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    MANUFACTURING METHOD OF PACKAGE CARRIER
    2.
    发明申请
    MANUFACTURING METHOD OF PACKAGE CARRIER 有权
    包装载体的制造方法

    公开(公告)号：US20110154657A1

    公开(公告)日：2011-06-30

    申请号：US12725641

    申请日：2010-03-17

    Applicant: Chih-Hong Chuang ,  Tzu-Wei Huang

    Inventor： Chih-Hong Chuang ,  Tzu-Wei Huang

    IPC: H05K3/00

    CPC classification number: H05K3/0097 ,  H05K3/427 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2203/1536 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49169 ,  Y10T29/49176

    Abstract: A manufacturing method of package carrier is provided. A first copper foil layer, a second copper foil layer on the first foil layer, a third copper foil layer and a fourth foil layer on the third foil layer are provided. The second copper foil layer is partially bonded the fourth copper foil layer by an adhesive gel so as to form a substrate of which the peripheral region is glued and the effective region is not glued. Therefore, the thinner substrate can be used in the following steps, such as patterning process or plating process. In addition, the substrate can be extended be the package carrier structure with odd-numbered layer or even-numbered layer.

    Abstract translation: 提供一种封装载体的制造方法。 提供第一铜箔层，第一箔层上的第二铜箔层，第三箔层上的第三铜箔层和第四箔层。 第二铜箔层通过粘合剂凝胶部分地接合第四铜箔层，以形成周边区域被胶合并且有效区域不胶合的基板。 因此，较薄的基板可以在以下步骤中使用，例如图案化工艺或电镀工艺。 此外，衬底可以扩展为具有奇数层或偶数层的封装载体结构。

    Image sensor devices and methods for manufacturing the same
    3.
    发明授权
    Image sensor devices and methods for manufacturing the same 有权
    图像传感器装置及其制造方法

    公开(公告)号：US08557626B2

    公开(公告)日：2013-10-15

    申请号：US12794257

    申请日：2010-06-04

    Applicant: Ming-Kai Liu ,  Tzu-Wei Huang ,  Jui-Hung Chang ,  Chia-Hui Huang ,  Teng-Sheng Chen

    Inventor： Ming-Kai Liu ,  Tzu-Wei Huang ,  Jui-Hung Chang ,  Chia-Hui Huang ,  Teng-Sheng Chen

    IPC: H01L31/0232 ,  H01L31/0236

    CPC classification number: H01L31/0232 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14685 ,  H01L31/0216 ,  H01L31/02164 ,  H01L31/02165

    Abstract: Disclosed is a method for forming an image sensor device. First, a lens is provided, and a first sacrificial element is then formed on the lens. Subsequently, an electromagnetic interference layer is formed on the lens and the first sacrificial element, and the first sacrificial element and the electromagnetic interference layer thereon are removed to form an electromagnetic interference pattern having an opening exposing a selected portion of the lens. A second sacrificial element is formed in the opening to cover a center region of the selected portion of the lens, while a peripheral region of the selected portion of the lens remains exposed. Next, a light-shielding layer is formed on the electromagnetic interference pattern, the second sacrificial element, and the peripheral region of the selected portion of the lens. Thereafter, the second sacrificial element and the light-shielding pattern thereon are removed to expose the center region of the selected portion of the lens as a light transmitting region.

    Abstract translation: 公开了一种用于形成图像传感器装置的方法。 首先，提供透镜，然后在透镜上形成第一牺牲元件。 随后，在透镜和第一牺牲元件上形成电磁干涉层，并且去除其上的第一牺牲元件和电磁干涉层，以形成具有暴露透镜的选定部分的开口的电磁干涉图案。 第二牺牲元件形成在开口中以覆盖透镜的所选部分的中心区域，而透镜的选定部分的周边区域保持暴露。 接下来，在电磁干涉图案，第二牺牲元件和透镜的选定部分的周边区域上形成遮光层。 此后，去除第二牺牲元件和其上的遮光图案以将透镜的选定部分的中心区域作为透光区域。

    Manufacturing method of circuit substrate
    5.
    发明授权
    Manufacturing method of circuit substrate 有权

