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公开(公告)号：US4967316A
公开(公告)日：1990-10-30
申请号：US417294
申请日：1989-10-05
IPC分类号： H01G4/06 , B60R16/02 , B60R16/023 , H04B15/00 , H05K1/02 , H05K1/05 , H05K1/16 , H05K3/00 , H05K3/32 , H05K7/14 , H05K9/00
CPC分类号： B60R16/0239 , H04B15/00 , H05K1/0231 , H05K1/162 , H05K1/0201 , H05K1/053 , H05K2201/09318 , H05K2201/10636 , H05K2203/0315 , H05K3/0061 , H05K3/284 , H05K3/321 , Y02P70/611
摘要： An electrical circuit unit, particularly for motor vehicles, features a grounded housing (1) and a printed circuit board (2) which, for protection against incoming and outgoing radiation of electrical noise, is short-circuited at high frequencies to the grounded housing. For this purpose, a noise suppression capacitor (6) on the PC board (2) is connected in series to a second capacitor. This second capacitor is formed by a metallized surface (8) on the board (2) and a metal-filled adhesive, as a first plate, a metal inner surface (11) of the housing (1) as a second plate, and an intermediate passivation or eloxal layer serving as a dielectric (13). The metal-filled adhesive acts to electrically bridge most of the gap between the metallized surface (8) and the housing surface (11), thereby capacitively coupling the metal-filled adhesive to the housing (1) and increasing the capacitance.
摘要翻译： 特别是用于机动车辆的电路单元具有接地壳体（1）和印刷电路板（2），该电路板用于防止电噪声的入射和射出辐射被高频地短路到接地的壳体。 为此，PC板（2）上的噪声抑制电容器（6）与第二电容器串联连接。 该第二电容器由板（2）上的金属化表面（8）和作为第一板的金属填充的粘合剂，作为第二板的壳体（1）的金属内表面（11）形成，并且 中间钝化或用作电介质的氧氟化物层（13）。 金属填充的粘合剂用于电连接金属化表面（8）和壳体表面（11）之间的大部分间隙，从而将金属填充的粘合剂电容耦合到壳体（1）并增加电容。
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2.发明授权Holder system for free-standing electronic components, especially hybrid modules 失效用于独立电子元件，特别是混合模块的支架系统
公开(公告)号：US4951176A
公开(公告)日：1990-08-21
申请号：US360353
申请日：1989-06-02
申请人： Dietrich Bergfried , Gert Jakob , Hans-Heinrich Maue , Uwe Schaub , Walter Roethlingshoefer , Ulrich Goebel , Elmar Huber , Roland Schmid , Gerhard Zucker
发明人： Dietrich Bergfried , Gert Jakob , Hans-Heinrich Maue , Uwe Schaub , Walter Roethlingshoefer , Ulrich Goebel , Elmar Huber , Roland Schmid , Gerhard Zucker
CPC分类号： H05K7/12 , H05K7/1417 , H05K1/141 , H05K3/301
摘要： The holder (1) for an electronic component (20), especially a hybrid module, is preferably a unitary plastic element having an elongated base plate (2) formed with openings (14) therein to permit insertion of terminal pins or lugs (21) projecting from the component therethrough. Two holder arms (30) project from the base plate, the holder arms having module support portions (3) and oppositely projecting posts (4). The posts fit into receiving openings (26, 27) of a printed circuit board, which receiving openings having a spacing (S) which is greater than the distance (D) between the posts so that, upon insertion of the posts in the openings the arms (30) will tilt towards each other, thus clamping a module, typically in card or board form, between the module support (3) of the arms. The holder can also form a transport holder for the module, by forming, for example, in the module a notch spaced from the upper edge, and engaging the notch (22) with a projecting rim (9) formed on the upper ends of the support portions (3) of the arms, the notch being so spaced that the terminal lugs or pins (21) then just fit into the openings (14) in the base plate, thereby protecting the pins against damage.
