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公开(公告)号：US6160715A
公开(公告)日：2000-12-12
申请号：US149804
申请日：1998-09-08
CPC分类号： H01L23/49827 , H01L23/13 , H01L23/147 , H01L23/3128 , H01L2224/16 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/15173 , H05K2201/10477
摘要： The specification describes a recessed chip IC package in which the IC chip is bonded to a translator, and power and ground planes for IC power and ground interconnections are formed on separate interconnect levels of the translator. The multilevel interconnection capability of the translator allows crossovers, and allows power and ground pins from the IC chip to be both isolated from signal I/Os, and consolidated into fewer interconnections going to the next board level. The translator also has a large area outboard of the IC chip area to allow fan out from high pin count chips to large pitch interconnection sites for interconnection to the next board level.
摘要翻译： 本说明书描述了一种嵌入式芯片IC封装，其中IC芯片与转换器接合，并且用于IC电源和接地互连的电源和接地层形成在转换器的单独互连电平上。 转换器的多电平互联能力允许交叉，并允许IC芯片的电源和接地引脚与信号I / O隔离，并且整合到进入下一个电路板级别的较少互连。 翻译器还具有IC芯片面积大的外部面积，可将风扇从高引脚数芯片到大间距互连位置互连到下一个板级。
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公开(公告)号：US06175158B1
公开(公告)日：2001-01-16
申请号：US09149803
申请日：1998-09-08
IPC分类号： H01L2348
CPC分类号： H01L23/49833 , H01L23/49838 , H01L2224/16
摘要： The specification describes a recessed chip IC package in which the IC chip is bonded to a silicon translator, and power and ground planes for IC power and ground interconnections are formed on separate interconnect levels of the translator. The multilevel interconnection capability of the translator allows crossovers, and allows power and ground pins from the IC chip to be both isolated from signal I/Os, and consolidated into fewer interconnections going to the next board level. The thermal mismatch between the silicon translator and conventional printed wiring board materials is addressed by using an interposer which is essentially a ball grid array of plated-through holes that transfers the interconnect pattern from the translator to the printed wiring board. The interposer may have a composition with a coefficient of thermal expansion (CTE) that lies between the CTE of silicon and the CTE of the board material. It may also be provided with holes or slots for additional stress relief.
摘要翻译： 该说明书描述了一种嵌入式芯片IC封装，其中IC芯片被结合到硅转换器，并且用于IC电源和接地互连的电源和接地层形成在转换器的分开的互连级上。 转换器的多电平互联能力允许交叉，并允许IC芯片的电源和接地引脚与信号I / O隔离，并且整合到进入下一个电路板级别的较少互连。 硅转换器和常规印刷线路板材料之间的热失配通过使用插入器来解决，该插入器本质上是将互连图案从转换器传送到印刷线路板的电镀通孔的球栅阵列。 插入件可以具有位于硅的CTE和板材料的CTE之间的热膨胀系数（CTE）的组成。 它还可以设置有用于额外的应力释放的孔或槽。
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公开(公告)号：US06369444B1
公开(公告)日：2002-04-09
申请号：US09081448
申请日：1998-05-19
IPC分类号： H01L2334
CPC分类号： H01L25/0652 , H01L2224/16225 , H01L2924/15151 , H01L2924/15321
摘要： The specification describes interconnection assemblies for silicon-on-silicon multichip modules. The silicon-on-silicon MCMs are mounted on epoxy/glass laminates which have a coefficient of thermal expansion (CTE) that essentially matches the CTE of silicon. In the preferred embodiment the assembly is a PC card with card edge connectors, i.e. without fixed solder interlevel interconnections, so that the CTE of the epoxy laminate comprising the card can be modified without regard to potential mismatch with a mother board.
摘要翻译： 该规范描述了硅上硅多芯片模块的互连组件。 硅上硅MCM安装在具有基本上与硅的CTE匹配的热膨胀系数（CTE）的环氧树脂/玻璃层压板上。 在优选实施例中，组件是具有卡边缘连接器的PC卡，即没有固定的焊料层间互连，使得可以修改包含卡的环氧树脂层压体的CTE，而不考虑与母板的潜在不匹配。
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公开(公告)号：US06251705B1
公开(公告)日：2001-06-26
申请号：US09425706
申请日：1999-10-22
IPC分类号： H01L2148
CPC分类号： H01L24/81 , H01L2224/05124 , H01L2224/05147 , H01L2224/05572 , H01L2224/05573 , H01L2224/05671 , H01L2224/16145 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/00 , H01L2924/00014
摘要： The specification describes methods for manufacturing thin tiles for IC packages using thinning techniques. The method includes the step of thinning the IC devices in chip form. This is achieved at the final stage of assembly where the chips are flip-chip bonded to the substrate and the backside of the chips is exposed for thinning. Using this approach, final chip thickness of the order of 2-8 mils can be produced and overall package thickness is dramatically reduced.