    公开(公告)号：US09603263B2

    公开(公告)日：2017-03-21

    申请号：US13552654

    申请日：2012-07-19

    Applicant: Chih-Hong Chuang ,  Tzu-Wei Huang

    Inventor： Chih-Hong Chuang ,  Tzu-Wei Huang

    IPC: H05K3/00 ,  H05K3/42

    CPC classification number: H05K3/427 ,  H05K3/0097 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2203/0228 ,  H05K2203/1536 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49156

    Abstract: A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. At least a through hole passing through the sealed area is formed. Two insulating layers are formed on the two metal layers. Two conductive layers are formed on the two insulating layers. The two insulating layers and the two conductive layers are laminated to the two metal layers bonded to each other, wherein the metal layers are embedded between the two insulating layers, and the two insulating layers fill into the through hole. The sealed area of the two metal layers is separated to form two separated circuit substrates. Therefore, the thinner substrate can be operated in the following steps, such as patterning process or plating process. In addition, the method may be extended to manufacture the circuit substrate with odd-numbered layer or even-numbered layer.

    Manufacturing method of substrate structure
    6.
    发明授权
    Manufacturing method of substrate structure 有权
    衬底结构的制造方法

    公开(公告)号：US09131635B2

    公开(公告)日：2015-09-08

    申请号：US13794815

    申请日：2013-03-12

    Applicant: Tzu-Wei Huang

    Inventor： Tzu-Wei Huang

    IPC: H05K3/42 ,  H05K3/00

    CPC classification number: H05K3/42 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/427 ,  H05K2203/1476 ,  Y10T29/49165

    Abstract: A manufacturing method of substrate structure is provided. The base material having a core layer and a first and second copper foil layers located at a first and second surfaces of the core layer is provided. A surface treatment is performed on the first and second copper foil layers so as to form a first and second roughened surfaces. A laser beam is irradiated on the first roughened surface so as to form at least one first blind hole extending from the first copper foil layer to the second surface. An etching process is performed on the second copper foil layer so as to form at least one second blind hole extending from the second copper foil layer to the second surface. A conductive layer fills up a through hole defined by the first and second blind holes and covers the first and second copper foil layers.

    Abstract translation: 提供了一种基板结构的制造方法。 提供具有芯层的基材和位于芯层的第一和第二表面的第一和第二铜箔层。 对第一和​​第二铜箔层进行表面处理，以形成第一和第二粗糙表面。 激光束照射在第一粗糙表面上，以便形成从第一铜箔层延伸到第二表面的至少一个第一盲孔。 对第二铜箔层进行蚀刻处理，以形成从第二铜箔层延伸到第二表面的至少一个第二盲孔。 导电层填充由第一和第二盲孔限定的通孔并覆盖第一和第二铜箔层。

    SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
    7.
    发明申请
    SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF 审中-公开
    基板结构及其制造方法

    公开(公告)号：US20150114698A1

    公开(公告)日：2015-04-30

    申请号：US14105195

    申请日：2013-12-13

    Applicant: Tzu-Wei Huang ,  Chin-Sheng Wang

    Inventor： Tzu-Wei Huang ,  Chin-Sheng Wang

    IPC: H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  H05K1/09

    CPC classification number: H05K1/115 ,  H05K3/0094 ,  H05K3/421 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09636 ,  H05K2201/09854 ,  Y10T29/302

    Abstract: A substrate structure includes a substrate and a filling material. The substrate has an upper surface, a lower surface, at least one first blind via and at least one second blind via. The substrate includes an insulation layer, a first copper foil layer and a second copper foil layer. The first copper foil layer and the second copper foil layer are respectively disposed on two opposite side surfaces of the insulation layer. The first blind via extends from the upper surface toward the second copper foil layer and exposes a portion of the second copper foil layer. The second blind via extends from the lower surface toward the first copper foil layer and exposes a portion of the first copper foil layer. The filling material is filled inside of the first blind via and the second blind via and covers the upper surface and the lower surface of the substrate.