摘要翻译： 用于电子部件（20）的特别是混合模块的保持器（1）优选地是具有在其中形成有开口（14）的细长底板（2）的整体塑料元件，以允许插入端子销或凸耳（21） 从部件突出。 两个保持臂（30）从基板突出，保持臂具有模块支撑部分（3）和相对突出的支柱（4）。 所述柱装配到印刷电路板的接收开口（26,27）中，所述接收开口（26,27）接收具有大于所述柱之间的距离（D）的间隔（S）的开口，使得当在所述开口中插入所述柱时， 臂（30）将彼此倾斜，从而将模块（通常以卡或板的形式）夹在臂的模块支撑件（3）之间。 保持器还可以通过在模块中形成与上边缘间隔开的凹口并且与凹口（22）接合形成在模具的上端的突出边缘（9），从而形成用于模块的输送保持器 所述臂的支撑部分（3），所述凹口间隔开，使得所述端子凸耳或销（21）刚刚配合到所述基板中的开口（14）中，从而保护所述销不受损坏。
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公开(公告)号：US5919325A
公开(公告)日：1999-07-06
申请号：US981163
申请日：1997-12-11
IPC分类号： H05K3/46 , H01L21/48 , H01L23/498 , H05K1/09 , C04B37/00
CPC分类号： H05K1/092 , H01L23/49883 , H01L2924/0002 , H01L2924/09701
摘要： A process for producing a ceramic multilayer substrate, particularly an LTCC substrate, in which printed circuit traces and plated contactings are produced in a printing process on a plurality of green ceramic foils using a conductive paste which contains a wax as a printing carrier and is free of highly volatile solvents, and the green ceramic foils subsequently being arranged in a stack one upon the other and fired. The otherwise customary, time-consuming drying of the green ceramic foils for the vaporization of the utilized solvent is eliminated. The foils can be stacked and fired immediately after the printing of the printed circuit traces and plated contactings. Furthermore, shrinkage of the printed circuit traces and the green ceramic foils before the firing is avoided, thereby decisively improving the precision of the produced ceramic multilayer substrates.
摘要翻译： PCT No.PCT / DE96 / 02348 Sec。 371 1997年12月11日第 102（e）日期1997年12月11日PCT 1996年12月7日PCT PCT。 第WO97 / 40529号公报 日期1997年10月30日一种制造陶瓷多层基板，特别是LTCC基板的方法，其中印刷电路迹线和电镀接触在印刷过程中在多个生坯陶瓷箔上使用包含蜡作为 印刷载体，并且不含高挥发性溶剂，并且随后将生坯陶瓷箔彼此堆叠并烧制。 消除了用于蒸发利用的溶剂的生坯陶瓷箔的另外常规，耗时的干燥。 在打印印刷电路迹线和电镀接触之后，箔可以堆叠并立即烧制。 此外，避免了在烧制之前的印刷电路迹线和生坯陶瓷箔的收缩，从而确定地提高了所制造的陶瓷多层基板的精度。
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公开(公告)号：US5599414A
公开(公告)日：1997-02-04
申请号：US322717
申请日：1994-10-13
IPC分类号： C04B37/00 , B32B18/00 , C04B35/622 , C04B41/51 , H01G4/12 , H01G4/30 , H01L21/48 , H05K1/03 , H05K1/16 , H05K3/00 , H05K3/46 , B32B31/18 , B32B31/26
CPC分类号： H05K3/4688 , B32B18/00 , C04B35/622 , C04B41/5194 , H01G4/30 , H01L21/481 , H01L21/4857 , H05K1/162 , H05K3/4629 , C04B2237/32 , C04B2237/61 , C04B2237/68 , H05K1/0306 , H05K2201/0116 , H05K2201/0187 , H05K2201/09145 , H05K2203/1147 , H05K3/0052 , H05K3/4611 , Y10T156/1052
摘要： In a method, which permits the application of porous plates inside of multilayered ceramic structures, dense regions are formed in the edge areas of the porous plates. The dense regions prevent fluids, gases and vapors from penetrating to the inside of the multilayered ceramic structure.
