人： Ken Iguchi ,  Hiroyuki Tsuchihashi ,  Isao Yahata ,  Takahiro Kawaguchi ,  Hiroyuki Taguchi ,  Hiroyuki Taki ,  Yoshiaki Sugizaki ,  Kikuo Mizutani ,  Chiaki Iizuka ,  Hidetoshi Yokochi

IPC分类号： H04N1/60 ,  H04N1/46 ,  G06K9/00 ,  B41J2/32

CPC分类号： B41J2/32

摘要： A color erasing apparatus includes a conveyance member to convey a sheet on which an image is formed of a color erasable coloring material, a color erasing part to erase a color of the coloring material of the image formed on the sheet conveyed by the conveyance member, a control part that counts the processed number of sheets images of which are color-erased by the color erasing part and determines whether the processed number of sheets exceeds a previously set threshold, and a notification interface to output a signal for notifying that, cleaning of the color erasing part is required if the processed number of sheets exceeds the threshold.

摘要翻译： 彩色消除装置包括：传送构件，用于输送由彩色可擦除着色材料形成图像的片材;消色部分，用于擦除形成在由传送部件传送的片材上的图像的着色材料的颜色; 对通过彩色消除部分进行彩色擦除的经处理的纸张数量进行计数的控制部分，并且确定处理的纸张数量是否超过预先设定的阈值;以及通知接口，用于输出用于通知清洁 如果处理的纸张数超过阈值，则需要彩色擦除部分。

公开(公告)号：US08846521B2

公开(公告)日：2014-09-30

申请号：US12238679

申请日：2008-09-26

申请人： Yoshiaki Sugizaki

发明人： Yoshiaki Sugizaki

IPC分类号： B81B7/00 ,  H01L23/00 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31

CPC分类号： H01L21/561 ,  B81B7/007 ,  B81B2207/098 ,  H01L23/3114 ,  H01L23/49811 ,  H01L24/18 ,  H01L24/19 ,  H01L24/73 ,  H01L24/82 ,  H01L2224/02319 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/06568 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012

摘要： A manufacturing method of an electronic component package, includes: forming electrode pads on a main surface of a first electronic component; forming first bonding wires shaped in loop so as to be electrically connected with the electrode pads and elongated upward from the electrode pads and such that both ends of the first bonding wires are on the electrode pad, respectively; forming a resin layer over the main surface of the first electronic component so as to embed the first bonding wires; removing the resin layer so as to expose ends of the first bonding wires from the resin layer and removing the end of each of the first bonding wires so that two wires are elongated from on each of the electrode pads; and forming a metallic layer on the surface of the resin layer after removing so that the first bonding wires are electrically connected with the metallic layer.

摘要翻译： 一种电子部件封装的制造方法，包括：在第一电子部件的主面上形成电极焊盘; 形成环形成的第一接合线，以便与电极焊盘电连接并从电极焊盘向上延伸，并且使得第一接合线的两端分别在电极焊盘上; 在第一电子部件的主表面上形成树脂层，以嵌入第一接合线; 去除所述树脂层，以使所述第一接合线的端部从所述树脂层露出，并且移除所述第一接合线中的每一个的末端，使得两条导线从每个所述电极焊盘上伸长; 并且在除去之后在树脂层的表面上形成金属层，使得第一接合线与金属层电连接。

公开(公告)号：US08733757B2

公开(公告)日：2014-05-27

申请号：US13529773

申请日：2012-06-21

申请人： Toshiaki Oshiro ,  Isao Yahata ,  Takahiro Kawaguchi ,  Yoshiaki Sugizaki ,  Kikuo Mizutani ,  Hiroyuki Taki ,  Hiroyuki Tsuchihashi ,  Chiaki Iizuka ,  Hidetoshi Yokochi ,  Ken Iguchi ,  Hiroyuki Hazu ,  Yoichi Yamaguchi ,  Hiroyuki Sugiyama ,  Yuichi Saito

发明人： Toshiaki Oshiro ,  Isao Yahata ,  Takahiro Kawaguchi ,  Yoshiaki Sugizaki ,  Kikuo Mizutani ,  Hiroyuki Taki ,  Hiroyuki Tsuchihashi ,  Chiaki Iizuka ,  Hidetoshi Yokochi ,  Ken Iguchi ,  Hiroyuki Hazu ,  Yoichi Yamaguchi ,  Hiroyuki Sugiyama ,  Yuichi Saito

IPC分类号： B65H7/02 ,  B65H33/04

CPC分类号： G03G21/00 ,  B65H2220/09 ,  B65H2402/31 ,  B65H2402/441 ,  B65H2601/11

摘要： A sheet processing apparatus includes: a conveying member configured to convey a sheet; a first opening section including a conveyance guide section arranged on the opposite side of the conveying member across a conveying path and configured to form the conveying path and a first pivot shaft configured to pivotably support the conveyance guide section, the first opening section being configured to form the conveying path using the conveyance guide section if changing to a closed state and open the conveying path if changing to an open state; and a second opening section including a cover section configured to cover the first opening section if the first opening section changes to the closed state and a second pivot shaft configured to pivotably support the cover section, the second opening section being configured to cause, if pivoting, the first opening section to pivot following the second opening section.

