公开(公告)号：US5402255A

公开(公告)日：1995-03-28

申请号：US19907

申请日：1993-02-19

申请人： Hiroyuki Nakanishi ,  Yasunori Chikawa ,  Naoyuki Tajima ,  Hiroshi Nishioka

发明人： Hiroyuki Nakanishi ,  Yasunori Chikawa ,  Naoyuki Tajima ,  Hiroshi Nishioka

IPC分类号： G02F1/13 ,  H01L23/498 ,  H05K1/14 ,  H05K3/36 ,  G02F1/1343

CPC分类号： G02F1/13452 ,  H01L23/4985 ,  H01L2224/49175 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K1/14 ,  H05K3/361

摘要： A liquid crystal panel module includes a liquid crystal panel and a plurality of tape carrier packages arranged along a side of the liquid crystal panel. A semiconductor element is attached to the tape carrier packages for operating the liquid crystal panel. Further, outer leads are disposed in the tape carrier packages on both sides of the semiconductor element and connected to each other between adjacent tape carrier packages. Finally, wires are disposed in the semiconductor element to electrically connect the outer leads, disposed on both sides of the semiconductor element, to each other.

摘要翻译： 液晶面板模块包括液晶面板和沿着液晶面板一侧布置的多个带状载体封装。 将半导体元件附接到用于操作液晶面板的带载体封装。 此外，外部引线设置在半导体元件两侧的带状载体封装中，并在相邻的载带封装之间相互连接。 最后，将导线设置在半导体元件中，将设置在半导体元件两侧的外引线彼此电连接。

公开(公告)号：US08269353B2

公开(公告)日：2012-09-18

申请号：US12635000

申请日：2009-12-10

申请人： Koji Miyata ,  Hiroyuki Nakanishi ,  Masahiro Okita ,  Kazuaki Tatsumi ,  Masato Yokobayashi

发明人： Koji Miyata ,  Hiroyuki Nakanishi ,  Masahiro Okita ,  Kazuaki Tatsumi ,  Masato Yokobayashi

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/83 ,  H01L23/544 ,  H01L24/31 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2224/16 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0781 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/0401

摘要： Patterns provided on a surface of a substrate include an adhesion area pattern and one or more non-adhesion area patterns. A chip electrode on a backside of a semiconductor chip is attached to the adhesion area pattern by a conductive adhesive. Consequently, an area of patterns subjected to gold plating that is stable in a steady state is smaller in a substrate of the present invention than in a conventional substrate, resulting in reduction in costs. Further, the chip electrode is attached to the adhesion area pattern by a conductive adhesive in a liquid form. Consequently, a semiconductor device of the present invention allows reducing use of an expensive conductive adhesive compared with a conventional semiconductor device, resulting in reduction in costs.

摘要翻译： 设置在基板的表面上的图案包括粘合区域图案和一个或多个非粘合区域图案。 半导体芯片背面的芯片电极通过导电粘合剂附着在粘合区域图案上。 因此，在本发明的基板中，与常规基板相比，在稳定状态下稳定的金镀层图案较小，导致成本降低。 此外，芯片电极通过导电粘合剂以液体形式附着到粘附区域图案上。 因此，与传统的半导体器件相比，本发明的半导体器件能够减少使用昂贵的导电粘合剂，从而降低成本。

公开(公告)号：US20110008880A1

公开(公告)日：2011-01-13

申请号：US12922109

申请日：2009-03-17

申请人： Yoshiharu Uehata ,  Hiroyuki Nakanishi

发明人： Yoshiharu Uehata ,  Hiroyuki Nakanishi

IPC分类号： C12M1/34

CPC分类号： G01N35/00029 ,  B01L2300/0825 ,  B01L2400/0481 ,  G01N21/8483 ,  G01N33/4875 ,  G01N2035/00108 ,  G01N2035/00306

摘要： A portable analyzer A1 includes: hole forming means designed to form a hole 3 for insertion of a specimen sampling implement 6 therein; and analyzing means capable of analyzing a specimen when the sampling implement 6 is inserted into the hole 3, the hole forming means including a first member 1 having a first region R1 corresponding to a portion of an internal surface of the hole 3, and a second member 2 having a second region R2 corresponding to another portion of the internal surface of the hole 3. The first and second members 1 and 2 are capable of relative movement while being coupled to each other, the relative movement causing at least one of the first and second regions R1 and R2 to be exposed to outside for easy cleaning thereof.