摘要翻译： 在允许在多层陶瓷结构内施加多孔板的方法中，在多孔板的边缘区域中形成致密区域。 密集区域防止流体，气体和蒸气渗透到多层陶瓷结构的内部。
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公开(公告)号：US5573808A
公开(公告)日：1996-11-12
申请号：US589234
申请日：1996-01-22
申请人： Werner Gruenwald , Walter Roethlingshoefer , Ulrich Goebel , Ralf Haug , Manfred Moser , Annette Seibold
发明人： Werner Gruenwald , Walter Roethlingshoefer , Ulrich Goebel , Ralf Haug , Manfred Moser , Annette Seibold
IPC分类号： H01G4/30 , H01L21/48 , H01L23/538 , H05K1/09 , H05K1/16 , H05K3/20 , H05K3/46 , B05D5/12 , B41M3/12
CPC分类号： H05K1/162 , H01G4/30 , H01L21/4857 , H01L23/5383 , H01L2924/0002 , H05K1/092 , H05K2201/09236 , H05K2201/09763 , H05K3/207 , H05K3/4611 , H05K3/4629 , Y10T29/435
摘要： In a method for producing a multilayer circuit, it is possible to produce capacitor structures including electrodes and a dielectric arranged in between. By pressing the capacitor structures into a ceramic layer, it is possible to produce a high-quality capacitor inside the multilayer circuit.
摘要翻译： 在制造多层电路的方法中，可以制造包括电极和布置在其间的电介质的电容器结构。 通过将电容器结构压入陶瓷层，可以在多层电路内产生高质量的电容器。
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公开(公告)号：US20110182048A1
公开(公告)日：2011-07-28
申请号：US12737445
申请日：2009-06-16
IPC分类号： H05K7/00
摘要： An electronic assembly has at least one conductor substrate carrying components, which conductor substrate is surrounded by a mechanical protection. The conductor substrate is encased using a molding compound as a mechanical protection and is contacted by at least one intrinsically stiff, spring-elastic electrical connection conductor, the connection conductor being embedded in the molding compound, at least in sections.
摘要翻译： 电子组件具有承载组件的至少一个导体衬底，该导体衬底被机械保护围绕。 导体衬底使用模制化合物作为机械保护装置，并且由至少一个固有的弹性弹性电连接导体接触，所述连接导体至少部分嵌入在模塑料中。
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7.发明授权Pressure sensor having at least one connector element arranged flush with a mounting surface and a capillary adhesive layer arranged between a support plate and the mounting surface 失效压力传感器具有与安装表面齐平的至少一个连接器元件和布置在支撑板和安装表面之间的毛细粘合剂层
公开(公告)号：US6021674A
公开(公告)日：2000-02-08
申请号：US973123
申请日：1997-12-01
CPC分类号： G01L19/143 , G01L19/0084 , G01L19/147
摘要： A pressure sensor includes a housing, a support plate arranged on a mounting surface of the housing, a sensor element arranged in the housing, and at least one connector element joined in electrically conductive fashion to at least one contact surface of the support plate. A method for manufacturing a pressure sensor in such a way that the pressure sensor on the one hand can be manufactured easily and on the other hand is resistant to malfunction and is operational over a long period of time. The at least one connector element is arranged flush with the mounting surface and joined directly to the at least one contact surface. A capillary adhesive layer is arranged between the support plate and the mounting surface.