摘要翻译： 本说明书描述了使用稀疏技术制造IC封装薄片的方法。 该方法包括以芯片形式稀疏IC器件的步骤。 这在组装的最后阶段实现，其中芯片被倒装连接到基板，并且芯片的背面暴露以使其变薄。 使用这种方法，可以产生2-8密耳数量级的最终芯片厚度，并且总体封装厚度显着降低。
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公开(公告)号：US06437990B1
公开(公告)日：2002-08-20
申请号：US09528882
申请日：2000-03-20
IPC分类号： H05K706
CPC分类号： H01L25/0655 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/85 , H01L25/18 , H01L2224/05554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/4943 , H01L2224/73253 , H01L2224/8121 , H01L2224/81815 , H01L2224/85 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H05K1/141 , H05K3/3436 , H01L2924/00014 , H01L2924/00
摘要： The specification describes a high density IC BGA package in which one or more IC chips are wire bonded to a BGA substrate in a conventional fashion and the BGA substrate is solder ball bonded to a printed wiring board. The standoff between the BGA substrate and the printed wiring board to which it is attached provides a BGA gap which, according to the invention, accommodates one or more IC chips flip-chip bonded to the underside of the BGA substrate. The recognition that state of the art IC chips, especially chips that are thinned, can easily fit into the BGA gap makes practical this efficient use of the BGA gap. The approach of the invention also marries wire bond technology with high packing density flip-chip assembly to produce a low cost, high reliability, state of the art IC package.
摘要翻译： 该说明书描述了一种高密度IC BGA封装，其中一个或多个IC芯片以常规方式引线接合到BGA衬底，并且BGA衬底焊接到印刷线路板上。 BGA衬底与其所附接的印刷电路板之间的间隔提供了一个BGA间隙，根据本发明，它可以容纳一个或多个倒装芯片，其结合到BGA衬底的底面。 认识到现有技术的IC芯片，特别是薄型的芯片，可以很容易地适应BGA间隙，实际上可以有效地利用BGA间隙。 本发明的方法还将引线键合技术与高封装密度倒装芯片组合结合，以产生低成本，高可靠性，最先进的IC封装。
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公开(公告)号：US6077725A
公开(公告)日：2000-06-20
申请号：US940157
申请日：1992-09-03
CPC分类号： H01L24/81 , H01L21/4867 , H01L24/75 , H05K3/3484 , H01L2224/1132 , H01L2224/16 , H01L2224/742 , H01L2224/75 , H01L2224/81192 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H05K2201/10674 , H05K2203/048 , H05K3/1216 , H05K3/3431 , H05K3/3436 , H05K3/3463
摘要： A multichip module is assembled using flip-chip bonding technology, a stencil printable solder paste and standard surface mount equipment for interconnecting signaling input/output contact pads on devices within such multichip module.
摘要翻译： 多芯片模块使用倒装芯片焊接技术组装，模板可印刷焊膏和标准表面贴装设备，用于在这种多芯片模块中的器件上互连信号输入/输出接触焊盘。
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公开(公告)号：US06396711B1
公开(公告)日：2002-05-28
申请号：US09588336
申请日：2000-06-06
IPC分类号： H05K702
CPC分类号： B81B7/007 , H01L2224/16225 , H01L2224/48227 , H01L2924/10253 , H01L2924/19107 , H01L2924/00
摘要： The specification describes interconnection strategies for micro-electronic machined mechanical systems (MEMS). Typical MEMS device array comprise a large number of individual mechanical devices each electrically driven by multi-chip modules (MCMs). High density interconnection is achieved by mounting the MCMs mounted on both sides of a system interconnection substrate. Overall interconnection length is reduced by locating the MCMs in a common circuit driving a given mechanical element on opposite sides of the system interconnection substrate and interconnecting them using vias through the substrate. Rapid replacement/repair is facilitated by mounted all active elements in sockets using contact pin arrays for electrical connections. In service reliability is obtained by providing spare sockets for redundant MCMs.