    Abstract translation: 衬底结构包括衬底和填充材料。 衬底具有上表面，下表面，至少一个第一盲孔和至少一个第二盲孔。 基板包括绝缘层，第一铜箔层和第二铜箔层。 第一铜箔层和第二铜箔层分别设置在绝缘层的两个相对的侧表面上。 第一盲孔从上表面延伸到第二铜箔层并暴露第二铜箔层的一部分。 第二盲孔从下表面延伸到第一铜箔层并暴露第一铜箔层的一部分。 填充材料填充在第一盲孔和第二盲孔内部并覆盖基板的上表面和下表面。

    MANUFACTURING METHOD OF CIRCUIT SUBSTRATE
    9.
    发明申请
    MANUFACTURING METHOD OF CIRCUIT SUBSTRATE 审中-公开
    电路基板的制造方法

    公开(公告)号：US20120279630A1

    公开(公告)日：2012-11-08

    申请号：US13552654

    申请日：2012-07-19

    Applicant: Chih-Hong Chuang ,  Tzu-Wei Huang

    Inventor： Chih-Hong Chuang ,  Tzu-Wei Huang

    IPC: H01B13/34

    CPC classification number: H05K3/427 ,  H05K3/0097 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2203/0228 ,  H05K2203/1536 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49156

    Abstract: A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. At least a through hole passing through the sealed area is formed. Two insulating layers are formed on the two metal layers. Two conductive layers are formed on the two insulating layers. The two insulating layers and the two conductive layers are laminated to the two metal layers bonded to each other, wherein the metal layers are embedded between the two insulating layers, and the two insulating layers fill into the through hole. The sealed area of the two metal layers is separated to form two separated circuit substrates. Therefore, the thinner substrate can be operated in the following steps, such as patterning process or plating process. In addition, the method may be extended to manufacture the circuit substrate with odd-numbered layer or even-numbered layer.

    Abstract translation: 电路基板的制造方法包括以下步骤。 两个金属层的周边结合形成密封区域。 至少形成通过密封区域的通孔。 在两个金属层上形成两个绝缘层。 在两个绝缘层上形成两个导电层。 将两个绝缘层和两个导电层层压到彼此接合的两个金属层上，其中金属层嵌入在两个绝缘层之间，并且两个绝缘层填充到通孔中。 两个金属层的密封区域被分离以形成两个分开的电路基板。 因此，可以在以下步骤中操作较薄的衬底，例如图案化工艺或电镀工艺。 此外，该方法可以扩展为制造具有奇数层或偶数层的电路基板。

    IMAGE SENSOR DEVICES AND METHODS FOR MANUFACTURING THE SAME
    10.
    发明申请
    IMAGE SENSOR DEVICES AND METHODS FOR MANUFACTURING THE SAME 有权
    图像传感器装置及其制造方法

    公开(公告)号：US20110298073A1

    公开(公告)日：2011-12-08

    申请号：US12794257

    申请日：2010-06-04

    Applicant: Ming-Kai Liu ,  Tzu-Wei Huang ,  Jui-Hung Chang ,  Chia-Hui Huang ,  Teng-Sheng Chen

    Inventor： Ming-Kai Liu ,  Tzu-Wei Huang ,  Jui-Hung Chang ,  Chia-Hui Huang ,  Teng-Sheng Chen

    IPC: H01L31/0232 ,  H01L31/18

    CPC classification number: H01L31/0232 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14685 ,  H01L31/0216 ,  H01L31/02164 ,  H01L31/02165

    Abstract: Disclosed is a method for forming an image sensor device. First, a lens is provided, and a first sacrificial element is then formed on the lens. Subsequently, an electromagnetic interference layer is formed on the lens and the first sacrificial element, and the first sacrificial element and the electromagnetic interference layer thereon are removed to form an electromagnetic interference pattern having an opening exposing a selected portion of the lens. A second sacrificial element is formed in the opening to cover a center region of the selected portion of the lens, while a peripheral region of the selected portion of the lens remains exposed. Next, a light-shielding layer is formed on the electromagnetic interference pattern, the second sacrificial element, and the peripheral region of the selected portion of the lens. Thereafter, the second sacrificial element and the light-shielding pattern thereon are removed to expose the center region of the selected portion of the lens as a light transmitting region.

    Abstract translation: 公开了一种用于形成图像传感器装置的方法。 首先，提供透镜，然后在透镜上形成第一牺牲元件。 随后，在透镜和第一牺牲元件上形成电磁干涉层，并且去除其上的第一牺牲元件和电磁干涉层，以形成具有暴露透镜的选定部分的开口的电磁干涉图案。 第二牺牲元件形成在开口中以覆盖透镜的所选部分的中心区域，而透镜的选定部分的周边区域保持暴露。 接下来，在电磁干涉图案，第二牺牲元件和透镜的选定部分的周边区域上形成遮光层。 此后，去除第二牺牲元件和其上的遮光图案以将透镜的选定部分的中心区域作为透光区域。

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