摘要翻译： PCT No.PCT / DE96 / 02301 Sec。 371 1997年12月1日第 102（e）1997年12月1日PCT PCT 1996年12月2日PCT公布。 公开号WO97 / 37204 PCT 日期1997年10月9日压力传感器包括壳体，布置在壳体的安装表面上的支撑板，布置在壳体中的传感器元件，以及至少一个以导电方式连接到至少一个接触表面的连接器元件 支撑板。 一种压力传感器的制造方法，其一方面可以容易地制造压力传感器，另一方面能够抵抗故障并长时间运行。 所述至少一个连接器元件布置成与所述安装表面齐平并且直接连接到所述至少一个接触表面。 毛细粘合剂层布置在支撑板和安装表面之间。
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8.发明申请METHOD FOR PRODUCING A CERAMIC COMPONENT, CERAMIC COMPONENT AND COMPONENT ASSEMBLY 有权陶瓷组件，陶瓷组件和组件组件的生产方法公开(公告)号：US20120234583A1
公开(公告)日：2012-09-20
申请号：US13496262
申请日：2010-09-01
CPC分类号： H05K3/4007 , H05K1/0306 , H05K3/4602
摘要： The invention relates to a method for producing a ceramic component, a ceramic component, and a component assembly having a ceramic component and a connection component. The method according to the invention for producing a ceramic component (1) comprises the steps: a) providing a ceramic substrate (2), wherein a conducting path (3) is arranged in the interior and/or on the surface of the ceramic substrate (2), and at least some regions of the ceramic substrate (2) are covered by a glaze (5); b) creating a contacting opening (6) in the glaze (5) in a region of a contact region (15) of the conducting path (3) to be contacted; c) applying a metallic layer (7) in the region of the contacting opening (6) for contacting the conducting path (3) in the contact region (15).
摘要翻译： 本发明涉及一种用于制造陶瓷部件，陶瓷部件和具有陶瓷部件和连接部件的部件组件的方法。 根据本发明的用于制造陶瓷部件（1）的方法包括以下步骤：a）提供陶瓷基板（2），其中导电路径（3）布置在陶瓷基板的内部和/或表面上 （2），并且陶瓷基板（2）的至少一些区域被釉（5）覆盖; b）在所述导电路径（3）的接触区域（15）的区域中在所述釉（5）中形成接触开口（6）以进行接触; c）在接触开口（6）的区域中施加用于接触接触区域（15）中的导电路径（3）的金属层（7）。
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公开(公告)号：US08115589B2
公开(公告)日：2012-02-14
申请号：US12304295
申请日：2007-11-02
IPC分类号： H01C1/012
CPC分类号： H05K1/167 , H01C7/003 , H01C17/065 , H01C17/06526 , H05K1/0306 , H05K3/245 , H05K3/4611 , H05K3/4629 , H05K2203/1105 , Y10T29/49082 , Y10T29/49099 , Y10T428/12944
摘要： A method for producing an electrical resistor, in particular a current sensing resistor, on a substrate, a resistor blank being placed on the substrate and then being heat-treated to form the resistor. To form the resistor blank, a palladium layer is applied to the substrate and a silver layer is applied to the palladium layer, or a silver layer is applied to the substrate and a palladium layer is applied to the silver layer, and the palladium of the palladium layer is then completely alloyed with the silver of the silver layer by heat treatment.
摘要翻译： 一种用于在基板上制造电阻器，特别是电流感测电阻器的方法，将电阻器坯体放置在衬底上，然后进行热处理以形成电阻器。 为了形成电阻器坯料，将钯层施加到衬底上，并将银层施加到钯层，或者将银层施加到衬底上，并将钯层施加到银层，并且将钯 然后通过热处理将钯层与银层完全合金化。
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公开(公告)号：US20100039213A1
公开(公告)日：2010-02-18
申请号：US12304295
申请日：2007-11-02
CPC分类号： H05K1/167 , H01C7/003 , H01C17/065 , H01C17/06526 , H05K1/0306 , H05K3/245 , H05K3/4611 , H05K3/4629 , H05K2203/1105 , Y10T29/49082 , Y10T29/49099 , Y10T428/12944
摘要： A method for producing an electrical resistor, in particular a current sensing resistor, on a substrate, a resistor blank being placed on the substrate and then being heat-treated to form the resistor. To form the resistor blank, a palladium layer is applied to the substrate and a silver layer is applied to the palladium layer, or a silver layer is applied to the substrate and a palladium layer is applied to the silver layer, and the palladium of the palladium layer is then completely alloyed with the silver of the silver layer by heat treatment.
摘要翻译： 一种用于在基板上制造电阻器，特别是电流感测电阻器的方法，将电阻器坯体放置在基板上，然后进行热处理以形成电阻器。 为了形成电阻器坯料，将钯层施加到衬底上，并将银层施加到钯层，或者将银层施加到衬底上，并将钯层施加到银层，并且将钯 然后通过热处理将钯层与银层完全合金化。
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