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    Printed-circuit board having projection electrodes and method for producing the same
    2.
    发明授权
    Printed-circuit board having projection electrodes and method for producing the same 失效
    具有投影电极的印刷电路板及其制造方法

    公开(公告)号：US06300576B1

    公开(公告)日：2001-10-09

    申请号：US09106302

    申请日：1998-06-29

    申请人： Yoshifumi Nakamura ,  Minehiro Itagaki ,  Hiroaki Takezawa ,  Yoshihiro Bessho ,  Tsukasa Shiraishi

    发明人： Yoshifumi Nakamura ,  Minehiro Itagaki ,  Hiroaki Takezawa ,  Yoshihiro Bessho ,  Tsukasa Shiraishi

    IPC分类号： H01R909

    CPC分类号： H01L23/49811 ,  H01L21/4853 ,  H01L2924/0002 ,  H05K1/095 ,  H05K3/4007 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T428/24926 ,  H01L2924/00

    摘要： A printed-circuit board, especially a multilayer printed-circuit board, with projection electrodes integrated with via hole conductors. Each of the projection electrodes is highly adhesive to a corresponding one of the via hole conductors and has high strength, and thus the production method of the printed-circuit board is simplified. Projection electrodes formed of a cured conducting paste are formed in such a manner that the electrodes are integrated with the via hole conductors which consist of a conducting paste embedded into the via hole formed in an insulating resin substrate to form a printed board. The method for producing a printed-circuit board, includes making via holes that penetrate through a prepreg to whose surface a parting film is applied; filling the via hole with a conducting paste; compressing the prepreg under heat to cure the prepreg and the paste; and then peeling off the film. Thus, projection electrodes with a height corresponding the thickness of the film are formed in a manner such that the projecting electrodes are integrated with the via hole conductors.

    摘要翻译： 印刷电路板，特别是多层印刷电路板，其具有与通孔导体集成的突出电极。 每个突起电极与相应的一个通孔导体高度粘合，并且具有高强度，因此简化了印刷电路板的制造方法。 由固化导电膏形成的投影电极以这样的方式形成，使得电极与通孔导体集成，通孔导体包括嵌入到形成在绝缘树脂基板中的通孔中的导电膏，以形成印刷板。 制造印刷电路板的方法包括制造穿透预浸料的通孔，其中涂覆有分离膜的表面; 用导电膏填充通孔; 在加热下压制预浸料以固化预浸料和糊料; 然后剥离胶片。 因此，以使得突出电极与通孔导体一体化的方式形成具有与膜的厚度对应的高度的突起电极。

    Conductive ink
    6.
    发明授权
    Conductive ink 失效
    导电油墨

    公开(公告)号：US5407473A

    公开(公告)日：1995-04-18

    申请号：US174807

    申请日：1993-12-29

    申请人： Kazuhiro Miura ,  Yoshihiro Bessho ,  Satoru Yuhaku ,  Yasuhiko Hakotani ,  Minehiro Itagaki ,  Yoshifumi Nakamura ,  Akihiko Miyoshi

    发明人： Kazuhiro Miura ,  Yoshihiro Bessho ,  Satoru Yuhaku ,  Yasuhiko Hakotani ,  Minehiro Itagaki ,  Yoshifumi Nakamura ,  Akihiko Miyoshi

    IPC分类号： H01B1/14 ,  H01L23/498 ,  H05K1/09 ,  C09D11/02

    CPC分类号： H01B1/14 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/092

    摘要： Conductive ink has an inorganic compound comprising 70.0-95.0 wt. % of CuO which is conductive and 5.0-30.0 wt. % of inorganic binder mixed with each other, and solvent and organic binder in which the inorganic compound is dispersed. The inorganic binder consists of lead borosilicate crystalline glass or aluminum borosilicate crystalline glass soften and crystallizes at 850.degree.-950.degree. C. The diameter of CuO powder of the inorganic compound is 100-7.0 .mu.m. The diameter of the lead borosilicate crystalline glass powder or the aluminum borosilicate crystalline glass powder of the inorganic compound is 1.0-5.0 .mu.m. The organic binder consists of ethyl cellulose or copolymer of polyisobytylmethacrylate and poly.alpha.-methylstyrene. The conductive ink contains the organic binder at 0.5-2.0 wt. %.

