NONVOLATILE RESISTANCE CHANGE DEVICE
    3.
    发明申请
    NONVOLATILE RESISTANCE CHANGE DEVICE 有权
    非易失性电阻变化器件

    公开(公告)号:US20120091420A1

    公开(公告)日:2012-04-19

    申请号:US13052165

    申请日:2011-03-21

    IPC分类号: H01L45/00

    摘要: According to one embodiment a first variable resistance layer which is arranged between a second electrode and a first electrode and in which a first conductive filament is capable of growing based on metal supplied from the second electrode, and an n-th variable resistance layer which is arranged between an n-th electrode and an (n+1)-th electrode and in which an n-th conductive filament whose growth rate is different from the first conductive filament is capable of growing based on metal supplied from the (n+1)-th electrode are included, a configuration in which a plurality of conductive filaments is electrically connected in series between the first electrode layer and the (n+1)-th electrode layer is included, and a resistance is changed in a stepwise manner.

    摘要翻译: 根据一个实施例,布置在第二电极和第一电极之间并且第一导电细丝能够基于从第二电极提供的金属生长的第一可变电阻层,以及第n可变电阻层,其是第 布置在第n电极和第(n + 1)电极之间,并且其中生长速度不同于第一导电细丝的第n导电细丝能够基于从第(n + 1)个 )电极,包括在第一电极层和第(n + 1)电极层之间串联电连接多根导电丝的结构,并且电阻以逐步的方式改变。

    Nonvolatile semiconductor memory apparatus
    4.
    发明授权
    Nonvolatile semiconductor memory apparatus 有权
    非易失性半导体存储装置

    公开(公告)号:US08154072B2

    公开(公告)日:2012-04-10

    申请号:US12403493

    申请日:2009-03-13

    IPC分类号: H01L29/788

    摘要: A nonvolatile semiconductor memory apparatus includes: a source and drain regions formed at a distance from each other in a semiconductor layer; a first insulating film formed on the semiconductor layer located between the source region and the drain region, the first insulating film including a first insulating layer and a second insulating layer formed on the first insulating layer and having a higher dielectric constant than the first insulating layer, the second insulating layer having a first site performing hole trapping and releasing, the first site being formed by adding an element different from a base material to the second insulating film, the first site being located at a lower level than a Fermi level of a material forming the semiconductor layer; a charge storage film formed on the first insulating film; a second insulating film formed on the charge storage film; and a control gate electrode formed on the second insulating film.

    摘要翻译: 一种非易失性半导体存储器件,包括:在半导体层中形成为彼此间隔一定距离的源区和漏区; 形成在位于源极区域和漏极区域之间的半导体层上的第一绝缘膜,所述第一绝缘膜包括形成在所述第一绝缘层上并具有比所述第一绝缘层高的介电常数的第一绝缘层和第二绝缘层 所述第二绝缘层具有进行孔捕获和释放的第一部位,所述第一部位通过将不同于基材的元素添加到所述第二绝缘膜而形成,所述第一部位位于比所述第二绝缘膜的费米能级更低的水平 形成半导体层的材料; 形成在所述第一绝缘膜上的电荷存储膜; 形成在电荷存储膜上的第二绝缘膜; 以及形成在所述第二绝缘膜上的控制栅电极。

    NAND-type nonvolatile semiconductor memory device
    6.
    发明授权
    NAND-type nonvolatile semiconductor memory device 有权
    NAND型非易失性半导体存储器件

    公开(公告)号:US07999303B2

    公开(公告)日:2011-08-16

    申请号:US12353586

    申请日:2009-01-14

    IPC分类号: H01L29/788

    摘要: The present invention provides a high-performance MONOS-type NAND-type nonvolatile semiconductor memory device using an aluminum oxide film as a part of gate insulating film in a select transistor and as a block insulating film in a memory transistor. The NAND-type nonvolatile semiconductor memory device has, on a semiconductor substrate, a plurality of memory cell transistors connected to each other in series and a select transistor. The memory cell transistor includes a first insulating film on the semiconductor substrate, a charge trapping layer, a second insulating film made of aluminum oxide,a first control gate electrode, and a first source/drain region. The select transistor includes a third insulating film on the semiconductor substrate, a fourth insulating film made of an aluminum oxide containing at least one of a tetravalent cationic element, a pentavalent cationic element, and N (nitrogen), a second control gate electrode, and a second source/drain region.

    摘要翻译: 本发明提供一种在选择晶体管中使用氧化铝膜作为栅绝缘膜的一部分的高性能MONOS型NAND型非易失性半导体存储器件,并且作为存储晶体管中的块绝缘膜。 NAND型非易失性半导体存储器件在半导体衬底上具有串联连接的多个存储单元晶体管和选择晶体管。 存储单元晶体管包括半导体衬底上的第一绝缘膜,电荷俘获层,由氧化铝制成的第二绝缘膜,第一控制栅极电极和第一源极/漏极区域。 选择晶体管包括半导体衬底上的第三绝缘膜,由包含四价阳离子元素,五价阳离子元素和N(氮)中的至少一种的氧化铝制成的第四绝缘膜,第二控制栅电极和 第二源极/漏极区域。