摘要翻译： 便携式分析器A1包括：孔形成装置，设计成形成用于将样本采集工具6插入其中的孔3; 以及分析装置，当采样器具6插入到孔3中时能够分析样本，该孔形成装置包括具有对应于孔3的内表面的一部分的第一区域R1的第一构件1， 构件2具有与孔3的内表面的另一部分相对应的第二区域R2。第一和第二构件1和2能够相对运动同时彼此联接，相对运动引起第一 和第二区域R1和R2暴露于外部以便于其清洁。

公开(公告)号：US20090231721A1

公开(公告)日：2009-09-17

申请号：US12399447

申请日：2009-03-06

申请人： Yoshiki Kajita ,  Hiroyuki Nakanishi ,  Hiroichi Yamaguchi

发明人： Yoshiki Kajita ,  Hiroyuki Nakanishi ,  Hiroichi Yamaguchi

IPC分类号： G02B27/14

CPC分类号： G02B26/0833 ,  G02B26/101 ,  G02B27/2228 ,  H04N13/365 ,  Y10S359/90

摘要： An image display apparatus has light beam emitting units (304L, 304R) which emit light beams based on image information and a set operating frequency, and MEMS mirrors (305L, 305R) which deflect the emitted light beams by deflection operations based on the operating frequency, in correspondence with the right and left eyes. Resonance frequency detection units (306L, 306R) respectively detect the resonance frequencies of the MEMS mirrors (305L, 305R). A control unit (307) sets the operating frequency of the MEMS mirrors (305L, 305R) based on the detected resonance frequencies.

摘要翻译： 基于图像信息和设定的工作频率的图像显示装置具有发射光束的光束发射单元（304L，304R），以及基于工作频率通过偏转操作偏转发射的光束的MEMS反射镜（305L，305R） 与右眼和左眼相对应。 谐振频率检测单元（306L，306R）分别检测MEMS反射镜（305L，305R）的谐振频率。 控制单元（307）基于检测到的共振频率设置MEMS反射镜（305L，305R）的工作频率。

公开(公告)号：US20080054463A1

公开(公告)日：2008-03-06

申请号：US11882374

申请日：2007-08-01

申请人： Hiroyuki Nakanishi

发明人： Hiroyuki Nakanishi

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L23/3114 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05548 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013

摘要： The semiconductor apparatus includes: a conductor section provided on a surface of a semiconductor chip so as to input and output an electric signal; and an external connection terminal provided on the surface of the conductor section so as to joint the conductor section to a package substrate, wherein the conductor section has a through hole provided on the surface of the conductor section and piercing a center of the surface of the conductor section, and the external connection terminal is formed along the through hole. As a result, it is possible to realize a semiconductor apparatus whose resistance against repetitive stresses and impulse is improved and which has high packaging reliability.

摘要翻译： 半导体装置包括：设置在半导体芯片的表面上以便输入和输出电信号的导体部分; 以及外部连接端子，设置在导体部分的表面上，以将导体部分接合到封装基板，其中导体部分具有设置在导体部分的表面上的通孔，并且穿透导体部分的表面的中心 导体部分，并且外部连接端子沿着通孔形成。 结果，可以实现对重复应力和脉冲的抵抗力提高并具有高封装可靠性的半导体装置。

公开(公告)号：US20070075424A1

公开(公告)日：2007-04-05

申请号：US11525041

申请日：2006-09-22

申请人： Hiroyuki Nakanishi ,  Haruya Mori

发明人： Hiroyuki Nakanishi ,  Haruya Mori

IPC分类号： H01L23/48

CPC分类号： H01L24/10 ,  H01L23/3114 ,  H01L23/525 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

摘要： In the peripheral part of a semiconductor chip, third electrode pads for wire bonding and plate wiring and first electrode pads dedicated to wire bonding are provided. On the other hand, second electrode pads dedicated to plate wiring are provided on an inner part away from the edge of the semiconductor chip. Further, the first and second electrode pads are connected via metal bypass layers, respectively. In the case of wire bonding, the first and third electrode pads are used and the third electrode pads are encapsulated with an insulating layer. Further, in the case of plate wiring, the second and third electrode pads are used and the first electrode pads are covered with an insulating layer. This realizes a semiconductor chip which has great versatility and which can be used in semiconductor packages of various types.

摘要翻译： 在半导体芯片的周边部分中，提供用于引线接合和板状布线的第三电极焊盘以及专用于引线接合的第一电极焊盘。 另一方面，专门用于平板布线的第二电极垫设置在远离半导体芯片的边缘的内部。 此外，第一和第二电极焊盘分别通过金属旁路层连接。 在引线接合的情况下，使用第一和第三电极焊盘，并且用绝缘层封装第三电极焊盘。 此外，在板状布线的情况下，使用第二和第三电极焊盘，并且第一电极焊盘被绝缘层覆盖。 这实现了具有很大通用性并且可以用于各种类型的半导体封装的半导体芯片。

公开(公告)号：US20060244145A1

公开(公告)日：2006-11-02

申请号：US11400247

申请日：2006-04-10

申请人： Hiroyuki Nakanishi ,  Kanji Natori

发明人： Hiroyuki Nakanishi ,  Kanji Natori

IPC分类号： H01L23/52

CPC分类号： H01L23/552 ,  H01L23/528 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device includes a semiconductor element, a first signal line connected with the semiconductor element, and a light-blocking region enclosing the semiconductor element, a first signal line pull-out region for pulling the first signal line outside the light-blocking region being provided in the light-blocking region, a first light-blocking signal line making up the first signal line being formed between the first signal line pull-out region and the semiconductor element, and the first light-blocking signal line being formed to extend along a direction which intersects a direction in which the first signal line extends toward the semiconductor element.