    摘要翻译： 导电油墨具有70.0-95.0重量％的无机化合物。 导电的CuO％和5.0-30.0wt。 相互混合的无机粘合剂的％，以及其中分散无机化合物的溶剂和有机粘合剂。 无机粘合剂由硼硅酸铅晶体玻璃或硼硅酸铝晶体玻璃软化并在850-950℃下结晶。无机化合物的CuO粉末的直径为100-7.0μm。 硼硅酸铅晶体玻璃粉末或无机化合物的硼硅酸铝结晶玻璃粉末的直径为1.0-5.0μm。 有机粘合剂由乙基纤维素或聚甲基丙烯酸异丁酯和聚α-甲基苯乙烯的共聚物组成。 导电油墨含有0.5-2.0重量％的有机粘合剂。 ％。

    Method for manufacturing electronic device with resin layer between chip carrier and circuit wiring board
    7.
    发明授权
    Method for manufacturing electronic device with resin layer between chip carrier and circuit wiring board 失效

    公开(公告)号：US06372547B1

    公开(公告)日：2002-04-16

    申请号：US09038069

    申请日：1998-03-11

    申请人： Yoshifumi Nakamura ,  Yoshihiro Bessho ,  Minehiro Itagaki

    发明人： Yoshifumi Nakamura ,  Yoshihiro Bessho ,  Minehiro Itagaki

    IPC分类号： H01L2148

    摘要： In BGA (Ball Grid Array), LGA (Land Grid Array) and the like, a resin layer is formed between an external connecting electrode of a chip carrier and a circuit wiring board. Consequently, the external connecting electrode can be prevented from cracking due to a difference between the coefficients of thermal expansion of the external connecting electrode and the circuit wiring board. Thus, the reliability in a thermal shock test can be enhanced. A connecting wiring which is conducted to an electrode of a semiconductor device is provided on a surface of an electrical insulating board, and the external connecting electrode for connection to a connecting electrode of the circuit wiring board is provided on a back face of the electrical insulating board. The external connecting electrode has a solder ball made of a conductor, and the resin layer formed on the side portion thereof.

    Method of making multi-layered ceramic substrates
    10.
    发明授权
    Method of making multi-layered ceramic substrates 失效
    制作多层陶瓷基板的方法

    公开(公告)号：US5662755A

    公开(公告)日：1997-09-02

    申请号：US526312

    申请日：1995-09-11

    申请人： Kazuhiro Miura ,  Yoshihiro Bessho ,  Satoru Yuhaku ,  Yasuhiko Hakotani ,  Minehiro Itagaki ,  Yoshifumi Nakamura ,  Akihiko Miyoshi

    发明人： Kazuhiro Miura ,  Yoshihiro Bessho ,  Satoru Yuhaku ,  Yasuhiko Hakotani ,  Minehiro Itagaki ,  Yoshifumi Nakamura ,  Akihiko Miyoshi

    IPC分类号： H01L21/48 ,  H01L23/15 ,  H05K3/24 ,  B32B31/26 ,  B32B31/12

    CPC分类号： H05K3/248 ,  H01L21/4857 ,  H01L23/15 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K2203/308 ,  H05K3/4629 ,  Y10T29/49163

    摘要： A method of making a multi-layered ceramic substrate which includes the steps of laminating a desired number of green sheets each being made of glass ceramics containing at least an organic binder and a solvent and each having a pattern of electrodes formed thereon by the use of an electroconductive paste, to thereby provide a green sheet laminate, The electrodes on opposite surfaces or an entire surface layer of the green sheet laminate are subsequently printed with a paste comprising an inorganic component added with at least an organic binder containing a Zn composition. On each surface of the laminate printed with the paste of the Zn composition, a green sheet made of an inorganic composition incapable of being sintered at a temperature of crystallization of the glass ceramics is then laminated thereby providing a laminate plate which is subsequently fired. After the firing, both of the inorganic composition incapable of firing sintered and the Zn composition are removed from the opposite surfaces of the laminate. The paste of the Zn composition may contains a main component selected from the group consisting of Zn, ZnO, Zn(OH).sub.2, ZnAl.sub.2 O.sub.4, and ZnCO.sub.3.

    摘要翻译： 一种制造多层陶瓷基板的方法，其包括以下步骤：将所需数量的生坯片材层叠，所述生坯片材由至少含有有机粘合剂和溶剂的玻璃陶瓷制成，并且各自具有通过使用 导电糊，从而提供生片层压体。随后用包含添加至少含有Zn组合物的有机粘合剂的无机组分的糊料印刷相对表面上的电极或生片层压体的整个表面层。 在印有Zn组合物的糊料的层压板的每个表面上，将由玻璃陶瓷的结晶温度下不能烧结的无机组合物制成的生片层叠，从而提供随后烧制的层压板。 烧成后，从层叠体的相对面除去无法烧成的无机组合物和Zn组合物。 Zn组合物的糊剂可以含有选自Zn，ZnO，Zn（OH）2，ZnAl 2 O 4和ZnCO 3的主要成分。