摘要翻译： 该规范描述了微电子加工机械系统（MEMS）的互连策略。 典型的MEMS器件阵列包括大量由多芯片模块（MCM）电驱动的各个机械装置。 通过安装安装在系统互连基板两侧的MCM来实现高密度互连。 通过将MCM定位在驱动系统互连基板的相对侧上的给定机械元件的公共电路中并且使用通孔穿过基板将它们互连来减小总互连长度。 通过将所有有源元件安装在插座中，使用接触针阵列进行电气连接，便于快速更换/维修。 通过为冗余MCM提供备用插座来获得服务可靠性。
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公开(公告)号：US06680212B2
公开(公告)日：2004-01-20
申请号：US09879759
申请日：2001-06-12
IPC分类号： H01L2166
CPC分类号： H01L22/20 , H01L2224/16 , H01L2224/48091 , H01L2924/00014 , H01L2924/014 , H01L2924/10253 , H01L2924/15311 , H01L2924/19041 , H01L2924/00 , H01L2224/0401
摘要： The specification describes electrical testing strategies for multi-chip modules (MCMs). The MCMs are fabricated on double sided substrates, which are then solder bump bonded to a motherboard to form a BGA package. Untested chips are attached permanently to one side of the substrate to form a partially completed MCM package (PCMP), and the PCMPs are tested. PCMPs that pass are then completed by assembling known good die on the other side of the substrate.
摘要翻译： 该规范描述了多芯片模块（MCM）的电气测试策略。 MCM制造在双面基板上，然后焊料凸块接合到母板上以形成BGA封装。 未经测试的芯片永久性地连接到基板的一侧以形成部分完成的MCM封装（PCMP），并且对PCMP进行测试。 然后通过在基板的另一侧上组装已知的良好模具来完成通过的PCMP。
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公开(公告)号：US06678167B1
公开(公告)日：2004-01-13
申请号：US09498005
申请日：2000-02-04
IPC分类号： H05K702
CPC分类号： H01L23/36 , H01L25/0652 , H01L2224/16225 , H01L2924/15311 , H01L2924/15321 , H05K1/141 , H05K1/189 , H05K3/3436
摘要： The specification describes a multi-chip IC package in which IC chips are flip-chip bonded to both sides of a flexible substrate. The upper (or lower) surface of the flexible substrate is bonded to a rigid support substrate with openings in the support substrate to accommodate the IC chips bonded to the upper (or lower) surface of the flexible substrate. In a preferred embodiment a plurality of IC memory chips are mounted on one side of the flexible substrate and one or more logic chips to the other. A very thin flexible substrate is used to optimize the length of through hole interconnections between the memory and logic devices. If logic chips are flip-chip mounted in the cavity formed by the openings, a heat sink plate can be used to both cap the cavity and make effective thermal contact the backside of the logic chips.
摘要翻译： 该说明书描述了一种多芯片IC封装，其中IC芯片倒装芯片结合到柔性基板的两侧。 柔性基板的上表面（或下表面）与支撑基板上具有开口的刚性支撑基板接合，以容纳粘合到柔性基板的上（或下）表面的IC芯片。 在优选实施例中，多个IC存储器芯片安装在柔性基板的一侧和一个或多个逻辑芯片之间。 使用非常薄的柔性基板来优化存储器和逻辑器件之间的通孔互连的长度。 如果将逻辑芯片倒装安装在由开口形成的空腔中，则可以使用散热板来盖住空腔并使逻辑芯片的背面有效的热接触。
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公开(公告)号：US06433411B1
公开(公告)日：2002-08-13
申请号：US09575883
申请日：2000-05-22
IPC分类号： H01L2302
CPC分类号： B81B7/0041 , B81B7/0048 , B81B7/0067 , B81B7/007 , H01L2224/48091 , H01L2224/48227 , H01L2924/01039 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： The specification describes packaging assemblies for micro-electronic machined mechanical systems (MEMS). The MEMS devices in these package assemblies are based on silicon MEMS devices on a silicon support and the MEMS devices and the silicon support are mechanically isolated from foreign materials. Foreign materials pose the potential for differential thermal expansion that deleteriously affects optical alignment in the MEMS devices. In a preferred embodiment the MEMS devices are enclosed in an all-silicon chamber. Mechanical isolation is also aided by using a pin contact array for interconnecting the silicon support substrate for the MEMS devices to the next interconnect level. The use of the pin contact array also allows the MEMS devices to be easily demountable for replacement or repair.
摘要翻译： 该规范描述了用于微电子机械加工机械系统（MEMS）的包装组件。 这些封装组件中的MEMS器件基于硅载体上的硅MEMS器件，并且MEMS器件和硅支撑体与异物机械隔离。 外来材料构成差分热膨胀的潜力，这有害影响MEMS器件中的光学对准。 在优选实施例中，MEMS器件封装在全硅室中。 通过使用针式接触阵列来将MEMS器件的硅支撑衬底互连到下一个互连级别也有助于机械隔离。 使用引脚触点阵列也可以使MEMS器件容易拆卸以进行更换或维修。
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