摘要翻译： 一种片材处理设备包括：输送构件，用于输送片材; 第一开口部分，包括输送引导部分，该输送引导部分布置在输送部件的相对侧上并且构造成形成输送路径，第一枢轴构造成可枢转地支撑输送引导部，第一开口部被配置为 如果改变为关闭状态，则使用输送引导部形成传送路径，如果改变为打开状态则打开输送路径; 以及第二开口部分，包括盖部分，其被构造成如果第一开口部分变为闭合状态则覆盖第一开口部分;以及第二枢转轴构造成可枢转地支撑盖部分，第二开口部分被构造成如果枢转 ，所述第一开口部分在所述第二开口部分之后枢转。

公开(公告)号：US08670011B2

公开(公告)日：2014-03-11

申请号：US13484187

申请日：2012-05-30

申请人： Kikuo Mizutani ,  Isao Yahata ,  Takahiro Kawaguchi ,  Yoshiaki Sugizaki ,  Ken Iguchi ,  Hiroyuki Taki ,  Hiroyuki Tsuchihashi ,  Chiaki Iizuka ,  Hidetoshi Yokochi

发明人： Kikuo Mizutani ,  Isao Yahata ,  Takahiro Kawaguchi ,  Yoshiaki Sugizaki ,  Ken Iguchi ,  Hiroyuki Taki ,  Hiroyuki Tsuchihashi ,  Chiaki Iizuka ,  Hidetoshi Yokochi

IPC分类号： B41J29/16

CPC分类号： B41J2/32 ,  B41J2202/37

摘要： In general, according to an embodiment, an erasing section erases the image on the sheet. A first conveying path conveys the sheet fed from a sheet feeding section and is provided with a reading section and a discharge section downstream of the reading section in a sheet conveying direction. A second conveying path is branched from the first conveying path downstream of the reading section in the sheet conveying direction and upstream of the discharge section in the sheet conveying direction. The second conveying path merges with the first conveying path upstream of the reading section in the sheet conveying direction and is provided with the erasing section. A sorting member, which is located at a branch point at which the second conveying path is branched from the first conveying path. A recording section is located on the first conveying path and records count information indicative of an erase count.

摘要翻译： 通常，根据实施例，擦除部分擦除片材上的图像。 第一输送路径传送从供纸部供给的纸张，并且在纸张输送方向上设置有读取部分和读取部分下游的排出部分。 第二输送路径从纸张输送方向上的读取部分下游的第一输送路径和纸张输送方向上在排出部分的上游分支。 第二输送路径在纸张输送方向上与读取部分的上游的第一输送路径合并，并且设置有擦除部。 分选部件，位于第二输送路径从第一输送路径分支的分支点处。 记录部分位于第一传送路径上，并记录指示擦除次数的计数信息。

公开(公告)号：US08614455B2

公开(公告)日：2013-12-24

申请号：US13424687

申请日：2012-03-20

申请人： Susumu Obata ,  Kazuhito Higuchi ,  Hideo Nishiuchi ,  Akiya Kimura ,  Toshiya Nakayama ,  Yoshiaki Sugizaki ,  Akihiro Kojima ,  Yosuke Akimoto

发明人： Susumu Obata ,  Kazuhito Higuchi ,  Hideo Nishiuchi ,  Akiya Kimura ,  Toshiya Nakayama ,  Yoshiaki Sugizaki ,  Akihiro Kojima ,  Yosuke Akimoto

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2924/00

摘要： According to an embodiment, a semiconductor light emitting device includes a stacked body, first and second electrodes, first and second interconnections, first and second pillars and a first insulating layer. The stacked body includes first and second semiconductor layers and a light emitting layer. The first and second electrodes are connected to the first and second semiconductor layers respectively. The first and second interconnections are connected to the first and second electrode respectively. The first and second pillars are connected to the first and second interconnections respectively. The first insulating layer is provided on the interconnections and the pillars. The first and second pillars have first and second monitor pads exposed in a surface of the first insulating layer. The first and second interconnections have first and second bonding pads exposed in a side face connected with the surface of the first insulating layer.

摘要翻译： 根据实施例，半导体发光器件包括层叠体，第一和第二电极，第一和第二互连，第一和第二柱以及第一绝缘层。 层叠体包括第一和第二半导体层和发光层。 第一和第二电极分别连接到第一和第二半导体层。 第一和第二互连分别连接到第一和第二电极。 第一和第二支柱分别连接到第一和第二互连。 第一绝缘层设置在互连和支柱上。 第一和第二支柱具有暴露在第一绝缘层的表面中的第一和第二监视器焊盘。 第一和第二互连具有暴露在与第一绝缘层的表面连接的侧面中的第一和第二接合焊盘。