公开(公告)号：US06953370B2

公开(公告)日：2005-10-11

申请号：US10873795

申请日：2004-06-22

申请人： Hiroyuki Matsuoka ,  Michiaki Okamoto ,  Atsushi Nishida ,  Hiroyuki Nakanishi ,  Masato Minakata

发明人： Hiroyuki Matsuoka ,  Michiaki Okamoto ,  Atsushi Nishida ,  Hiroyuki Nakanishi ,  Masato Minakata

IPC分类号： H01R13/64 ,  H01R13/645

CPC分类号： H01R13/64 ,  H01R13/6456

摘要： An attempt to fit an improper combination of housings (10, 30) together brings a projection (32R) of the wrong housing (30) into abutting engagement with an interference portion (15) in a fitting recess (12). Abutment surfaces (15a, 32Ra) are inclined in directions to move an inner peripheral surface of the fitting recess (12) towards an outer peripheral surface of the wrong housing (30). Therefore, the fitting recess (12) cannot deform and spread out, and the fitting of the wrong housing (30) cannot proceed by force.

摘要翻译： 将外壳（10,30）组合不正确的尝试将错误的壳体（30）的突起（32R）与装配凹部（12）中的干涉部分（15）邻接接合。 基台面（15a，32aa）在使嵌合凹部（12）的内周面向错误的壳体（30）的外周面移动的方向倾斜。 因此，嵌合凹部（12）不会发生变形和展开，并且错误的壳体（30）的装配不能用力进行。

公开(公告)号：US06653989B2

公开(公告)日：2003-11-25

申请号：US09818601

申请日：2001-03-28

申请人： Hiroyuki Nakanishi

发明人： Hiroyuki Nakanishi

IPC分类号： G09G500

CPC分类号： G02B27/017 ,  G02B27/0172 ,  G02B2027/0118 ,  G02B2027/0129 ,  G02B2027/0138

摘要： A composite display apparatus keeps both optical density of display images formed by a display means and shutter speed of cameras such as a CCD in an optimum state relative to the external world light (see-through light), even in environments where the quantity of see-through light varies widely. The composite display apparatus includes a display optical system for guiding a light beam from a display means to the eyeballs of an observer; an image-pickup optical system for allowing an external light beam to form an image on an image-pickup means; and an optical path separating means provided in an optical path for allowing an ocular optical axis of the light beam of the display optical system entering the eyeballs of the observer, or an imaginary ocular optical axis which is an extension of the ocular optical axis, and an external world optical axis of the light beam entering the image-pickup optical system to substantially coincide.

摘要翻译： 复合显示装置即使在看到的数量的环境中，也能够将由显示装置形成的显示图像的光密度和CCD等相机的快门速度相对于外部世界光（透明光）保持在最佳状态 通过光线变化很大。 复合显示装置包括用于将来自显示装置的光束引导到观察者的眼球的显示光学系统; 用于允许外部光束在图像拾取装置上形成图像的图像拾取光学系统; 以及光路分离装置，设置在用于允许显示光学系统的光束进入观察者的眼球的视光轴或作为眼睛光轴的延伸的假想眼光轴的光路中，以及 进入图像拾取光学系统的光束的外部世界光轴基本上重合。

公开(公告)号：US08887545B2

公开(公告)日：2014-11-18

申请号：US13077038

申请日：2011-03-31

申请人： Masami Ito ,  Masanori Tanahashi ,  Hiroyuki Nakanishi

发明人： Masami Ito ,  Masanori Tanahashi ,  Hiroyuki Nakanishi

IPC分类号： B21J1/06 ,  B21K29/00 ,  B21J13/03

CPC分类号： B21J13/03 ,  B21J1/06

摘要： There is provided a forging die holder including a resistance heater capable of efficiently heating a die via the die holder when warm forging or hot forging is performed. A die holder is for holding a die used in a forging press for performing warm forging or hot forging. The die holder has heater mounting holes into which resistance heaters are inserted, sensor mounting holes into which temperature sensors are inserted, and guide portions disposed on both end portions of holder surfaces of holders for supporting back surfaces of the foregoing die to support side surfaces of the foregoing die located therebetween on both sides thereof. The heater mounting holes are formed at positions opposing the holder surfaces in aligned relation with the side surfaces of the foregoing die.

摘要翻译： 提供了一种锻造模座，其包括电阻加热器，其能够在进行热锻或热锻时能够经由模具保持器有效地加热模具。 模具座用于保持用于锻造压力机的模具，用于进行锻造或热锻。 模具座具有加热器安装孔，电阻加热器插入其中，插入温度传感器的传感器安装孔和设置在保持器的保持器表面的两个端部上的引导部分，用于支撑前述模具的背面以支撑 上述模具位于其两侧。 加热器安装孔形成在与上述模具的侧表面对准的保持器表面相对的位置处。